JPWO2022196411A1 - - Google Patents

Info

Publication number
JPWO2022196411A1
JPWO2022196411A1 JP2023506981A JP2023506981A JPWO2022196411A1 JP WO2022196411 A1 JPWO2022196411 A1 JP WO2022196411A1 JP 2023506981 A JP2023506981 A JP 2023506981A JP 2023506981 A JP2023506981 A JP 2023506981A JP WO2022196411 A1 JPWO2022196411 A1 JP WO2022196411A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023506981A
Other versions
JPWO2022196411A5 (ja
JP7550958B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022196411A1 publication Critical patent/JPWO2022196411A1/ja
Publication of JPWO2022196411A5 publication Critical patent/JPWO2022196411A5/ja
Application granted granted Critical
Publication of JP7550958B2 publication Critical patent/JP7550958B2/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023506981A 2021-03-15 2022-03-07 半導体装置および電力変換装置 JP7550958B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021041268 2021-03-15
JP2021041268 2021-03-15
PCT/JP2022/009704 WO2022196411A1 (ja) 2021-03-15 2022-03-07 半導体装置および電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2022196411A1 true JPWO2022196411A1 (ja) 2022-09-22
JPWO2022196411A5 JPWO2022196411A5 (ja) 2023-05-29
JP7550958B2 JP7550958B2 (ja) 2024-09-13

Family

ID=

Also Published As

Publication number Publication date
WO2022196411A1 (ja) 2022-09-22

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022009896A2 (ja)
BR112022024743A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112023011738A2 (ja)
JPWO2022196411A1 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016176A2 (ja)
BR102021016200A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230307

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230307

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240521

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240718

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240806