JP7550958B2 - 半導体装置および電力変換装置 - Google Patents

半導体装置および電力変換装置 Download PDF

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Publication number
JP7550958B2
JP7550958B2 JP2023506981A JP2023506981A JP7550958B2 JP 7550958 B2 JP7550958 B2 JP 7550958B2 JP 2023506981 A JP2023506981 A JP 2023506981A JP 2023506981 A JP2023506981 A JP 2023506981A JP 7550958 B2 JP7550958 B2 JP 7550958B2
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Prior art keywords
groove
diffusion plate
heat diffusion
semiconductor device
substrate
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Japanese (ja)
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JPWO2022196411A5 (https=
JPWO2022196411A1 (https=
Inventor
雄太 吉見
健太 藤井
雄二 白形
寛之 矢原
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023506981A 2021-03-15 2022-03-07 半導体装置および電力変換装置 Active JP7550958B2 (ja)

Applications Claiming Priority (3)

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JP2021041268 2021-03-15
JP2021041268 2021-03-15
PCT/JP2022/009704 WO2022196411A1 (ja) 2021-03-15 2022-03-07 半導体装置および電力変換装置

Publications (3)

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JPWO2022196411A1 JPWO2022196411A1 (https=) 2022-09-22
JPWO2022196411A5 JPWO2022196411A5 (https=) 2023-05-29
JP7550958B2 true JP7550958B2 (ja) 2024-09-13

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JP (1) JP7550958B2 (https=)
WO (1) WO2022196411A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2014160707A (ja) 2013-02-19 2014-09-04 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、及びパワーモジュール
WO2017188246A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 電力用回路装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718451U (ja) * 1993-08-27 1995-03-31 株式会社明電舎 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2014160707A (ja) 2013-02-19 2014-09-04 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、及びパワーモジュール
WO2017188246A1 (ja) 2016-04-26 2017-11-02 三菱電機株式会社 電力用回路装置

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JPWO2022196411A1 (https=) 2022-09-22
WO2022196411A1 (ja) 2022-09-22

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