JP7511769B2 - 電気機器配線部品 - Google Patents

電気機器配線部品 Download PDF

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Publication number
JP7511769B2
JP7511769B2 JP2023537777A JP2023537777A JP7511769B2 JP 7511769 B2 JP7511769 B2 JP 7511769B2 JP 2023537777 A JP2023537777 A JP 2023537777A JP 2023537777 A JP2023537777 A JP 2023537777A JP 7511769 B2 JP7511769 B2 JP 7511769B2
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JP
Japan
Prior art keywords
housing
wiring component
opening
filler
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023537777A
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English (en)
Japanese (ja)
Other versions
JPWO2023007571A1 (https=
Inventor
友貴 廣瀬
満夫 曽根
昭史 下野
大義 岡崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023007571A1 publication Critical patent/JPWO2023007571A1/ja
Application granted granted Critical
Publication of JP7511769B2 publication Critical patent/JP7511769B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00—Installations of bus-bars
    • H02G5/06—Totally-enclosed installations, e.g. in metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
JP2023537777A 2021-07-27 2021-07-27 電気機器配線部品 Active JP7511769B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/027658 WO2023007571A1 (ja) 2021-07-27 2021-07-27 電気機器配線部品

Publications (2)

Publication Number Publication Date
JPWO2023007571A1 JPWO2023007571A1 (https=) 2023-02-02
JP7511769B2 true JP7511769B2 (ja) 2024-07-05

Family

ID=85086440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023537777A Active JP7511769B2 (ja) 2021-07-27 2021-07-27 電気機器配線部品

Country Status (5)

Country Link
US (1) US12609517B2 (https=)
JP (1) JP7511769B2 (https=)
CN (1) CN117694023A (https=)
DE (1) DE112021008024B4 (https=)
WO (1) WO2023007571A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002078147A (ja) 2000-08-25 2002-03-15 Sumitomo Wiring Syst Ltd 回路基板および該回路基板を備えたジャンクションボックス
JP2004084279A (ja) 2002-08-27 2004-03-18 Bridgestone Corp 天井点検口の蓋体固定構造
JP2006074907A (ja) 2004-09-02 2006-03-16 Honda Motor Co Ltd 電源分配装置
JP2013027053A (ja) 2011-07-14 2013-02-04 Auto Network Gijutsu Kenkyusho:Kk 半導体モジュール、及び、電気接続箱

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2514432Y2 (ja) * 1988-05-10 1996-10-16 矢崎総業株式会社 電気接続箱
JP2002027636A (ja) 2000-07-04 2002-01-25 Sumitomo Wiring Syst Ltd 高電圧用電気接続箱に用いる回路体
US6333463B1 (en) * 2000-11-17 2001-12-25 Tyco Electronics Corporation Wire separators having sealant material reservoirs and cable splice closures employing such separators
JP2011193566A (ja) 2010-03-12 2011-09-29 Nissin Kogyo Co Ltd 電子基板の電気接続構造
JP6194868B2 (ja) 2014-09-18 2017-09-13 株式会社オートネットワーク技術研究所 電気接続箱
DE102017204949B4 (de) * 2017-03-23 2024-11-28 SUMIDA Components & Modules GmbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bauelements
JP7415742B2 (ja) * 2020-03-31 2024-01-17 株式会社デンソー 電力変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002078147A (ja) 2000-08-25 2002-03-15 Sumitomo Wiring Syst Ltd 回路基板および該回路基板を備えたジャンクションボックス
JP2004084279A (ja) 2002-08-27 2004-03-18 Bridgestone Corp 天井点検口の蓋体固定構造
JP2006074907A (ja) 2004-09-02 2006-03-16 Honda Motor Co Ltd 電源分配装置
JP2013027053A (ja) 2011-07-14 2013-02-04 Auto Network Gijutsu Kenkyusho:Kk 半導体モジュール、及び、電気接続箱

Also Published As

Publication number Publication date
DE112021008024B4 (de) 2025-11-06
DE112021008024T5 (de) 2024-05-16
US12609517B2 (en) 2026-04-21
CN117694023A (zh) 2024-03-12
WO2023007571A1 (ja) 2023-02-02
JPWO2023007571A1 (https=) 2023-02-02
US20240275153A1 (en) 2024-08-15

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