JPWO2022196411A1 - - Google Patents
Info
- Publication number
- JPWO2022196411A1 JPWO2022196411A1 JP2023506981A JP2023506981A JPWO2022196411A1 JP WO2022196411 A1 JPWO2022196411 A1 JP WO2022196411A1 JP 2023506981 A JP2023506981 A JP 2023506981A JP 2023506981 A JP2023506981 A JP 2023506981A JP WO2022196411 A1 JPWO2022196411 A1 JP WO2022196411A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021041268 | 2021-03-15 | ||
| JP2021041268 | 2021-03-15 | ||
| PCT/JP2022/009704 WO2022196411A1 (ja) | 2021-03-15 | 2022-03-07 | 半導体装置および電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196411A1 true JPWO2022196411A1 (https=) | 2022-09-22 |
| JPWO2022196411A5 JPWO2022196411A5 (https=) | 2023-05-29 |
| JP7550958B2 JP7550958B2 (ja) | 2024-09-13 |
Family
ID=83320424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506981A Active JP7550958B2 (ja) | 2021-03-15 | 2022-03-07 | 半導体装置および電力変換装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7550958B2 (https=) |
| WO (1) | WO2022196411A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718451U (ja) * | 1993-08-27 | 1995-03-31 | 株式会社明電舎 | 半導体装置 |
| JP2004356261A (ja) * | 2003-05-28 | 2004-12-16 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2014160707A (ja) * | 2013-02-19 | 2014-09-04 | Mitsubishi Materials Corp | 接合体の製造方法、パワーモジュールの製造方法、及びパワーモジュール |
| WO2017188246A1 (ja) * | 2016-04-26 | 2017-11-02 | 三菱電機株式会社 | 電力用回路装置 |
-
2022
- 2022-03-07 WO PCT/JP2022/009704 patent/WO2022196411A1/ja not_active Ceased
- 2022-03-07 JP JP2023506981A patent/JP7550958B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718451U (ja) * | 1993-08-27 | 1995-03-31 | 株式会社明電舎 | 半導体装置 |
| JP2004356261A (ja) * | 2003-05-28 | 2004-12-16 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2014160707A (ja) * | 2013-02-19 | 2014-09-04 | Mitsubishi Materials Corp | 接合体の製造方法、パワーモジュールの製造方法、及びパワーモジュール |
| WO2017188246A1 (ja) * | 2016-04-26 | 2017-11-02 | 三菱電機株式会社 | 電力用回路装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7550958B2 (ja) | 2024-09-13 |
| WO2022196411A1 (ja) | 2022-09-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230307 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230307 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240521 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240718 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240806 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240903 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7550958 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |