DE112021008024B4 - Verdrahtungskomponente für elektrische geräte - Google Patents

Verdrahtungskomponente für elektrische geräte

Info

Publication number
DE112021008024B4
DE112021008024B4 DE112021008024.5T DE112021008024T DE112021008024B4 DE 112021008024 B4 DE112021008024 B4 DE 112021008024B4 DE 112021008024 T DE112021008024 T DE 112021008024T DE 112021008024 B4 DE112021008024 B4 DE 112021008024B4
Authority
DE
Germany
Prior art keywords
section
wiring component
housing
busbars
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112021008024.5T
Other languages
German (de)
English (en)
Other versions
DE112021008024T5 (de
Inventor
Yuki Hirose
Mitsuo SONE
Akifumi SHIMONO
Taigi OKAZAKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021008024T5 publication Critical patent/DE112021008024T5/de
Application granted granted Critical
Publication of DE112021008024B4 publication Critical patent/DE112021008024B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4602Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4608Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00Installations of bus-bars
    • H02G5/06Totally-enclosed installations, e.g. in metal casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02Details
    • H02G3/08Distribution boxes; Connection or junction boxes
    • H02G3/16Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
DE112021008024.5T 2021-07-27 2021-07-27 Verdrahtungskomponente für elektrische geräte Active DE112021008024B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/027658 WO2023007571A1 (ja) 2021-07-27 2021-07-27 電気機器配線部品

Publications (2)

Publication Number Publication Date
DE112021008024T5 DE112021008024T5 (de) 2024-05-16
DE112021008024B4 true DE112021008024B4 (de) 2025-11-06

Family

ID=85086440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021008024.5T Active DE112021008024B4 (de) 2021-07-27 2021-07-27 Verdrahtungskomponente für elektrische geräte

Country Status (5)

Country Link
US (1) US12609517B2 (https=)
JP (1) JP7511769B2 (https=)
CN (1) CN117694023A (https=)
DE (1) DE112021008024B4 (https=)
WO (1) WO2023007571A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166417U (https=) 1988-05-10 1989-11-21
DE102011005434A1 (de) 2010-03-12 2011-11-03 Nissin Kogyo Co., Ltd. Elektrische Verbindungsstruktur einer Platine
DE112015004241T5 (de) 2014-09-18 2017-06-14 Autonetworks Technologies, Ltd. Elektrischer Verteiler

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002027636A (ja) 2000-07-04 2002-01-25 Sumitomo Wiring Syst Ltd 高電圧用電気接続箱に用いる回路体
JP3698034B2 (ja) 2000-08-25 2005-09-21 住友電装株式会社 ジャンクションボックス
US6333463B1 (en) * 2000-11-17 2001-12-25 Tyco Electronics Corporation Wire separators having sealant material reservoirs and cable splice closures employing such separators
JP3894309B2 (ja) * 2002-08-27 2007-03-22 株式会社ブリヂストン 天井点検口の蓋体固定構造
JP2006074907A (ja) 2004-09-02 2006-03-16 Honda Motor Co Ltd 電源分配装置
JP5782884B2 (ja) * 2011-07-14 2015-09-24 株式会社オートネットワーク技術研究所 半導体モジュール、及び、電気接続箱
DE102017204949B4 (de) * 2017-03-23 2024-11-28 SUMIDA Components & Modules GmbH Induktives Bauelement und Verfahren zum Herstellen eines induktiven Bauelements
JP7415742B2 (ja) * 2020-03-31 2024-01-17 株式会社デンソー 電力変換装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166417U (https=) 1988-05-10 1989-11-21
DE102011005434A1 (de) 2010-03-12 2011-11-03 Nissin Kogyo Co., Ltd. Elektrische Verbindungsstruktur einer Platine
DE112015004241T5 (de) 2014-09-18 2017-06-14 Autonetworks Technologies, Ltd. Elektrischer Verteiler

Also Published As

Publication number Publication date
DE112021008024T5 (de) 2024-05-16
US12609517B2 (en) 2026-04-21
CN117694023A (zh) 2024-03-12
WO2023007571A1 (ja) 2023-02-02
JPWO2023007571A1 (https=) 2023-02-02
US20240275153A1 (en) 2024-08-15
JP7511769B2 (ja) 2024-07-05

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R018 Grant decision by examination section/examining division