JPWO2021111716A1 - - Google Patents
Info
- Publication number
- JPWO2021111716A1 JPWO2021111716A1 JP2021562472A JP2021562472A JPWO2021111716A1 JP WO2021111716 A1 JPWO2021111716 A1 JP WO2021111716A1 JP 2021562472 A JP2021562472 A JP 2021562472A JP 2021562472 A JP2021562472 A JP 2021562472A JP WO2021111716 A1 JPWO2021111716 A1 JP WO2021111716A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019219540 | 2019-12-04 | ||
| JP2019219540 | 2019-12-04 | ||
| PCT/JP2020/037164 WO2021111716A1 (ja) | 2019-12-04 | 2020-09-30 | 撮像装置および撮像装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021111716A1 true JPWO2021111716A1 (https=) | 2021-06-10 |
| JP7513634B2 JP7513634B2 (ja) | 2024-07-09 |
Family
ID=76221896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021562472A Active JP7513634B2 (ja) | 2019-12-04 | 2020-09-30 | 撮像装置および撮像装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12356737B2 (https=) |
| EP (1) | EP4071794A4 (https=) |
| JP (1) | JP7513634B2 (https=) |
| CN (1) | CN114730785A (https=) |
| WO (1) | WO2021111716A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021111715A1 (ja) | 2019-12-04 | 2021-06-10 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
| JP7834422B2 (ja) * | 2021-09-14 | 2026-03-24 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321859U (https=) * | 1989-07-12 | 1991-03-05 | ||
| JPH0562057U (ja) * | 1992-01-29 | 1993-08-13 | 京セラ株式会社 | 撮像装置 |
| JP2001308302A (ja) * | 2000-04-27 | 2001-11-02 | Mitsubishi Electric Corp | 撮像装置および撮像装置搭載製品ならびに撮像装置製造方法 |
| JP2008258921A (ja) * | 2007-04-04 | 2008-10-23 | Sharp Corp | 固体撮像装置およびそれを備えた電子機器 |
| WO2016129409A1 (ja) * | 2015-02-13 | 2016-08-18 | ソニー株式会社 | 撮像素子、製造方法、および電子機器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321859A (ja) * | 1989-06-20 | 1991-01-30 | Nippondenso Co Ltd | 酸素センサー |
| JPH042747A (ja) | 1990-04-19 | 1992-01-07 | Furukawa Alum Co Ltd | アルミニウム合金制振材料の製造方法 |
| JPH0562057A (ja) * | 1991-09-03 | 1993-03-12 | Oki Electric Ind Co Ltd | 自動取引装置 |
| JP3651580B2 (ja) * | 2000-04-07 | 2005-05-25 | 三菱電機株式会社 | 撮像装置及びその製造方法 |
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| KR101100790B1 (ko) * | 2006-09-15 | 2012-01-02 | 후지쯔 세미컨덕터 가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
| JP2008245244A (ja) | 2007-02-26 | 2008-10-09 | Sony Corp | 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置 |
| JP2009021307A (ja) * | 2007-07-10 | 2009-01-29 | Sharp Corp | 半導体装置、撮像装置、およびそれらの製造方法 |
| JP5324890B2 (ja) * | 2008-11-11 | 2013-10-23 | ラピスセミコンダクタ株式会社 | カメラモジュールおよびその製造方法 |
| US8890269B2 (en) * | 2012-05-31 | 2014-11-18 | Stmicroelectronics Pte Ltd. | Optical sensor package with through vias |
-
2020
- 2020-09-30 US US17/780,230 patent/US12356737B2/en active Active
- 2020-09-30 CN CN202080082540.2A patent/CN114730785A/zh not_active Withdrawn
- 2020-09-30 EP EP20895571.6A patent/EP4071794A4/en not_active Withdrawn
- 2020-09-30 WO PCT/JP2020/037164 patent/WO2021111716A1/ja not_active Ceased
- 2020-09-30 JP JP2021562472A patent/JP7513634B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321859U (https=) * | 1989-07-12 | 1991-03-05 | ||
| JPH0562057U (ja) * | 1992-01-29 | 1993-08-13 | 京セラ株式会社 | 撮像装置 |
| JP2001308302A (ja) * | 2000-04-27 | 2001-11-02 | Mitsubishi Electric Corp | 撮像装置および撮像装置搭載製品ならびに撮像装置製造方法 |
| JP2008258921A (ja) * | 2007-04-04 | 2008-10-23 | Sharp Corp | 固体撮像装置およびそれを備えた電子機器 |
| WO2016129409A1 (ja) * | 2015-02-13 | 2016-08-18 | ソニー株式会社 | 撮像素子、製造方法、および電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021111716A1 (ja) | 2021-06-10 |
| CN114730785A (zh) | 2022-07-08 |
| EP4071794A1 (en) | 2022-10-12 |
| JP7513634B2 (ja) | 2024-07-09 |
| US12356737B2 (en) | 2025-07-08 |
| US20220415937A1 (en) | 2022-12-29 |
| EP4071794A4 (en) | 2023-01-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230828 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240312 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240430 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240528 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240627 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7513634 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |