JP7513634B2 - 撮像装置および撮像装置の製造方法 - Google Patents

撮像装置および撮像装置の製造方法 Download PDF

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Publication number
JP7513634B2
JP7513634B2 JP2021562472A JP2021562472A JP7513634B2 JP 7513634 B2 JP7513634 B2 JP 7513634B2 JP 2021562472 A JP2021562472 A JP 2021562472A JP 2021562472 A JP2021562472 A JP 2021562472A JP 7513634 B2 JP7513634 B2 JP 7513634B2
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imaging
light
imaging device
sealing
wiring board
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Japanese (ja)
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JPWO2021111716A1 (https=
Inventor
睦夫 辻
大祐 茅野
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021562472A 2019-12-04 2020-09-30 撮像装置および撮像装置の製造方法 Active JP7513634B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019219540 2019-12-04
JP2019219540 2019-12-04
PCT/JP2020/037164 WO2021111716A1 (ja) 2019-12-04 2020-09-30 撮像装置および撮像装置の製造方法

Publications (2)

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JPWO2021111716A1 JPWO2021111716A1 (https=) 2021-06-10
JP7513634B2 true JP7513634B2 (ja) 2024-07-09

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JP2021562472A Active JP7513634B2 (ja) 2019-12-04 2020-09-30 撮像装置および撮像装置の製造方法

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US (1) US12356737B2 (https=)
EP (1) EP4071794A4 (https=)
JP (1) JP7513634B2 (https=)
CN (1) CN114730785A (https=)
WO (1) WO2021111716A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021111715A1 (ja) 2019-12-04 2021-06-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法
JP7834422B2 (ja) * 2021-09-14 2026-03-24 ソニーセミコンダクタソリューションズ株式会社 半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308302A (ja) 2000-04-27 2001-11-02 Mitsubishi Electric Corp 撮像装置および撮像装置搭載製品ならびに撮像装置製造方法
JP2008258921A (ja) 2007-04-04 2008-10-23 Sharp Corp 固体撮像装置およびそれを備えた電子機器
WO2016129409A1 (ja) 2015-02-13 2016-08-18 ソニー株式会社 撮像素子、製造方法、および電子機器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321859A (ja) * 1989-06-20 1991-01-30 Nippondenso Co Ltd 酸素センサー
JPH085566Y2 (ja) * 1989-07-12 1996-02-14 オリンパス光学工業株式会社 固体撮像装置
JPH042747A (ja) 1990-04-19 1992-01-07 Furukawa Alum Co Ltd アルミニウム合金制振材料の製造方法
JPH0562057A (ja) * 1991-09-03 1993-03-12 Oki Electric Ind Co Ltd 自動取引装置
JPH0562057U (ja) * 1992-01-29 1993-08-13 京セラ株式会社 撮像装置
JP3651580B2 (ja) * 2000-04-07 2005-05-25 三菱電機株式会社 撮像装置及びその製造方法
JP2004296453A (ja) * 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
KR101100790B1 (ko) * 2006-09-15 2012-01-02 후지쯔 세미컨덕터 가부시키가이샤 반도체 장치 및 그 제조 방법
JP2008245244A (ja) 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP2009021307A (ja) * 2007-07-10 2009-01-29 Sharp Corp 半導体装置、撮像装置、およびそれらの製造方法
JP5324890B2 (ja) * 2008-11-11 2013-10-23 ラピスセミコンダクタ株式会社 カメラモジュールおよびその製造方法
US8890269B2 (en) * 2012-05-31 2014-11-18 Stmicroelectronics Pte Ltd. Optical sensor package with through vias

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308302A (ja) 2000-04-27 2001-11-02 Mitsubishi Electric Corp 撮像装置および撮像装置搭載製品ならびに撮像装置製造方法
JP2008258921A (ja) 2007-04-04 2008-10-23 Sharp Corp 固体撮像装置およびそれを備えた電子機器
WO2016129409A1 (ja) 2015-02-13 2016-08-18 ソニー株式会社 撮像素子、製造方法、および電子機器

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Publication number Publication date
WO2021111716A1 (ja) 2021-06-10
CN114730785A (zh) 2022-07-08
EP4071794A1 (en) 2022-10-12
US12356737B2 (en) 2025-07-08
US20220415937A1 (en) 2022-12-29
EP4071794A4 (en) 2023-01-04
JPWO2021111716A1 (https=) 2021-06-10

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