JP7540611B2 - 伸縮デバイス - Google Patents

伸縮デバイス Download PDF

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Publication number
JP7540611B2
JP7540611B2 JP2023566194A JP2023566194A JP7540611B2 JP 7540611 B2 JP7540611 B2 JP 7540611B2 JP 2023566194 A JP2023566194 A JP 2023566194A JP 2023566194 A JP2023566194 A JP 2023566194A JP 7540611 B2 JP7540611 B2 JP 7540611B2
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JP
Japan
Prior art keywords
wiring
substrate
main surface
side wiring
substrate side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023566194A
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English (en)
Japanese (ja)
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JPWO2023106051A5 (https=
JPWO2023106051A1 (https=
Inventor
圭佑 西田
祐依 中村
信康 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023106051A1 publication Critical patent/JPWO2023106051A1/ja
Publication of JPWO2023106051A5 publication Critical patent/JPWO2023106051A5/ja
Application granted granted Critical
Publication of JP7540611B2 publication Critical patent/JP7540611B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2023566194A 2021-12-10 2022-11-15 伸縮デバイス Active JP7540611B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021201035 2021-12-10
JP2021201035 2021-12-10
PCT/JP2022/042423 WO2023106051A1 (ja) 2021-12-10 2022-11-15 伸縮デバイス

Publications (3)

Publication Number Publication Date
JPWO2023106051A1 JPWO2023106051A1 (https=) 2023-06-15
JPWO2023106051A5 JPWO2023106051A5 (https=) 2024-07-26
JP7540611B2 true JP7540611B2 (ja) 2024-08-27

Family

ID=86730402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566194A Active JP7540611B2 (ja) 2021-12-10 2022-11-15 伸縮デバイス

Country Status (3)

Country Link
US (1) US20240321721A1 (https=)
JP (1) JP7540611B2 (https=)
WO (1) WO2023106051A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178121A (ja) 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
JP2016219543A (ja) 2015-05-18 2016-12-22 日本メクトロン株式会社 伸縮性配線基板
WO2019138855A1 (ja) 2018-01-15 2019-07-18 パイクリスタル株式会社 フレキシブル基板、電子デバイス、電子デバイスの製造方法
WO2020137078A1 (ja) 2018-12-27 2020-07-02 株式会社村田製作所 伸縮性配線基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56172980U (https=) * 1980-05-21 1981-12-21
JP5256143B2 (ja) * 2009-08-03 2013-08-07 東海ゴム工業株式会社 配線体接続構造体およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178121A (ja) 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
JP2016219543A (ja) 2015-05-18 2016-12-22 日本メクトロン株式会社 伸縮性配線基板
WO2019138855A1 (ja) 2018-01-15 2019-07-18 パイクリスタル株式会社 フレキシブル基板、電子デバイス、電子デバイスの製造方法
WO2020137078A1 (ja) 2018-12-27 2020-07-02 株式会社村田製作所 伸縮性配線基板

Also Published As

Publication number Publication date
US20240321721A1 (en) 2024-09-26
WO2023106051A1 (ja) 2023-06-15
JPWO2023106051A1 (https=) 2023-06-15

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