JPWO2024134938A5 - - Google Patents

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Publication number
JPWO2024134938A5
JPWO2024134938A5 JP2023579348A JP2023579348A JPWO2024134938A5 JP WO2024134938 A5 JPWO2024134938 A5 JP WO2024134938A5 JP 2023579348 A JP2023579348 A JP 2023579348A JP 2023579348 A JP2023579348 A JP 2023579348A JP WO2024134938 A5 JPWO2024134938 A5 JP WO2024134938A5
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JP
Japan
Prior art keywords
electronic component
absorbing layer
microwave absorbing
element body
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023579348A
Other languages
English (en)
Japanese (ja)
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JPWO2024134938A1 (https=
JP7525079B1 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023793 external-priority patent/WO2024134938A1/ja
Publication of JPWO2024134938A1 publication Critical patent/JPWO2024134938A1/ja
Application granted granted Critical
Publication of JP7525079B1 publication Critical patent/JP7525079B1/ja
Publication of JPWO2024134938A5 publication Critical patent/JPWO2024134938A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023579348A 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法 Active JP7525079B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022205383 2022-12-22
JP2022205383 2022-12-22
PCT/JP2023/023793 WO2024134938A1 (ja) 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法

Publications (3)

Publication Number Publication Date
JPWO2024134938A1 JPWO2024134938A1 (https=) 2024-06-27
JP7525079B1 JP7525079B1 (ja) 2024-07-30
JPWO2024134938A5 true JPWO2024134938A5 (https=) 2024-11-19

Family

ID=91587915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023579348A Active JP7525079B1 (ja) 2022-12-22 2023-06-27 電子部品、電子部品の実装構造体及び電子部品の分離方法

Country Status (4)

Country Link
US (1) US20250239409A1 (https=)
JP (1) JP7525079B1 (https=)
CN (1) CN118541765A (https=)
WO (1) WO2024134938A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2601225B2 (ja) * 1994-11-08 1997-04-16 日本電気株式会社 部品を搭載したプリント基板からの部品の解体方法
JPH1017948A (ja) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd プリント基板のはんだ除去方法およびはんだ除去装置
JP2002233856A (ja) * 2001-02-06 2002-08-20 Narifumi Uemura プリント基板からの金属類の分離方法および装置

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