WO2021085103A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
WO2021085103A1
WO2021085103A1 PCT/JP2020/038514 JP2020038514W WO2021085103A1 WO 2021085103 A1 WO2021085103 A1 WO 2021085103A1 JP 2020038514 W JP2020038514 W JP 2020038514W WO 2021085103 A1 WO2021085103 A1 WO 2021085103A1
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Prior art keywords
resin composition
group
component
acid
polymer
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Ceased
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PCT/JP2020/038514
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English (en)
French (fr)
Japanese (ja)
Inventor
卓宏 橋本
哲徳 曽我
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ThreeBond Co Ltd
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ThreeBond Co Ltd
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Application filed by ThreeBond Co Ltd filed Critical ThreeBond Co Ltd
Priority to JP2021554293A priority Critical patent/JP7581616B2/ja
Priority to KR1020227013697A priority patent/KR20220093114A/ko
Priority to US17/770,476 priority patent/US20220396650A1/en
Priority to CN202080076091.0A priority patent/CN114630870B/zh
Priority to EP20880659.6A priority patent/EP4053205A4/en
Publication of WO2021085103A1 publication Critical patent/WO2021085103A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • C09J201/02Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/02Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/55Boron-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/02Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/12Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00Compositions for adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00Compositions for sealing or packing joints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/309Sulfur containing acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • C08K2003/329Phosphorus containing acids
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/005Additives being defined by their particle size in general
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/5403Silicon-containing compounds containing no other elements than carbon or hydrogen

Definitions

  • the present invention relates to a resin composition having excellent coatability and workability.
  • Adhesives, sealants, coating agents, etc. are generally adjusted in viscosity and chixiness in order to improve workability when applied. Among them, adhesives and sealants are used to improve the chixo property, enable application to vertical surfaces, and adjust the flow property to prevent the resin from flowing into the necessary range and causing problems. It is an indispensable technology to do.
  • a filler is added to the adhesive or the sealant, or a compound having a bad compatibility with the base binder resin is added to the adhesive or the sealant to serve as a base.
  • Various methods such as a method of chemically causing a repulsion with a resin to develop a tixogenic property have been adopted (Patent Document 1).
  • the present inventors have found a method for obtaining a resin composition having excellent coatability and workability by suppressing an increase in viscosity and effectively imparting thixophilicity.
  • the present invention has been reached.
  • the thixotropic property is also called sway denaturation or thixotropic property, and the better the thixotropic property, the lower the viscosity in a high shear rate state such as when applying a paint, but the low shear rate as after application. In the state, the viscosity becomes high, and the appropriate coating can be completed without the coated paint flowing downward (dripping).
  • the present invention can be any of the following [1] to [13]. An appropriate combination of the specific elements described in [1] to [13] is also within the scope of the present invention.
  • One or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bonded to a silicon atom.
  • Resin composition containing [2] The resin composition according to the above [1], wherein the component (D) is an acid or an acid ester compound.
  • One or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bonded to a silicon atom. Select from the group consisting of (C) silica powder surface-treated with alkylsilane, and (D) an acid containing one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen, and derivatives thereof.
  • One or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bonded to a silicon atom.
  • A a polymer having two or more alkenyl groups
  • B a polyorganosiloxane having a hydroxyl group bonded to a silicon atom.
  • C silica powder surface-treated with alkylsilane
  • D an acid containing one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen, and derivatives thereof.
  • One or more compounds that are To produce a resin composition by mixing When the step of mixing the cross-linking agent and the curing catalyst with the resin composition, and when the component (A) is used as the base polymer, when the component (B) is used as the base polymer under the condition that the curing temperature is 30 to 300 ° C. , A step of curing the resin composition to produce a cured product under the condition that the curing temperature is 10 to 50 ° C. in the presence of water vapor.
  • a method for producing a cured product including.
  • the resin composition of the present invention is very useful for improving coatability and workability because the thixotropy can be adjusted without increasing the viscosity, there is no bleeding out over time, and the shape retention after coating is excellent. Is.
  • the preferable mode and the more preferable mode illustrated below can be used in combination with each other as appropriate regardless of the expressions such as “preferable” and “more preferable”.
  • the description of the numerical range is an example, and a range in which the upper limit and the lower limit of each range and the numerical values of the examples are appropriately combined can be preferably used regardless of expressions such as “preferable” and “more preferable”. .. Further, terms such as “contains” or “contains” may be appropriately read as “essentially” or “consisting of only”.
  • One aspect of the present invention is one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bonded to a silicon atom. Select from the group consisting of (C) silica powder surface-treated with alkylsilane, and (D) an acid containing one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen, and derivatives thereof.
  • One or more compounds that are It is a resin composition containing.
  • the component (A) used in the present invention is a base polymer, which is a main component exhibiting the characteristics of a resin composition, and is also called a base binder when it has properties as a binder.
  • the component (A) is a polymer having two or more alkenyl groups, and may be one in which two or more alkenyl groups are attached or bonded to the terminal or molecular chain of the polymer molecule constituting the main chain.
  • the main chain of the polymer constituting the component (A) is not particularly limited, and various main chains can be used.
  • the main chain of the polymer is a vinyl-based copolymer or polyorganosiloxane, and in such a case, each of the components (A) is a vinyl-based copolymer having two or more alkenyl groups. It can be (A-1) and a polyorganosiloxane (A-2) having two or more alkenyl groups.
  • the number average molecular weight of the polymer constituting the main chain is, for example, in the range of 500 to 1,000,000, preferably 1000 to 100,000. Unless otherwise specified, the number average molecular weight in the present specification is calculated by a standard polystyrene conversion method using size exclusion chromatography (SEC).
  • the viscosity of the component (A-1) at 25 ° C. is, for example, preferably 0.03 Pa ⁇ s to 1500 Pa ⁇ s, more preferably 0.05 Pa ⁇ s to 1000 Pa ⁇ s, and particularly preferably 0.3 Pa ⁇ s to. It is 800 Pa ⁇ s.
  • the viscosity test method herein conforms to JIS Z 8803.
  • the alkenyl group content of the component (A) can be, for example, 0.01 mmol / g to 5 mmol / g, preferably in the range of 0.05 mmol / g to 1 mmol / g.
  • the organic group having 1 to 20 carbon atoms is not particularly limited, but an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms are preferable, and specifically, the following Such groups:-(CH 2 ) n- CH 3 , -CH (CH 3 )-(CH 2 ) n- CH 3 , -CH (CH 2 CH 3 )-(CH 2 ) n- CH 3 , -CH (CH 2 CH 3 ) 2 , -C (CH 3 ) 2- (CH 2 ) n -CH 3 , -C (CH 3 ) (CH 2 CH 3 )-(CH 2 ) n -CH 3 , -C 6 H 5 , -C 6 H 4 (CH 3 ), -C 6 H 3 (CH 3 ) 2 ,-(CH 2 ) n -C 6 H 5 ,-(CH 2 ) n -C
  • R 1 hydrogen or a methyl group as R 1 is more preferably hydrogen as R 2 and R 3.
  • the number of alkenyl groups constituting the component (A) is two or more, but it is preferable that one alkenyl group is present at both ends of the polymer molecule.
  • the vinyl-based monomer used as a constituent unit of the copolymer constituting the main chain of the component (A-1) is not particularly limited, and various monomers can be used.
  • the monomers include (meth) acrylic acid, methyl (meth) acrylic acid, ethyl (meth) acrylic acid, -n-propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, and (meth).
  • Acrylic acid-n-butyl (meth) acrylate-isobutyl, (meth) acrylate-tert-butyl, (meth) acrylate-n-pentyl, (meth) acrylate-n-hexyl, (meth) acrylate cyclohexyl , (Meta) Acrylic Acid-n-Heptyl, (Meta) Acrylic Acid-n-octyl, (Meta) Acrylic Acid-2-ethylhexyl, (Meta) Acrylic Acid Nonyl, (Meta) Acrylic Acid Decyl, (Meta) Acrylic Acid Dodecyl, phenyl (meth) acrylate, toluyl (meth) acrylate, benzyl (meth) acrylate, -2-methoxyethyl (meth) acrylate, -3-methoxybutyl (meth) acrylate, (meth) acrylate -2-Hydroxyethyl,
  • Maleimide-based monomers such as; acrylonitrile, and nitrile group-containing vinyl-based monomers such as methacrylonitrile; acrylic Amide and amide group-containing vinyl monomers such as methacrylamide; vinyl esters such as vinyl acetate, vinyl propionate, vinyl pivalate, vinyl benzoate, and vinyl cinnate; alkenes such as ethylene and propylene; butadiene, And conjugated dienes such as isoprene; vinyl chloride, vinylidene chloride, allyl chloride, allyl alcohol and the like. These may be used alone or may be copolymerized in plurality.
  • styrene-based monomers and (meth) acrylic acid-based monomers are preferable from the viewpoint of physical properties of the product. More preferably, it is an acrylic acid ester monomer and a methacrylic acid ester monomer, particularly preferably an acrylic acid ester monomer, and most preferably butyl acrylate.
  • the above-mentioned monomer may be copolymerized with another monomer or further block-copolymerized. In this case, the above-mentioned monomer may be copolymerized by mass ratio of, for example, 40% or more, preferably 50% or more, more preferably. It is preferably contained in an amount of 60% or more, more preferably 70% or more.
  • (meth) acrylic acid represents acrylic acid and / or methacrylic acid.
  • the number average molecular weight of the vinyl-based polymer of the present invention (polymer constituting the main chain of the component (A-1)) is in the range of 500 or more and less than 1,000,000, more preferably 1000 or more and less than 100,000. ..
  • the molecular weight is 500 or more, the abundance of hydrosilyl bonds in the cured product is appropriate, so that the original characteristics of the vinyl polymer are easily exhibited, and when it is less than 1,000,000, it is difficult to apply the dispense. It does not become difficult to handle.
  • the vinyl polymer can be obtained by various polymerization methods, and the method is not particularly limited, but the radical polymerization method is preferable from the viewpoint of versatility of the monomer and ease of control.
  • the radical polymerizations controlled radical polymerization is preferable, living radical polymerization is more preferable, and atom transfer radical polymerization is particularly preferable.
  • R 4 is hydrogen or an organic group having 1 to 20 carbon atoms.
  • the organic group having 1 to 20 carbon atoms is not particularly limited, but an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms are preferable, and specifically, the following Such groups are exemplified.
  • the component (A-1) preferably has a viscosity at 25 ° C. of 0.03 Pa ⁇ s or more and less than 1500 Pa ⁇ s, more preferably 0.05 Pa ⁇ s or more and less than 1000 Pa ⁇ s, and particularly preferably 0.3 Pa ⁇ s or more. It is less than 800 Pa ⁇ s.
  • the alkenyl group content of the component (A-1) is 0.01 mmol / g or more and 5 mmol / g or less, more preferably 0.05 mmol / g or more and 1 mmol / g or less. Within the above range, a resin composition having excellent reactivity and flexibility can be obtained.
  • the polyorganosiloxane having the alkenyl group of the component (A-2) is not particularly limited, and various types can be used.
  • the molecular structure of the polyorganosiloxane having an alkenyl group is substantially linear, but there may be a partially branched structure.
  • vinyl group-blocking polydimethylsiloxane at both ends of the molecular chain dimethylsiloxane / diphenylsiloxane copolymer at the end of the molecular chain; vinyl group-blocking dimethylsiloxane / methylvinylsiloxane / diphenylsiloxane copolymer at both ends of the molecular chain; Polydimethylsiloxane with a vinyl group at the end and a trimethoxy group at the end of the other molecular chain; a vinyl group at the end of the molecular chain and a trimethylsiloxy group at the end of the other molecular chain.
  • Polydimethylsiloxane trimethylsiloxy group-blocking dimethylsiloxane, methylvinylsiloxane, diphenylsiloxane copolymer at both ends of the molecular chain.
  • polydimethylsiloxane which has vinyl groups at both ends of the molecular chain, is preferable because it is versatile and has excellent curability.
  • the component (A-2) cannot be a polyorganosiloxane (component (B)) having a hydroxyl group bonded to a silicon atom.
  • the alkenyl group contained in the component (A-2) of the present invention is preferably one that hydrosilylates with a cross-linking agent described later, and may be the alkenyl group exemplified in the above (A) and (A-1), and is preferable.
  • Is preferably a vinyl group (H 2 C CH ⁇ ) bonded to Si of the polyorganosiloxane which is the main chain.
  • the component (A-2) preferably has a viscosity at 25 ° C. of 0.03 Pa ⁇ s or more and less than 1500 Pa ⁇ s, more preferably 0.05 Pa ⁇ s or more and less than 1000 Pa ⁇ s, and particularly preferably 0.3 Pa ⁇ s or more. It is less than 800 Pa ⁇ s.
  • the number average molecular weight of the polyorganosiloxane in the component (A-2) of the present invention is in the range of 500 or more and less than 1,000,000, more preferably 1000 or more and less than 100,000.
  • the molecular weight is 500 or more, the abundance of hydrosilyl bonds in the cured product is appropriate, so that the original characteristics of the vinyl polymer are easily exhibited, and when it is less than 1,000,000, it is difficult to apply the dispense. It does not become difficult to handle.
  • the alkenyl group content of the component (A-2) is 0.01 mmol / g or more and 5 mmol / g or less, more preferably 0.05 mmol / g or more and 1 mmol / g or less. Within the above range, a resin composition having excellent reactivity and flexibility can be obtained.
  • a method for introducing an alkenyl group into a polymer of a main chain in the component (A) a known method can be appropriately used. Taking the method of introducing an alkenyl group into a vinyl-based polymer as an example, the following can be used. Method can be mentioned. (1) When a vinyl polymer is synthesized by radical polymerization, preferably living radical polymerization, a compound having both a low polymerizable alkenyl group and a relatively highly polymerizable alkenyl group in one molecule is used as the second monomer. How to react.
  • An enolate anion is prepared by allowing a metal simple substance such as zinc or an organic metal compound to act on a vinyl-based polymer having at least one highly reactive carbon-halogen bond, and then a halogen or an acetyl group.
  • a method for reacting with an electrophilic compound having an alkenyl group such as an alkenyl group-containing compound having an alkenyl group, a carbonyl compound having an alkenyl group, an isocyanate compound having an alkenyl group, and an acid halide having an alkenyl group.
  • (6) A method of substituting a halogen by reacting a vinyl-based polymer having at least one highly reactive carbon-halogen bond with an oxyanion or a carboxylate anion having an alkenyl group.
  • a method in which a compound containing a hydroxyl group and an alkenyl group is further reacted.
  • the methods (2), (6), and (7) are preferable because they are easier to control.
  • the component (B) used in the present invention is a polyorganosiloxane having a hydroxyl group bonded to a silicon atom.
  • the component (B) is a component different from the component (A).
  • polyorganosiloxane in which both terminal groups represented by the following general formula (III) are hydroxyl groups, that is, polyorganosiloxanes sealed with hydroxyl groups are preferable as the component (B).
  • R 5 and R 6 represent substituted or unsubstituted monovalent hydrocarbon groups which may be the same or different, and are preferably hydrocarbon groups having 12 or less carbon atoms.
  • n is, for example, an integer of 5 or more, preferably 10 to 100, and more preferably 15 to 50.
  • the viscosity of the component (B) at 25 ° C. is preferably 10 mm 2 / s or more and less than 1000 mm 2 / s, more preferably 20 mm 2 / s or more and less than 500 mm 2 / s, and most preferably 30 mm 2 / s to. It is 100 mm 2 / s. When it is 10 mm 2 / s or more and less than 1000 mm 2 / s, the change in viscosity of the resin composition over time can be suppressed.
  • the number average molecular weight of the component (B) is, for example, in the range of 500 to 1,000,000, preferably 1000 to 100,000.
  • Examples of commercially available components (B) include X-21-5841 manufactured by Shin-Etsu Chemical Co., Ltd., KF-9701, BY16-873 manufactured by Toray Dow Corning Co., Ltd., and XC96-723 manufactured by Momentive Co., Ltd. Be done.
  • the base polymer of the component (A) and / or the component (B) may contain either or both of the component (A) and the component (B).
  • the component (C) used in the present invention is a silica powder surface-treated with alkylsilane.
  • the component (C) of the present invention is used in combination with the component (D) described later, it is possible to exhibit outstanding thixophilicity.
  • the alkylsilane include alkylsilane compounds represented by the general formula (IV): Si (R 7 ) 4 .
  • R 7 is the same but different from the viewpoint of the effect of exhibiting excellent dispersibility in the component (A) and the component (B) and exhibiting high thixophilicity with the component (D).
  • R 7 of the above general formula (IV) include a propyl group, an isopropyl group, a butyl group, an isobutyl group, a pentyl group, an isopentyl group, a hexyl group, an isohexyl group, a heptyl group, an isoheptyl group, an octyl group and an isooctyl group.
  • Nonyl group, isononyl group, decyl group, isodecyl group, and octyl group is preferable.
  • the silica powder of the component (C) is preferably fumed silica powder.
  • Fused silica powder is composed of silicon dioxide obtained by the flame hydrolysis method, forms spherical particles, and a plurality of particles are aggregated and fused in a beaded shape to form a bulky aggregate. is there.
  • the average particle size of the primary particles of the silica powder surface-treated with the alkylsilane component (C) is preferably 1 nm or more and less than 300 nm, more preferably 3 nm or more and less than 100 nm, and most preferably 5 nm or more and less than 50 nm. Is.
  • the average particle size of the primary particles referred to in the present invention is measured and calculated by a general method such as a centrifugal sedimentation light transmission method, a laser diffraction method, or a method measured by a transmission electron microscope, but there is no particular notice.
  • the major axis and the minor axis of the two-dimensional projection image of each primary particle are measured using a transmission electron microscope, and the average thereof is measured. It is a numerical value obtained from.
  • the BET specific surface area of the silica powder surface-treated with the alkylsilane component (C) is preferably less than 300 m 2 / g, more preferably less than 250 m 2 / g.
  • the lower limit of the BET specific surface area is, for example, 100 m 2 / g or more, preferably 150 m 2 / g or more, from the viewpoint of the filling rate of the component (A) and the component (B). ..
  • the apparent specific weight of the surface-treated silica powder of the component (C) is preferably 1 g / l or more and less than 100 g / l. , More preferably 10 g / l or more and less than 80 g / l.
  • the apparent specific weight referred to in the present specification is a value measured by measuring the apparent density after sufficient tapping in accordance with DIN ISO 787-11.
  • the component (C) preferably contains 0.01 to 100 parts by mass, more preferably 0.1 to 50 parts by mass, with respect to 100 parts by mass of the base polymer of the component (A) and / or the component (B). It is preferably contained in an amount of 0.5 to 30 parts by mass, most preferably. When the content is 0.01 to 100 parts by mass, the viscosity characteristics can be controlled while maintaining the characteristics of the base polymer.
  • Examples of commercially available products of the component (C) include AEROSIL R805 (manufactured by Evonik) and CAB-O-SIL TS-530 (manufactured by CABOT).
  • the component (D) that can be used in the present invention is a compound containing one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.
  • the component (D) is a main component that suppresses an increase in viscosity due to the component (C) and increases the effect of imparting chixiness.
  • the component (D) may be an acid containing the above elements, and a derivative of the acid such as an ester (acid ester compound) of the acid or a salt of the acid.
  • Examples of the component (D) include boric acid, borate ester, phosphoric acid, phosphoric acid ester, sulfuric acid, sulfuric acid ester, nitric acid, nitrate ester and the like.
  • boric acid, boric acid ester, phosphoric acid, and phosphoric acid ester are preferable from the viewpoint of curability and storage stability, and boric acid ester and phosphoric acid ester are preferable from the viewpoint of the effect of imparting thixophilicity, and boric acid ester is preferable. Is particularly preferable.
  • any boric acid ester can be used, but in the present invention, it is more preferably a compound represented by the following general formula (V) having one boric acid ester in the molecule.
  • R 8 is a functional group selected from hydrogen or an alkyl group having 1 to 6 carbon atoms which may have a substituent, an aryl group, a carbonyl group, and an acetyl group, and has three functional groups. All of them may be the same or different.
  • the compound include borate trialkyl ester compounds such as trimethyl borate, triethyl borate, and tributyl borate, and tributyl borate is preferable from the viewpoint of storage stability of the resin composition.
  • Examples of the phosphoric acid ester include, but are limited to, ethyl acid phosphate, butyl acid phosphate, butoxyethyl acid phosphate, oleyl acid phosphate, 2-ethylhexyl acid phosphate, 2-hydroxyethyl methacrylate acid phosphate, dibutyl phosphate and the like. It's not a thing.
  • the component (D) preferably contains 0.05 to 20 parts by mass, and more preferably 0.1 to 12 parts by mass, based on 100 parts by mass of the base polymer of the component (A) and / or the component (B). It is preferably contained in an amount of 0.2 to 7 parts by mass. When the amount is 0.05 to 20 parts by mass, the thixotropy can be maintained without affecting the properties of the resin composition.
  • the resin composition of the present invention contains a filler, an antioxidant, a light stabilizer, a storage stabilizer, a defoaming agent, as long as the object of the present invention is not impaired.
  • a filler that does not impair storage stability may be added for the purpose of improving the elastic modulus, resin strength, fluidity, etc. of the cured product.
  • specific examples thereof include organic powders, inorganic powders and metallic powders.
  • the filler for the inorganic powder include glass, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, dried clay minerals, and dried diatomaceous earth.
  • the blending amount of the inorganic powder is preferably about 0.1 to 100 parts by mass with respect to 100 parts by mass of the base polymer of the component (A) and / or the component (B). If it is 100 parts by mass or less, sufficient fluidity can be obtained as a resin composition, and good workability can be obtained.
  • the filler of the organic powder examples include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
  • the blending amount of the organic powder is preferably about 0.1 to 100 parts by mass with respect to 100 parts by mass of the base polymer of the component (A) and / or the component (B). If it is larger than 0.1 part by mass, the effect is not reduced, and even if it is 100 parts by mass or less, sufficient fluidity can be obtained as a resin composition, and good workability can be obtained.
  • Examples of the filler of the metallic powder include gold, platinum, silver, copper, indium, palladium, nickel, alumina, tin, iron, aluminum and stainless steel.
  • the blending amount of the metallic powder is preferably about 0.1 to 100 parts by mass, more preferably 1 to 50 parts by mass with respect to 100 parts by mass of the base polymer of the component (A) and / or the component (B). is there.
  • antioxidants examples include ⁇ -naphthoquinone, 2-methoxy-1,4-naphthoquinone, methylhydroquinone, hydroquinone, hydroquinone monomethyl ether, mono-tert-butylhydroquinone, 2,5-di-tert-butylhydroquinone, p.
  • Kinone compounds such as -benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tert-butyl-p-benzoquinone; phenothiazine, 2,2-methylene-bis (4-methyl-6-tert- Butylphenol), catechol, tert-butylcatechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, 2-tert-butyl-6- (3-tert-butyl-2-) Hydroxy-5-methylbenzyl) -4-methylphenyl acrylate, 2- [1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 4,4'-butylidenebis (6-tert-butyl-3-methylphenol), 4,4'-thiobis (6-tert-butyl-3-methylphenol),
  • Examples of the light stabilizer include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, and 4-benzoyl.
  • the amount of the arbitrary component contained in the resin composition of the present invention is, for example, 0.05 to 100 parts by mass, preferably 0, based on 100 parts by mass of the base polymer of the component (A) and / or the component (B). .1 to 50 parts by mass, more preferably 0.2 to 20 parts by mass is appropriate.
  • the resin composition of the present invention may be present as a curable resin composition by further appropriately adding curable components such as a cross-linking agent, a catalyst, and a coupling agent. By curing the curable resin composition under arbitrary conditions, a cured product of the curable resin composition can be obtained.
  • curable resin composition of the present invention of the present invention in addition to the one-component curable resin composition obtained by mixing all the components, some components are separately prepared and stored, and mixed at the time of use. It can also be used as a kit of a two-component curable resin composition.
  • a compound having one or more hydrosilyl groups in one molecule can be contained as a cross-linking agent.
  • the hydrosilyl group represents a group having a SiH bond.
  • the cross-linking agent is not particularly limited as long as it can be cured by the hydrosilylation reaction with the component (A), and examples thereof include polysiloxane, preferably organohydrogenpolysiloxane, which is linear, branched, or branched. Examples thereof include silicone containing a hydrosilyl group in a molecule composed of cyclic or reticulated molecules. Further, from the viewpoint of resin strength and curability, a compound having two or more hydrosilyl groups in one molecule is preferable.
  • the viscosity of the cross-linking agent at 25 ° C. is preferably 1 mPa ⁇ s or more and less than 10 Pa ⁇ s, more preferably 5 mPa ⁇ s or more and less than 5 Pa ⁇ s, and particularly preferably 7 mPa ⁇ s from the viewpoint of compatibility with the component (A). -S or more and less than 1 Pa ⁇ s.
  • the SiH value of the cross-linking agent is preferably 10 or more and less than 1000 g / mol, more preferably 50 or more and less than 700 g / mol, and most preferably 100 or more and less than 500 g / mol from the viewpoint of curability of the resin composition.
  • the SiH value means the concentration (g / mol) of the SiH group in one molecule.
  • the substituent other than the hydrogen atom bonded to the silicon atom of the cross-linking agent is preferably an alkyl group or a phenyl group having 1 to 20 carbon atoms, but other groups may also be used.
  • the commercially available cross-linking agent is not particularly limited, but CR-300, CR-500 (manufactured by Kaneka Corporation), HMS-013, HMS-151, HMS-301 (manufactured by Asmax Co., Ltd.), SH1107 Fluid (Toray Dow). (Made by Corning Co., Ltd.) and the like.
  • the amount of the cross-linking agent added is preferably 0.5 equivalents or more and 1.5 equivalents or less with respect to the hydrosilyl group in the cross-linking agent and one alkenyl group contained in the component (A). More preferably, it is an amount of 0.8 equivalent or more and 1.2 equivalent or less. If it is more than 0.5 equivalent, the crosslink density will not be too low, and if it is less than 1.5 equivalent, the problem of foaming due to the dehydrogenation reaction will occur and the heat resistance will be affected. There is no.
  • the mixing ratio of the component (A) and the component (C) is such that the molar ratio of the hydrosilyl group of the component (C) to 1 mol of the alkenyl group of the component (A) is 0.2 or more and 5 from the viewpoint of curability. It is preferably in the following range, and more preferably 0.4 or more and 2.5 or less. When the molar ratio is less than 5, sufficient curability can be obtained, and when it is 0.2 or more, a uniform and strong cured product in which cracks and voids do not occur in the cured product after curing can be obtained.
  • the addition reaction type curing catalyst preferably contains a hydrosilylation catalyst.
  • the hydrosilylation catalyst is not particularly limited as long as it can catalyze the hydrosilylation reaction, and any catalyst can be used. Examples thereof include radical initiators such as organic peroxides and azo compounds, and transition metal catalysts. .. Of these, a transition metal catalyst is preferable because of its high reactivity.
  • transition metal catalyst examples include those in which a platinum solid is supported on a carrier such as platinum alone, alumina, silica, or carbon black; platinum chloride acid; a complex of platinum chloride acid and alcohol, aldehyde, ketone, or the like.
  • Platinum-olefin complex Platinum-vinylsiloxane complex such as Pt n (ViMe 2 SiOSiMe 2 Vi) n , Pt [(MeViSiO) 4 ] m ; Platinum-vinylsiloxane complex such as Pt (PPh 3 ) 4 , Pt (PBu 3 ) 4 Platinum-phosphite complexes such as Pt [P (OPh) 3 ] 4 and Pt [P (OBu) 3 ] 4 ; Pt (acac) 2 can be mentioned.
  • Me represents a methyl group
  • Bu represents a butyl group
  • Vi represents a vinyl group
  • Ph represents a phenyl group
  • acac represents acetylacetonato
  • n and m represent integers.
  • the platinum-hydrocarbon complex described in US Pat. No. 3,159,601 of Ashby et al. And US Pat. No. 3,159,662; and the platinum alcoholate described in US Pat. No. 3220972 of Lamoreaux et al. A catalyst can also be mentioned.
  • chloroplatinic acid, platinum-olefin complex, platinum-vinylsiloxane complex and the like are preferable from the viewpoint of excellent activity.
  • examples of catalysts other than platinum compounds include RhCl (PPh 3 ) 3 , RhCl 3 , Rh / Al 2 O 3 , RuCl 3 , IrCl 3 , FeCl 3 , AlCl 3 , PdCl 2 and xH 2 O, NiCl 2. , TiCl 4 , etc. These catalysts may be used alone or in combination of two or more.
  • the amount of the catalyst is not particularly limited, but when the component (A) is used, it is used in the range of 1 ⁇ 10 -8 mol or more and less than 1 ⁇ 10 -1 mol with respect to 1 mol of the alkenyl group of the component (A). It is preferable to use it in the range of 1 ⁇ 10 -6 mol or more and less than 1 ⁇ 10 ⁇ 2 mol.
  • the hydrosilylation catalyst is generally expensive and corrosive, and a large amount of hydrogen gas may be generated to foam the cured product. Therefore, it is less than 1 ⁇ 10 -1 mol. Is preferable.
  • the absolute amount of the catalyst present in the curable resin composition is, for example, 0.01 to 1 part by mass, preferably 0.020 to 0.5 part by mass, based on 100 parts by mass of the component (A). It is preferably 0.03 to 0.1 parts by mass.
  • the form of the catalyst may be either solid or liquid, but for example, it may be used in the form of an alcohol solution, preferably in the form of a solution such as methanol, ethanol or propanol, and more preferably in the form of an isopropanol solution. Appropriate.
  • a curable resin composition is obtained by using a resin composition containing the component (B) as a base polymer, it is preferable to further contain a compound having a polyfunctional hydrolyzable silyl group.
  • a compound having a polyfunctional hydrolyzable silyl group is preferable to be further contain a compound having a polyfunctional hydrolyzable silyl group.
  • an organic complex composed of an organic tin complex, an amine compound, titanium or a fourth group element of zirconium as a condensation reaction catalyst.
  • condensation reaction catalysts such as dealcohol type, deoxime type, deacetic acid type, and deketone type depending on the type of hydrolyzing group.
  • the compound having a polyfunctional hydrolyzable silyl group is not limited as long as it is a compound having 2 to 3 hydrolyzable silyl groups in one molecule, and is preferably a silane coupling agent.
  • the hydrolyzed silyl group include asyloxysilyl groups such as acetoxysilyl group, octanoyloxysilyl group and benzoyloxysilyl group, ketooximes such as dimethylketooxymsilyl group, methylethylketooxymsilyl group and diethylketoximsilyl group.
  • Cyril group alkoxysilyl group such as methoxysilyl group, ethoxysilyl group, propoxy group, alkenyloxysilyl group such as isopropenyloxysilyl group, 1-ethyl-2-methylvinyloxysilyl group; dimethylaminosilyl group, diethylaminosilyl Aminosilyl groups such as groups, butylaminosilyl groups and cyclohexylaminosilyl groups; aminoxysilyl groups such as dimethylaminoxylsilyl groups and diethylaminoxylsilyl groups; and N-methylacetamidesilyl groups, N-ethylacetamidesilyl groups, N- Examples thereof include an amide silyl group such as a methylbenzamide silyl group, but the present invention is not limited thereto.
  • a methoxysilyl group, an ethoxysilyl group, and a propoxysilyl group are preferable from the viewpoint of consideration for the
  • condensation reaction catalyst examples include dibutyltin bistriethoxysilicate, dibutyltin dioctate, dibutyltin acetate, dibutyltin dilaurate, butyltin-2-ethylhexoate, stannous caprylate, and naphthene in the organic tin complex.
  • dibutyltin bistriethoxysilicate dibutyltin dioctate
  • dibutyltin acetate dibutyltin dilaurate
  • butyltin-2-ethylhexoate stannous caprylate
  • naphthene in the organic tin complex There are tin acid acid, tin oleate, tin butyrate and the like.
  • titanium-based catalysts tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium octylene glycolate, titanium tetraacetylacetonate, titanium ethylacetate, polyhydroxytitanium stearate. , Titanium Lactate, and Titanium Triethanol Aminate.
  • zirconium-based catalysts tetranormal propoxyzirconium, tetranormalbutoxyzirconium, zirconium tetraacetylacetonate, zirconium monobutoxyacetylacetonate bis (ethylacetate acetate), zirconium dibutoxybis (ethylacetacetate), zirconium tetraacetylacetonate And zirconium tributoxystearate.
  • the present invention is not particularly limited to these.
  • a compound having an amine in the structure of the cross-linking agent can also be used as a catalyst.
  • amine compound examples include 3- (2-aminoethyl) aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, and N-2- (aminoethyl)-. 3-Aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldiethoxysilane, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane , And 3-aminopropyltriethoxysilane and the like.
  • the amount of the compound having a hydrolyzable silyl group and the condensation reaction catalyst added is 0.1 to 25 parts by mass, preferably 1 to 20 parts by mass of the compound having a hydrolyzable silyl group with respect to 100 parts by mass of the component (B).
  • the amount of the condensation reaction catalyst is 0.001 to 1 part by mass, preferably 0.01 to 0.5 part by mass.
  • the resin composition of the present invention is used as a part of a material of a curable resin composition for use as a sealant, an adhesive or the like.
  • the curable resin composition of the present invention can be used as a sealant, an adhesive, a coating agent and the like.
  • the cured product obtained by curing the curable resin composition of the present invention is a seal layer or a sealing portion formed by curing the sealing material, an adhesive layer or an adhesive portion formed by curing the adhesive, or a bonding portion. It can be used as a coating layer or a coating portion formed by curing the coating agent.
  • ⁇ Applying method> As a method of applying the resin composition and the curable resin composition of the present invention to an adherend, a known method of applying a sealant, an adhesive or the like is used. For example, methods such as dispensing, spraying, inkjet, screen printing, gravure printing, dipping, and spin coating using an automatic coating machine can be used.
  • the resin composition and the curable resin composition of the present invention are appropriately liquid at 25 ° C. from the viewpoint of coatability.
  • the curable resin composition of the present invention can be cured by a known method utilizing heating, moisture, or the like to obtain a cured product.
  • a method for producing a cured product specifically, a step of producing a resin composition by mixing the above components (A) to (D) and, if necessary, the above optional components.
  • the component (B) is used as the base polymer under the condition that the curing temperature is 30 to 300 ° C.
  • An example of a method for producing a cured product which comprises a step of curing the resin composition to produce a cured product under the condition that the curing temperature is 10 to 50 ° C. in the presence of water vapor.
  • the curing temperature is not particularly limited, but is preferably 30 to 300 ° C, more preferably 50 to 200 ° C, and 60 to 150 ° C. More preferred.
  • the curing time is not particularly limited, but in the case of 60 to 150 ° C., it is preferably 20 minutes or more and less than 5 hours, and more preferably 40 minutes or more and 3 hours or less.
  • the curing temperature is not particularly limited, but is preferably 10 ° C to 50 ° C, preferably 15 ° C to 30 ° C.
  • the relative humidity is preferably 40% RH or more, and the curing time is preferably 1 hour or more and less than 2 weeks.
  • the resin composition of the present invention is produced by mixing each component.
  • the mixing order of each component is not particularly limited, and the component (D) may be added after the component (C) is dispersed in the component (A) and / or the component (B) with a mixer, or (A). ) And / or component (B) may be added with component (D), stirred with a mixer, and then component (C) may be added and dispersed.
  • a curable component such as a cross-linking agent or a catalyst can be further added to the resin composition of the present invention to obtain a curable resin composition.
  • the curable resin composition is produced by the following procedure.
  • (A-1) Component: XMAP OR100A (manufactured by Kaneka): Acrylic copolymer having one vinyl group at each end as an alkenyl group, viscosity (25 ° C.) 700 Pa ⁇ s
  • (A-2) Component: XF40-A1987 (manufactured by Shin-Etsu Chemical Co., Ltd.): Polyorganosiloxane having one vinyl group at each end as an alkenyl group, viscosity (25 ° C.) 13 Pa ⁇ s, alkenyl group (vinyl group) ) Content 0.13 mmol / g
  • Ingredient: KF-9701 manufactured by Shin-Etsu Chemical Co., Ltd.
  • Ingredients: AEROSIL, R805 manufactured by Evonik): Fumed silica powder
  • Each addition amount is the addition amount of the component (A) or the component (B) with respect to 100 parts by mass of the base polymer.
  • component (A) is used-CR-500 (crosslinking agent) Hydrosilyl group-containing compound (manufactured by Kaneka Corporation) 16 parts by mass (1.0 equivalent to component A) SiH value: 253 g / mol -Pt-VTS-3.0IPA (transition metal catalyst)
  • component of isopropyl alcohol solution of platinum divinyltetramethyldisiloxane complex manufactured by Yumicore Precious Metals Japan Co., Ltd.
  • (2-Aminoethyl) Aminopropyltrimethoxysilane condensation reaction catalyst, manufactured by Z-6020 Toray Dow Corning Co., Ltd.
  • 9 parts by mass dibutyltin bistriethoxysilicate
  • the component (A) or the component (B) was weighed in a stirring container, the component (C) was weighed in a stirring container, and the mixture was stirred for 30 minutes.
  • the component (D) was weighed and stirred for 10 minutes.
  • a cross-linking agent and a catalyst were weighed in to obtain each curable resin composition. Detailed preparation amounts are shown in Tables 1 and 2, and all numerical values are expressed in parts by mass.
  • the viscosity (Pa ⁇ s) of the curable resin composition was measured with a cone plate type viscometer based on the following measurement conditions. Evaluation is based on the following criteria, and the results are shown in Table 1. Shear velocity: 1.0s -1 Measurement time: 3 min Temperature condition: 25 ° C Resin amount: 0.5 mL By measuring the viscosity, it is possible to evaluate whether or not the viscosity of the sample is low in a high shear rate state at the time of sample application. [Sauce evaluation] The sagging property is a measurement of how much the applied paint moves in the vertical direction after a lapse of a predetermined period after applying the paint or the like to the surface to be coated.
  • a 5 mm beet of each resin was applied.
  • the test piece was erected vertically, and the distance the resin moved from the marked line was measured over time (10 minutes, 30 minutes, 60 minutes). The test was conducted at 25 ° C.
  • ⁇ Evaluation criteria> ⁇ (Excellent): The moving distance after 60 minutes is less than 3 mm ⁇ (Good): The moving distance after 60 minutes is less than 5 mm ⁇ (Yes): The moving distance after 30 minutes is less than 5 mm ⁇ (Not possible): The moving distance after 10 minutes was 5 mm or more.
  • Examples 1 to 7, especially Examples 1 to 5, especially Examples 3 and 5, have sufficiently low viscosities and are in a state of being easy to apply.
  • the sagging property it had a good sagging property regardless of the viscosity values of Examples 1 to 7.
  • the resin compositions using the components (C') and (D') shown in Table 2 did not give satisfactory results in terms of sagging property. Further, even if the product has a high viscosity and does not contain the component (D) as in Comparative Example 7, the sagging property is poor.
  • the resin composition of the present invention is very useful because it can effectively impart thixotropy regardless of the viscosity, has good workability, and can be applied to various coating methods.

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