JPWO2022196411A5 - - Google Patents

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Publication number
JPWO2022196411A5
JPWO2022196411A5 JP2023506981A JP2023506981A JPWO2022196411A5 JP WO2022196411 A5 JPWO2022196411 A5 JP WO2022196411A5 JP 2023506981 A JP2023506981 A JP 2023506981A JP 2023506981 A JP2023506981 A JP 2023506981A JP WO2022196411 A5 JPWO2022196411 A5 JP WO2022196411A5
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JP
Japan
Prior art keywords
diffusion plate
groove
substrate
bonded
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023506981A
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English (en)
Japanese (ja)
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JP7550958B2 (ja
JPWO2022196411A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/009704 external-priority patent/WO2022196411A1/ja
Publication of JPWO2022196411A1 publication Critical patent/JPWO2022196411A1/ja
Publication of JPWO2022196411A5 publication Critical patent/JPWO2022196411A5/ja
Application granted granted Critical
Publication of JP7550958B2 publication Critical patent/JP7550958B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023506981A 2021-03-15 2022-03-07 半導体装置および電力変換装置 Active JP7550958B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021041268 2021-03-15
JP2021041268 2021-03-15
PCT/JP2022/009704 WO2022196411A1 (ja) 2021-03-15 2022-03-07 半導体装置および電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2022196411A1 JPWO2022196411A1 (https=) 2022-09-22
JPWO2022196411A5 true JPWO2022196411A5 (https=) 2023-05-29
JP7550958B2 JP7550958B2 (ja) 2024-09-13

Family

ID=83320424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506981A Active JP7550958B2 (ja) 2021-03-15 2022-03-07 半導体装置および電力変換装置

Country Status (2)

Country Link
JP (1) JP7550958B2 (https=)
WO (1) WO2022196411A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718451U (ja) * 1993-08-27 1995-03-31 株式会社明電舎 半導体装置
JP2004356261A (ja) 2003-05-28 2004-12-16 Mitsubishi Electric Corp 電力用半導体装置
JP2014160707A (ja) 2013-02-19 2014-09-04 Mitsubishi Materials Corp 接合体の製造方法、パワーモジュールの製造方法、及びパワーモジュール
JP6584652B2 (ja) 2016-04-26 2019-10-02 三菱電機株式会社 電力用回路装置

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