JP7495062B2 - 異方熱伝導性樹脂部材及び熱伝送基板 - Google Patents
異方熱伝導性樹脂部材及び熱伝送基板 Download PDFInfo
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- JP7495062B2 JP7495062B2 JP2020569698A JP2020569698A JP7495062B2 JP 7495062 B2 JP7495062 B2 JP 7495062B2 JP 2020569698 A JP2020569698 A JP 2020569698A JP 2020569698 A JP2020569698 A JP 2020569698A JP 7495062 B2 JP7495062 B2 JP 7495062B2
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- 229920005989 resin Polymers 0.000 title claims description 64
- 239000011347 resin Substances 0.000 title claims description 64
- 230000005540 biological transmission Effects 0.000 title claims description 27
- 239000000835 fiber Substances 0.000 claims description 117
- 239000000758 substrate Substances 0.000 claims description 20
- 229920005992 thermoplastic resin Polymers 0.000 claims description 19
- 238000005338 heat storage Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 229920006240 drawn fiber Polymers 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000004804 winding Methods 0.000 description 6
- 238000007380 fibre production Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
- D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
- D02G3/22—Yarns or threads characterised by constructional features, e.g. blending, filament/fibre
- D02G3/36—Cored or coated yarns or threads
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- D—TEXTILES; PAPER
- D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
- D02J—FINISHING OR DRESSING OF FILAMENTS, YARNS, THREADS, CORDS, ROPES OR THE LIKE
- D02J1/00—Modifying the structure or properties resulting from a particular structure; Modifying, retaining, or restoring the physical form or cross-sectional shape, e.g. by use of dies or squeeze rollers
- D02J1/22—Stretching or tensioning, shrinking or relaxing, e.g. by use of overfeed and underfeed apparatus, or preventing stretch
- D02J1/221—Preliminary treatments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2401/00—Physical properties
- D10B2401/04—Heat-responsive characteristics
- D10B2401/041—Heat-responsive characteristics thermoplastic; thermosetting
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (6)
- バンドル化された複数の熱可塑性樹脂の延伸ファイバを有する第一のファイバ群と、前記第一のファイバ群から分岐した第二のファイバ群及び第三のファイバ群と、を備え、
前記熱可塑性樹脂が、アクリルポリマー、メタクリルポリマー、ポリエチレンテレフタレート、ポリアリレート、ポリスルフォン、及びポリエーテルエーテルケトンからなる群より選ばれる少なくとも一種である、異方熱伝導性樹脂部材。 - 前記複数の熱可塑性樹脂の延伸ファイバが結合材によりバンドル化された、請求項1に記載の樹脂部材。
- 基板と、前記基板上に設けられた請求項1又は2に記載の異方熱伝導性樹脂部材と、を備える熱伝送基板。
- 前記異方熱伝導性樹脂部材と熱的に接続された蓄熱部材を更に備える、請求項3に記載の熱伝送基板。
- 基板と、前記基板上に設けられた異方熱伝導性樹脂部材と、前記異方熱伝導性樹脂部材と熱的に接続された断熱部材と、を備える熱伝送基板であって、
前記異方熱伝導性樹脂部材が、バンドル化された複数の熱可塑性樹脂の延伸ファイバを有する第一のファイバ群と、前記第一のファイバ群から分岐した第二のファイバ群及び第三のファイバ群と、を備える、熱伝送基板。 - 前記異方熱伝導性樹脂部材と熱的に接続された熱光変換部材を更に備える、請求項3~5のいずれか一項に記載の熱伝送基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2019014390 | 2019-01-30 | ||
JP2019014390 | 2019-01-30 | ||
PCT/JP2020/003265 WO2020158826A1 (ja) | 2019-01-30 | 2020-01-29 | 異方熱伝導性樹脂部材及び熱伝送基板 |
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JPWO2020158826A1 JPWO2020158826A1 (ja) | 2021-12-02 |
JP7495062B2 true JP7495062B2 (ja) | 2024-06-04 |
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US (1) | US20220089930A1 (ja) |
JP (1) | JP7495062B2 (ja) |
TW (1) | TWI831912B (ja) |
WO (1) | WO2020158826A1 (ja) |
Citations (8)
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JP2000151164A (ja) | 1998-11-10 | 2000-05-30 | Toshiba Corp | 電子機器 |
JP2002255100A (ja) | 2001-02-28 | 2002-09-11 | Mitsubishi Electric Corp | 人工衛星用熱伝導コネクタ |
JP2004225170A (ja) | 2003-01-20 | 2004-08-12 | Toyobo Co Ltd | 高機能性高耐熱熱伝導性有機繊維 |
JP2004285522A (ja) | 2003-03-24 | 2004-10-14 | Toyobo Co Ltd | 高熱伝導性耐熱有機繊維 |
WO2015190930A1 (en) | 2014-06-12 | 2015-12-17 | Olympic Holding B.V. | Thermal conductive high modules organic polymeric fibers |
WO2017141682A1 (ja) | 2016-02-16 | 2017-08-24 | ローム株式会社 | 熱光変換素子および熱電変換素子 |
CN206612256U (zh) | 2017-03-31 | 2017-11-07 | 常州信息职业技术学院 | 一种可发热日常用手套 |
WO2019168037A1 (ja) | 2018-03-01 | 2019-09-06 | 日立化成株式会社 | 異方熱伝導性樹脂ファイバ、異方熱伝導性樹脂部材及びそれらの製造方法 |
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JPH06214067A (ja) * | 1993-01-13 | 1994-08-05 | Hitachi Ltd | 冷却デバイス |
US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
US6286591B1 (en) * | 1999-11-08 | 2001-09-11 | Space Systems/Loral, Inc. | Thermal harness using thermal conductive fiber and polymer matrix material |
WO2004038759A2 (en) * | 2002-08-23 | 2004-05-06 | Dahm Jonathan S | Method and apparatus for using light emitting diodes |
KR102327141B1 (ko) * | 2014-11-19 | 2021-11-16 | 삼성전자주식회사 | 프리패키지 및 이를 사용한 반도체 패키지의 제조 방법 |
US11814568B2 (en) * | 2018-03-01 | 2023-11-14 | Resonac Corporation | Anisotropic thermal conductive resin member and manufacturing method thereof |
CN108684089A (zh) * | 2018-04-20 | 2018-10-19 | 江苏澳盛复合材料科技有限公司 | 一种加热板 |
KR102281515B1 (ko) * | 2019-07-23 | 2021-07-26 | 엘지전자 주식회사 | 개인화 언어 모델을 이용하여 사용자의 음성을 인식하는 인공 지능 장치 및 그 방법 |
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- 2020-01-29 US US17/422,440 patent/US20220089930A1/en active Pending
- 2020-01-29 WO PCT/JP2020/003265 patent/WO2020158826A1/ja active Application Filing
- 2020-01-29 JP JP2020569698A patent/JP7495062B2/ja active Active
- 2020-01-30 TW TW109102872A patent/TWI831912B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000151164A (ja) | 1998-11-10 | 2000-05-30 | Toshiba Corp | 電子機器 |
JP2002255100A (ja) | 2001-02-28 | 2002-09-11 | Mitsubishi Electric Corp | 人工衛星用熱伝導コネクタ |
JP2004225170A (ja) | 2003-01-20 | 2004-08-12 | Toyobo Co Ltd | 高機能性高耐熱熱伝導性有機繊維 |
JP2004285522A (ja) | 2003-03-24 | 2004-10-14 | Toyobo Co Ltd | 高熱伝導性耐熱有機繊維 |
WO2015190930A1 (en) | 2014-06-12 | 2015-12-17 | Olympic Holding B.V. | Thermal conductive high modules organic polymeric fibers |
WO2017141682A1 (ja) | 2016-02-16 | 2017-08-24 | ローム株式会社 | 熱光変換素子および熱電変換素子 |
CN206612256U (zh) | 2017-03-31 | 2017-11-07 | 常州信息职业技术学院 | 一种可发热日常用手套 |
WO2019168037A1 (ja) | 2018-03-01 | 2019-09-06 | 日立化成株式会社 | 異方熱伝導性樹脂ファイバ、異方熱伝導性樹脂部材及びそれらの製造方法 |
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TWI831912B (zh) | 2024-02-11 |
JPWO2020158826A1 (ja) | 2021-12-02 |
TW202040089A (zh) | 2020-11-01 |
WO2020158826A1 (ja) | 2020-08-06 |
US20220089930A1 (en) | 2022-03-24 |
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