JP7498228B2 - 基板ホルダ、基板支持部、基板をクランプシステムにクランプする方法、およびリソグラフィ装置 - Google Patents
基板ホルダ、基板支持部、基板をクランプシステムにクランプする方法、およびリソグラフィ装置 Download PDFInfo
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
本出願は、2017年11月20日に出願された欧州出願第17202627.0号の優先権を主張し、その全体が本明細書に援用される。
Claims (11)
- リソグラフィ装置に使用され、基板を基板支持部に支持するように構成される基板ホルダであって、
第1本体表面と第2本体表面を有する本体であって、前記第1本体表面と前記第2本体表面が当該本体の両側にある本体と、
前記第1本体表面から突出する複数の第1バールであって、各第1バールが前記基板を支持するように構成される先端を有する複数の第1バールと、
前記第2本体表面から突出する複数の第2バールであって、前記基板ホルダを前記基板支持部に支持するための先端を各第2バールが有する複数の第2バールと、を備え、
前記第1バールの中心部を前記第1バールの突出方向に沿って通る第1仮想線が、前記第2本体表面から突出するすべてのバールの中心部をそれらバールの突出方向に沿って通る第2仮想線と不一致であり、
前記複数の第1バールは、前記本体が変形するとき前記基板が前記第1バールのうち第1サブセットまたは前記第1バールのうち第2サブセットのいずれかのみによって支持されるように配置されている、基板ホルダ。 - 少なくとも2つの第1仮想線が、2つの隣接する第2仮想線の間を通る、請求項1に記載の基板ホルダ。
- 前記第1バールのうち少なくとも1つが、前記第1本体表面に垂直な方向から見たとき、前記第2バールのうち少なくとも1つと重なっている、請求項1または2に記載の基板ホルダ。
- リソグラフィ装置に使用され、基板を基板支持部に支持するように構成される基板ホルダであって、
第1本体表面と第2本体表面を有する本体であって、前記第1本体表面と前記第2本体表面が当該本体の両側にある本体と、
前記第1本体表面から突出する複数の第1バールであって、各第1バールが前記基板を支持するように構成される先端を有する複数の第1バールと、
前記第2本体表面から突出する複数の第2バールであって、前記基板ホルダを前記基板支持部に支持するための先端を各第2バールが有する複数の第2バールと、を備え、
前記第2バールのうち1つ又は複数の中心部を前記第2バールのうち前記1つ又は複数の突出方向に沿って通る仮想線が、前記第1バール間の1つ又は複数のギャップを通過し、
前記複数の第1バールは、前記本体が変形するとき前記基板が前記第1バールのうち第1サブセットまたは前記第1バールのうち第2サブセットのいずれかのみによって支持されるように配置されている、基板ホルダ。 - 前記仮想線の各々が、隣接する第1バール間のギャップを通過する、請求項4に記載の基板ホルダ。
- リソグラフィ装置に使用され、基板を基板支持部に支持するように構成される基板ホルダであって、
第1本体表面と第2本体表面を有する本体であって、前記第1本体表面と前記第2本体表面が当該本体の両側にある本体と、
前記第1本体表面から突出する複数の第1バールであって、各第1バールが前記基板を支持するように構成される先端を有する複数の第1バールと、
前記第2本体表面から突出する複数の第2バールであって、前記基板ホルダを前記基板支持部に支持するための先端を各第2バールが有する複数の第2バールと、を備え、
鉛直方向において、1つ又は複数の第2バールが1つ又は複数の第1バールと重なっておらず、
前記複数の第1バールは、前記本体が変形するとき前記基板が前記第1バールのうち第1サブセットまたは前記第1バールのうち第2サブセットのいずれかのみによって支持されるように配置されている、基板ホルダ。 - 前記第2本体表面に沿う単位長さ当たりの第2バールの数は、前記第1本体表面に沿う単位長さ当たりの第1バールの数と異なる、請求項6に記載の基板ホルダ。
- 前記複数の第1バールは、円錐台状の形状を有しており、及び/または、前記複数の第1バールは、基板が前記第1バールのうち第2サブセットによって支持されるとき前記第1バールのうち第1サブセットの各第1バールの前記先端と前記基板との間に隙間が存在するように配置されている、請求項1から7のいずれかに記載の基板ホルダ。
- 前記第1バールのピッチは、前記第2バールのピッチよりも小さい、請求項1から8のいずれかに記載の基板ホルダ。
- 前記基板ホルダに力を印加可能とするように構成される電極をさらに備える、請求項1から9のいずれかに記載の基板ホルダ。
- 基板をクランプするクランプシステムであって、前記基板を保持するように構成される請求項1から10のいずれかに記載の基板ホルダを備えるクランプシステムを備えるリソグラフィ装置。
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EP17202627.0 | 2017-11-20 | ||
EP17202627 | 2017-11-20 | ||
JP2020527115A JP7121122B2 (ja) | 2017-11-20 | 2018-10-24 | 基板ホルダ、基板支持部、基板をクランプシステムにクランプする方法、およびリソグラフィ装置 |
PCT/EP2018/079185 WO2019096554A1 (en) | 2017-11-20 | 2018-10-24 | Substrate holder, substrate support and method of clamping a substrate to a clamping system |
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JP2022117758A Active JP7498228B2 (ja) | 2017-11-20 | 2022-07-25 | 基板ホルダ、基板支持部、基板をクランプシステムにクランプする方法、およびリソグラフィ装置 |
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US (2) | US11187998B2 (ja) |
EP (1) | EP3714329A1 (ja) |
JP (2) | JP7121122B2 (ja) |
KR (2) | KR102456532B1 (ja) |
CN (1) | CN111406235A (ja) |
NL (1) | NL2021871A (ja) |
TW (3) | TWI815329B (ja) |
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WO2018116112A1 (en) | 2016-12-22 | 2018-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
KR20220011128A (ko) | 2019-05-24 | 2022-01-27 | 에이에스엠엘 홀딩 엔.브이. | 리소그래피 장치, 기판 테이블 및 방법 |
EP3869272A1 (en) * | 2020-02-21 | 2021-08-25 | ASML Netherlands B.V. | Substrate table and method of handling a substrate |
WO2022078743A1 (en) * | 2020-10-16 | 2022-04-21 | Asml Netherlands B.V. | Object table, stage apparatus, holding method and lithographic apparatus |
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US20220082952A1 (en) | 2022-03-17 |
KR102456532B9 (ko) | 2024-07-31 |
US20200326635A1 (en) | 2020-10-15 |
JP2021503103A (ja) | 2021-02-04 |
KR102617775B1 (ko) | 2023-12-22 |
CN111406235A (zh) | 2020-07-10 |
KR20200067200A (ko) | 2020-06-11 |
KR102617775B9 (ko) | 2024-08-26 |
TWI714911B (zh) | 2021-01-01 |
EP3714329A1 (en) | 2020-09-30 |
NL2021871A (en) | 2019-05-22 |
KR102456532B1 (ko) | 2022-10-18 |
KR20220143173A (ko) | 2022-10-24 |
TW202243099A (zh) | 2022-11-01 |
JP2022145719A (ja) | 2022-10-04 |
US11187998B2 (en) | 2021-11-30 |
TWI760104B (zh) | 2022-04-01 |
TW201923959A (zh) | 2019-06-16 |
TWI815329B (zh) | 2023-09-11 |
JP7121122B2 (ja) | 2022-08-17 |
WO2019096554A1 (en) | 2019-05-23 |
TW202131446A (zh) | 2021-08-16 |
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