JP7525079B1 - 電子部品、電子部品の実装構造体及び電子部品の分離方法 - Google Patents

電子部品、電子部品の実装構造体及び電子部品の分離方法 Download PDF

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Publication number
JP7525079B1
JP7525079B1 JP2023579348A JP2023579348A JP7525079B1 JP 7525079 B1 JP7525079 B1 JP 7525079B1 JP 2023579348 A JP2023579348 A JP 2023579348A JP 2023579348 A JP2023579348 A JP 2023579348A JP 7525079 B1 JP7525079 B1 JP 7525079B1
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Japan
Prior art keywords
electronic component
microwave absorbing
dielectric
layer
element body
Prior art date
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JP2023579348A
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English (en)
Japanese (ja)
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JPWO2024134938A5 (https=
JPWO2024134938A1 (https=
Inventor
慶次郎 小島
拓海 正木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2024134938A5 publication Critical patent/JPWO2024134938A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2023579348A 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法 Active JP7525079B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022205383 2022-12-22
JP2022205383 2022-12-22
PCT/JP2023/023793 WO2024134938A1 (ja) 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法

Publications (3)

Publication Number Publication Date
JPWO2024134938A1 JPWO2024134938A1 (https=) 2024-06-27
JP7525079B1 true JP7525079B1 (ja) 2024-07-30
JPWO2024134938A5 JPWO2024134938A5 (https=) 2024-11-19

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Family Applications (1)

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JP2023579348A Active JP7525079B1 (ja) 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法

Country Status (4)

Country Link
US (1) US20250239409A1 (https=)
JP (1) JP7525079B1 (https=)
CN (1) CN118541765A (https=)
WO (1) WO2024134938A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139446A (ja) * 1994-11-08 1996-05-31 Nec Corp 部品を搭載したプリント基板からの部品の解体方法
JPH1017948A (ja) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd プリント基板のはんだ除去方法およびはんだ除去装置
JP2002233856A (ja) * 2001-02-06 2002-08-20 Narifumi Uemura プリント基板からの金属類の分離方法および装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139446A (ja) * 1994-11-08 1996-05-31 Nec Corp 部品を搭載したプリント基板からの部品の解体方法
JPH1017948A (ja) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd プリント基板のはんだ除去方法およびはんだ除去装置
JP2002233856A (ja) * 2001-02-06 2002-08-20 Narifumi Uemura プリント基板からの金属類の分離方法および装置

Also Published As

Publication number Publication date
WO2024134938A1 (ja) 2024-06-27
US20250239409A1 (en) 2025-07-24
JPWO2024134938A1 (https=) 2024-06-27
CN118541765A (zh) 2024-08-23

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