JPWO2023106051A1 - - Google Patents

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Publication number
JPWO2023106051A1
JPWO2023106051A1 JP2023566194A JP2023566194A JPWO2023106051A1 JP WO2023106051 A1 JPWO2023106051 A1 JP WO2023106051A1 JP 2023566194 A JP2023566194 A JP 2023566194A JP 2023566194 A JP2023566194 A JP 2023566194A JP WO2023106051 A1 JPWO2023106051 A1 JP WO2023106051A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023566194A
Other languages
Japanese (ja)
Other versions
JPWO2023106051A5 (https=
JP7540611B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023106051A1 publication Critical patent/JPWO2023106051A1/ja
Publication of JPWO2023106051A5 publication Critical patent/JPWO2023106051A5/ja
Application granted granted Critical
Publication of JP7540611B2 publication Critical patent/JP7540611B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2023566194A 2021-12-10 2022-11-15 伸縮デバイス Active JP7540611B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021201035 2021-12-10
JP2021201035 2021-12-10
PCT/JP2022/042423 WO2023106051A1 (ja) 2021-12-10 2022-11-15 伸縮デバイス

Publications (3)

Publication Number Publication Date
JPWO2023106051A1 true JPWO2023106051A1 (https=) 2023-06-15
JPWO2023106051A5 JPWO2023106051A5 (https=) 2024-07-26
JP7540611B2 JP7540611B2 (ja) 2024-08-27

Family

ID=86730402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566194A Active JP7540611B2 (ja) 2021-12-10 2022-11-15 伸縮デバイス

Country Status (3)

Country Link
US (1) US20240321721A1 (https=)
JP (1) JP7540611B2 (https=)
WO (1) WO2023106051A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56172980U (https=) * 1980-05-21 1981-12-21
JP2011034822A (ja) * 2009-08-03 2011-02-17 Tokai Rubber Ind Ltd 配線体接続構造体およびその製造方法
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
JP2016219543A (ja) * 2015-05-18 2016-12-22 日本メクトロン株式会社 伸縮性配線基板
WO2019138855A1 (ja) * 2018-01-15 2019-07-18 パイクリスタル株式会社 フレキシブル基板、電子デバイス、電子デバイスの製造方法
WO2020137078A1 (ja) * 2018-12-27 2020-07-02 株式会社村田製作所 伸縮性配線基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56172980U (https=) * 1980-05-21 1981-12-21
JP2011034822A (ja) * 2009-08-03 2011-02-17 Tokai Rubber Ind Ltd 配線体接続構造体およびその製造方法
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板
JP2016219543A (ja) * 2015-05-18 2016-12-22 日本メクトロン株式会社 伸縮性配線基板
WO2019138855A1 (ja) * 2018-01-15 2019-07-18 パイクリスタル株式会社 フレキシブル基板、電子デバイス、電子デバイスの製造方法
WO2020137078A1 (ja) * 2018-12-27 2020-07-02 株式会社村田製作所 伸縮性配線基板

Also Published As

Publication number Publication date
US20240321721A1 (en) 2024-09-26
WO2023106051A1 (ja) 2023-06-15
JP7540611B2 (ja) 2024-08-27

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