JPWO2021111716A1 - - Google Patents

Info

Publication number
JPWO2021111716A1
JPWO2021111716A1 JP2021562472A JP2021562472A JPWO2021111716A1 JP WO2021111716 A1 JPWO2021111716 A1 JP WO2021111716A1 JP 2021562472 A JP2021562472 A JP 2021562472A JP 2021562472 A JP2021562472 A JP 2021562472A JP WO2021111716 A1 JPWO2021111716 A1 JP WO2021111716A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021562472A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021111716A1 publication Critical patent/JPWO2021111716A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
JP2021562472A 2019-12-04 2020-09-30 Pending JPWO2021111716A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019219540 2019-12-04
PCT/JP2020/037164 WO2021111716A1 (ja) 2019-12-04 2020-09-30 撮像装置および撮像装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021111716A1 true JPWO2021111716A1 (ja) 2021-06-10

Family

ID=76221896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562472A Pending JPWO2021111716A1 (ja) 2019-12-04 2020-09-30

Country Status (5)

Country Link
US (1) US20220415937A1 (ja)
EP (1) EP4071794A4 (ja)
JP (1) JPWO2021111716A1 (ja)
CN (1) CN114730785A (ja)
WO (1) WO2021111716A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4071795A4 (en) * 2019-12-04 2023-01-11 Sony Semiconductor Solutions Corporation IMAGING DEVICE AND METHOD OF MANUFACTURING THE IMAGING DEVICE
WO2023042450A1 (ja) * 2021-09-14 2023-03-23 ソニーセミコンダクタソリューションズ株式会社 半導体装置の製造方法、半導体装置、及び半導体装置用の配線基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321859A (ja) * 1989-06-20 1991-01-30 Nippondenso Co Ltd 酸素センサー
JPH0562057A (ja) * 1991-09-03 1993-03-12 Oki Electric Ind Co Ltd 自動取引装置
JP3651580B2 (ja) * 2000-04-07 2005-05-25 三菱電機株式会社 撮像装置及びその製造方法
JP3626661B2 (ja) * 2000-04-27 2005-03-09 三菱電機株式会社 撮像装置および撮像装置搭載製品ならびに撮像装置製造方法
WO2008032404A1 (en) * 2006-09-15 2008-03-20 Fujitsu Microelectronics Limited Semiconductor device and method for manufacturing same
JP2008245244A (ja) 2007-02-26 2008-10-09 Sony Corp 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置
JP5324890B2 (ja) * 2008-11-11 2013-10-23 ラピスセミコンダクタ株式会社 カメラモジュールおよびその製造方法
US8890269B2 (en) * 2012-05-31 2014-11-18 Stmicroelectronics Pte Ltd. Optical sensor package with through vias
WO2016129409A1 (ja) * 2015-02-13 2016-08-18 ソニー株式会社 撮像素子、製造方法、および電子機器

Also Published As

Publication number Publication date
EP4071794A1 (en) 2022-10-12
EP4071794A4 (en) 2023-01-04
WO2021111716A1 (ja) 2021-06-10
US20220415937A1 (en) 2022-12-29
CN114730785A (zh) 2022-07-08

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