CN108684089A - 一种加热板 - Google Patents
一种加热板 Download PDFInfo
- Publication number
- CN108684089A CN108684089A CN201810362795.9A CN201810362795A CN108684089A CN 108684089 A CN108684089 A CN 108684089A CN 201810362795 A CN201810362795 A CN 201810362795A CN 108684089 A CN108684089 A CN 108684089A
- Authority
- CN
- China
- Prior art keywords
- heating plate
- weight
- parts
- thermal diffusion
- carbon fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 84
- -1 polypropylene Polymers 0.000 claims abstract description 69
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 57
- 239000004917 carbon fiber Substances 0.000 claims abstract description 57
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000004743 Polypropylene Substances 0.000 claims abstract description 48
- 229920001155 polypropylene Polymers 0.000 claims abstract description 47
- 238000009792 diffusion process Methods 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 33
- 230000001070 adhesive effect Effects 0.000 claims abstract description 33
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 26
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 66
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 44
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 229920002554 vinyl polymer Polymers 0.000 claims description 8
- 239000000395 magnesium oxide Substances 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000004185 ester group Chemical group 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 230000014509 gene expression Effects 0.000 claims description 2
- 150000002978 peroxides Chemical class 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 150000001924 cycloalkanes Chemical class 0.000 claims 1
- 238000005187 foaming Methods 0.000 abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 abstract description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 150000001451 organic peroxides Chemical class 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 6
- 239000011324 bead Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004088 foaming agent Substances 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000002738 chelating agent Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- UJXFNIQSAHCTTA-UHFFFAOYSA-N 1-butylperoxyhexane Chemical class CCCCCCOOCCCC UJXFNIQSAHCTTA-UHFFFAOYSA-N 0.000 description 2
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- DQMUQFUTDWISTM-UHFFFAOYSA-N O.[O-2].[Fe+2].[Fe+2].[O-2] Chemical compound O.[O-2].[Fe+2].[Fe+2].[O-2] DQMUQFUTDWISTM-UHFFFAOYSA-N 0.000 description 2
- JSRFLPZZQPDXMO-UHFFFAOYSA-N OCCC[Si](OC)(OC)C.C(CN)N Chemical compound OCCC[Si](OC)(OC)C.C(CN)N JSRFLPZZQPDXMO-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229910000464 lead oxide Inorganic materials 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- GBMDVOWEEQVZKZ-UHFFFAOYSA-N methanol;hydrate Chemical class O.OC GBMDVOWEEQVZKZ-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- PMAAOHONJPSASX-UHFFFAOYSA-N 2-butylperoxypropan-2-ylbenzene Chemical group CCCCOOC(C)(C)C1=CC=CC=C1 PMAAOHONJPSASX-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- MWICEJNAECYTMS-UHFFFAOYSA-N [3-(2,4-dimethyl-3-phenylpentan-3-yl)peroxy-2,4-dimethylpentan-3-yl]benzene Chemical compound C(C)(C)C(C1=CC=CC=C1)(C(C)C)OOC(C1=CC=CC=C1)(C(C)C)C(C)C MWICEJNAECYTMS-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920013822 aminosilicone Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 125000001891 dimethoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Substances OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000009955 starching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
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Abstract
本发明涉及加热装置领域,具体涉及一种加热板,具有发泡聚丙烯层、热扩散层,以及设置在发泡聚丙烯层和热扩散层中的碳纤维发热电缆,所述碳纤维发热电缆表面包覆有绝缘层,所述绝缘层通过导热型胶粘剂粘结在热扩散层的内表面。绝缘层由以下重量份物质组成:交联聚丙烯树脂100重量份,金属氧化物I 20~40重量份;热扩散层由以下重量份物质组成:聚丙烯100重量份,短切碳纤维10~40重量份,金属氧化物II 20~40重量份。本发明的加热板采用高性能碳纤维为发热体,工作状态下不会被氧化,发泡层的热传导系数低,保证了热量最大限度的流向热扩散层,有利于节约能源,加热板主体材料是聚丙烯,价格便宜,具有良好的实用性。
Description
技术领域
本发明涉及加热装置领域,具体涉及一种加热板。
技术背景
碳纤维是导电性、导热性良好的非金属材料,而且力学性能优异,具有很高的拉伸强度和模量,不会断裂和破损。此外,碳纤维还具有很好的化学惰性、耐高温腐蚀,能保持良好化学的稳定性。
碳纤维已被用于加热板的电缆。中国专利CN201110001466.X公开了一种碳纤维电加热板,由碳纤维发热电缆、导热层、铝镁合金框体、电接点、保温层、散热板构成。铝镁合金框体的存在导致电加热板质量大、笨重,不利于搬运,同时铝镁合金框体具有很好的导电性,易出现漏电触电等危险。
所以,需要一种加热板,具有质量轻、热传导率高、加热效率高、绝缘性好、安全等特点。
发明内容
为了解决上述问题,本发明提供了一种加热板,具有发泡聚丙烯层、热扩散层,以及设置在两层中的碳纤维发热电缆。
其中,碳纤维发热电缆是发热元件,通过通电产生热量,起到加热作用。碳纤维发热电缆由碳纤维及包覆在碳纤维表面的绝缘层构成。碳纤维是由聚丙烯腈、沥青、酚醛、黏胶等原料经过纺丝、氧化、碳化和上浆制成,包含有碳纤维丝、碳纤维束、短切碳纤维、碳纤维布等各种形式产品。绝缘层由绝缘高导热耐热材料制成,包裹在碳纤维的表面既能防止漏电等安全问题,又能保证足够的热传导率,保证电加热板的加热工作效率。
热传导率为单位截面、长度的材料在单位温差下和单位时间内直接传导的热量。
进一步的,所述绝缘层含有交联聚丙烯树脂100重量份,金属氧化物I 20~40重量份。
聚丙烯材料具有很好的加工性能,耐高温腐蚀。同时聚丙烯发泡材料质量轻、热传导率低、绝缘性好、粘结性强、价格低廉,广泛用于日用品、包装、工业、农业、交通运输业、军事工业、航天工业等领域。
其中,交联聚丙烯树脂由聚丙烯树脂与有机过氧化物反应交联制成。交联的聚丙烯树脂具有很好的力学性能(强度和韧性)和优异的耐候性、耐高温、绝缘性和耐溶解腐蚀性,包裹碳纤维的表面防止漏电等安全问题。
其中,有机过氧化物是指含有过氧键的有机化合物,可以是二烷基过氧化物、烷基过氧化氢、酰基过氧化物、烷基过氧酸及过氧酸酯等,如二特丁基过氧化物、二异丙苯基过氧化物、特丁过氧化苯甲酸酯、特丁基异丙苯基过氧化物、双特丁基过氧化间异丙基苯、2,5-二甲基-2,5-双特丁过氧化己烷。优选为二异丙苯基过氧化物、特丁基异丙苯基过氧化物、双特丁基过氧化间异丙基苯、2,5-二甲基-2,5-双特丁过氧化己烷中的一种或多种。以交联聚丙烯树脂为100重量份计,有机过氧化物交联剂为0.1~10重量份,优选为1~8重量份。
绝缘层中的金属氧化物I为本领域已知的金属氧化物,本身具有很高的热传导率,可以提高绝缘层的热传导率,提高导热板工作效率。金属氧化物可列举如,氧化镁、氧化钙、氧化铝、三氧化二铁、氧化亚铁、氧化铜、氧化锌、氧化铅等;优选为氧化铝。氧化铝可以是颗粒状、粉末状、片状、针状等形状,优选为片状氧化铝。相比于其它形状的氧化铝,片状氧化铝更能好的提高热传导率。为了进一步保证绝缘层的高热传导率和导热均匀性,氧化铝的数均粒径优选小于 100μm,长厚比在10~50之间,更优选,数均粒径小于50μm,长厚比在20~40之间。数均粒径可以用激光粒度仪测定。长厚比通过显微观察测量和统计。
以交联聚丙烯树脂100重量份计,绝缘层中金属氧化物I含量为 20~40重量份。含量小于20重量份,绝缘层的热传导率太小,加热板效率太低;含量大于40重量份,绝缘层的力学性能变差,耐候性和耐溶剂腐蚀性能不够,存在安全隐患,并且金属环氧化合物在绝缘层的分散的均一性变差,影响其导热效果,优选为25~35重量份。
进一步的,所述的片状氧化铝表面经过硅烷偶联剂处理。可以提高交联的聚丙烯树脂与无机片状氧化铝的相容性,让氧化铝在树脂中分散地更加均匀,使绝缘层具有均匀的热传导率,不会出现局部过热现象而烧坏绝缘层,引起火灾或漏电隐患。
其中,硅烷偶联剂可以是已知的任何一种硅烷偶联剂,具体举例如氨丙基三乙氧基硅烷,缩水甘油迷氧基丙基三甲氧基硅烷,甲基丙烯酰氧基丙基三甲氧基硅烷,乙烯基三乙氧基硅烷,乙烯基三乙氧基硅烷,巯丙基三甲(乙)氧基硅烷,乙二胺丙基三乙氧基硅烷,乙二胺丙基甲基二甲氧基硅烷中的一种或多种。优选为式1所示的硅烷偶联剂,具有此结构的硅烷偶联剂尤其适合于片状氧化铝。
其中:R1、R2、R3或R4表示含1~8个碳原子的烷基;X表示含1~18个碳原子的烷基、环烷基、芳基、杂环芳基、乙烯基或醚基,优选为芳基、杂环芳基、乙烯基或醚基;Y表示含有环氧基、丙烯酰氧基、氨基、巯基、酯基、脲基、氨基甲酸酯基或杂环烷烃的基团,优选为环氧基、丙烯酰氧基、酯基、脲基和氨基甲酸酯基;m表示1~ 9中的任意一个整数;n表示1~4中的任意一个整数,优选的,m: n=1~3:3~1。式1所示的硅烷偶联剂除了可以提高交联的聚丙烯树脂与无机片状氧化铝的相容性,还可以提高绝缘层的韧性,不易破损断裂。
式1所示的硅烷偶联剂可以通过以下方式制备:将不同种类的三甲氧基硅烷偶联剂,在氮气保护下混合均匀后,在0℃下缓慢滴加 108ml甲醇-水(体积比1:1)混合溶液,控制反应温度维持在0℃左右,滴加完毕后,继续搅拌0.5h后,升温到70℃,继续反应1h后,蒸除溶剂后制得。
进一步的,所述绝缘层的绝缘体积电阻率在1kV、20℃条件下≥ 1×1016Ω·cm。
其中,体积电阻率为在一定温度下,材料中的直流电场强度与稳态电流密度之商。确保加热板在使用过程中不会出现漏电等安全隐患。优选的绝缘层的绝缘体积电阻率在1kV、20℃条件下≥1×1017Ω·cm。
热扩散层使将碳纤维发热电缆产生的热量扩散开,起到均匀加热的作用,具有均匀优异的热传导率。
进一步的,所述的热扩散层含有以下成分:聚丙烯100重量份,短切碳纤维10~40重量份,金属氧化物II 20~40重量份。
其中,聚丙烯是热扩散层的基体,和碳纤维发热电缆有很好的相容性和粘结性,并具有很好的绝缘性和耐热性。
短切碳纤维具有很高的力学强度及模量和导热性,可以增强热扩散层的拉伸性能和热传导率。
金属氧化物具有很高的导热性,能进一步提高热扩散层的热传导率。
为了保证热扩散层具有足够的强度、韧性和热传导率,以热扩散层中聚丙烯含量100重量份计,短切碳纤维10~40重量份,金属氧化物20~40重量份。两者的含量太低,热扩散层的强度不够,热传导率不足;两者的含量太高,热扩散层的韧性不足,热传导均一性太差,容易引起局部过热而造成安全隐患。优选的,短切碳纤维20~30重量份,金属氧化物II25~35重量份。
金属氧化物可列举如,氧化镁、氧化钙、氧化铝、三氧化二铁、氧化亚铁、氧化铜、氧化锌、氧化铅等;优选为氧化铝。氧化铝可以是颗粒状、粉末状、片状、针状等形状,优选为针状氧化铝。如前文所述,片状氧化铝的更能好的提高热传导率,但是使用片状氧化铝后,材料的导热均匀性不如针状氧化铝。
为了保证热扩散层的高热传导率和导热均匀性,氧化铝的数均粒径优选小于100μm,长径比在10~50之间,更优选,数均粒径小于 50μm,长径比在20~40之间。数均粒径可以用激光粒度仪测定。长径比通过显微观察测量和统计。
进一步的,所述的针状氧化铝的表面经过硅烷偶联剂处理。可以提高聚丙烯树脂与氧化铝的相容性,让氧化铝在树脂中分散地更加均匀,使绝缘层具有均匀的热传导率,不会出现局部过热现象而烧坏绝缘层,引起火灾或漏电隐患。
其中,硅烷偶联剂可以是已知的任何一种硅烷偶联剂,具体举例如氨丙基三乙氧基硅烷,缩水甘油迷氧基丙基三甲氧基硅烷,甲基丙烯酰氧基丙基三甲氧基硅烷,乙烯基三乙氧基硅烷,乙烯基三乙氧基硅烷,巯丙基三甲(乙)氧基硅烷,乙二胺丙基三乙氧基硅烷,乙二胺丙基甲基二甲氧基硅烷中的一种或多种。优选为式2所示的硅烷偶联剂,具有此结构的硅烷偶联剂尤其适合于针状氧化铝。
其中,R是三甲氧基、三乙氧基、乙氧基二甲氧基、甲氧基二乙氧基中的一种或多种,优选为三甲氧基。式2所示的硅烷偶联剂可以提高热扩散层的介电性能、力学性能、耐辐射性、耐燃性和耐磨性。
式2所示的硅烷偶联剂可以用以下方法制备,包括下述的步骤:
1、将氨基硅烷与邻苯二甲酸混合,加入有机溶剂,混合搅拌;
2、向上述的混合液中加入强酸,反应得硅烷偶联剂。
上述的混合液反应的温度为90~100℃,混合液的反应时间为3~7 小时。氨基硅烷为3-氨基丙基-三甲氧基硅烷、3-氨基丙基-三乙氧基硅烷、3-氨基丙基-甲氧基-二乙氧基硅烷和3-氨基丙基-乙氧基-二甲氧基硅烷中的一种或多种。有机溶剂为甲苯、二甲苯、无水甲醇、无水乙醇中的至少一种,添加量为氨基硅烷与邻苯二甲酸总体积的 0.2~1。强酸为浓硫酸、浓硝酸、浓磷酸中的一种或几种混合酸,添加量为氨基硅烷与邻苯二甲酸总体积的0.1~0.5。
进一步的,上述金属氧化物表面硅烷偶联剂处理的具体方法是已知的任何一种方法。举例如:将金属氧化物加入硅烷偶联剂的乙醇溶液中混合均匀,然后离心过滤烘干即可。
其中硅烷偶联剂的质量为金属氧化物的0.5~5%,优选为1~3%。
进一步的,所述的热扩散层的热传导率高于0.8W/m·K,优选的,热扩散层的热传导率高于1W/m·K。
进一步的,所述的碳纤维发热电缆通过导热型胶粘剂连接粘结在热扩散层的表面上。
其中,导热型胶黏剂有胶黏剂和导热填料组成。所述导热填料为氧化铝、氧化镁、氧化锌、氮化铝、氮化硼、碳化硅、二氧化硅、氢氧化铝、氢氧化镁中的至少一种,优选为块状和/或针型的氧化铝。所述的胶黏剂为已知的任何一种胶黏剂具体如聚丙烯酸胶黏剂、环氧胶黏剂、聚氨酯胶黏剂、聚醋酸乙烯胶黏剂、聚酰胺胶黏剂等,为了提高碳纤维发热电缆和热扩散层的粘结性,优选为聚丙烯热熔胶。
导热型胶黏剂可以选择按如下方法制备:
1、将导热填料与螯合剂EDTA-2Na水溶液(EDTA-2Na质量分数为0.01~0.5%)加热到60~70℃螯合,再加入硅烷偶联剂(硅烷偶联剂质量为填料的0.5~5%)中搅拌混合均匀,过滤烘干粉碎。
2、将胶黏剂和填料(质量为胶黏剂的1~5倍)充分混合均匀,抽真空,再常温下加入固化剂(质量为胶黏剂的0.1~10%)即可。固化剂根据胶黏剂的种类选择,可以是有机过氧化物、胺类、羧酸等。进一步的,所述的导热型胶粘剂的热传导率高于0.8W/m·K,优选的,导热型胶粘剂的热传导率高于1W/m·K。
发泡聚丙烯层是由发泡聚丙烯加工而成。发泡聚丙烯由聚丙烯树脂与发泡剂、交联剂等试剂混合均匀,在一定温度和压力下按照已知方法发泡制得。发泡时的温度和压强根据发泡剂和交联剂等试剂的种类确定。发泡剂和交联剂的为该领域的任何已知的发泡剂和交联剂。交联剂优选有机过氧化物。发泡剂可以是物理发泡剂、化学发泡剂,具体如正己烷、正戊烷、正庚烷、碳酸钙、碳酸镁、碳酸氢钠等。
发泡聚丙烯层具有很低的热传导率,保证热量能通过热扩散层传递给待加热物体,提高加热板的效率。
进一步的,所述的发泡聚丙烯层的厚度为5~30mm,热传导率小于0.1W/m·K。发泡聚丙烯层的厚度小于5mm,发泡聚丙烯层的隔热效果不好,影响加热板正面的加热效率;发泡聚丙烯层的厚度大于 30mm,虽然可以提高绝热效果,但影响产品的轻巧化并浪费材料。更优选发泡聚丙烯层的厚度为10~20mm,热传导率小于0.07W/m·K。
进一步的,加热板中热扩散层的厚度为5~10mm,碳纤维发热电缆中碳纤维丝束的厚度为0.5~2mm,绝缘层的厚度为1~4mm。
进一步的,所述的加热板还含有表面装饰层,设置于热扩散层的外表面。表面装饰层可以通过印刷、涂覆等已知方式设置在热扩散层表面。
进一步的,本发明加热板可以按照如下的制备方法制得:
1、将聚丙烯树脂、有机过氧化物和金属氧化物I按照配比在挤出机中共混,并将其挤出到碳纤维发热电缆的外周,得到包覆了绝缘层的碳纤维发热电缆;
2、将聚丙烯树脂、金属氧化物II和短切碳纤维按照配比混合均匀,再通过挤出机挤出制备出热扩散层;
3、用胶黏剂将碳纤维发热电缆粘结到热扩散层上;
4、将发泡聚丙烯层复合到热扩散层粘有碳纤维发热电缆的一面,即可制得本发明加热板。
本发明的有益效果:
1、本发明的加热板采用高性能碳纤维为发热体,工作状态下不会被氧化,可以保持长达50年以上的寿命。
2、碳纤维发热电缆与热扩散层通过导热型胶粘剂粘结,保证电缆和热扩散层具有很高的热传导率。同时发泡层的热传导系数低,保证了热量最大限度的流向热扩散层,有利于节约能源。
3、热扩散层的热传导系数高,加热板的热扩散层一面的升温速度快。
4、本发明的加热板主体材料是聚丙烯,在保持良好性能的同时,价格便宜,具有良好的实用性。
附图说明
图1为本发明加热板的结构示意图。
图2为碳纤维发热电缆在加热板中的排列方式示意图。
具体实施方式
本发明的测试项目及其测试方法:
加热板上表面温度及其均匀性:将按照实施例中原料制作好的样品在25℃、50%RH的环境中,对碳纤维发热电缆施加100mA的直流电3小时。分别沿加热板的宽度和长度方向划分5等分,形成25 个区域。使用红外线测温枪测量每个区域的上表面(或下表面)温度。取其平均值作为上表面(或下表面)的温度,用其标准偏差衡量温度均匀性。
热传导率:按照GB/T 3139-2005进行。
体积电阻率:按照GB/T 1410-2006进行。
实施例和对比例所用原料:
发泡聚丙烯
A1:古河电气工业株式会社产,厚度为5mm,密度0.46g/cm3,热传导率为0.09W/m·K。
A2:古河电气工业株式会社产,厚度为15mm,密度0.23g/cm3,热传导率为0.05W/m·K。
聚丙烯
B:燕山石化产B205,密度0.91g/cm3,熔体流动速率1.0g/10min,热变形温度105℃。
短切碳纤维
C:日本东丽株式会社产,T008-003,热传导率为10W/m·K。
金属氧化物
D1:粉末状氧化镁:上海攀田粉体材料有限公司产,粒径1μm。
D2:片状氧化铝:河合石灰工业株式会社产,型号BMF,平均粒径5μm,长度/厚度比25。
D3:针状氧化铝:河合石灰工业株式会社产,型号BMI,平均粒径6μm,长径比40。
碳纤维发热电缆
E:碳纤维丝,由日本东丽株式会社产T300-6k编织而成,厚度 1mm。
有机过氧化物
F:二特丁基过氧化物,124℃时的半衰期是10小时,186℃时的半衰期为1min。
硅烷偶联剂
G1:乙烯基三乙氧硅烷,美岚实业(上海)有限公司产。
G2:式1所示的硅烷偶联剂,式中X为甲基,Y为1,2-乙二胺基,m:n为3:1;制备方法如下:在装有冷凝器、温度计的1L三口烧瓶中投入1.0molN-(β-氨乙基)-γ-氨丙基三甲氧基硅烷和3.0mol甲基三甲氧基硅烷,在氮气保护下混合均匀后,室温下缓慢滴加108ml甲醇/水(体积比为1:1)混合溶液,控制反应温度维持在25℃左右,滴加完毕后,继续搅拌0.5h后,升温到70℃,继续反应1h后,蒸除溶剂后制得。
G3:式1所示的硅烷偶联剂,式中X为苯基,Y为3-2,3-环氧丙氧基,m:n为1:3;制备方法如下:在装有冷凝器、温度计的1L三口烧瓶中投入3.0mol3-(2,3-环氧丙氧)丙基三甲氧基硅烷和1.0mol苯基三甲氧基硅烷,在氮气保护下混合均匀后,室温下缓慢滴加108ml甲醇/水(体积比为1:1)混合溶液,控制反应温度维持在25℃左右,滴加完毕后,继续搅拌0.5h后,升温到70℃,继续反应1h后,蒸除溶剂后制得。
G4:式2所示的硅烷偶联剂,R是三甲氧基;制备方法如下:在一个装有机械搅拌,温度计和回流冷凝管的100mL三颈瓶中加入 20mL(3-氨基丙基)三甲氧基硅烷,5mL邻苯二甲酸,10mL无水甲醇,于60℃混合搅拌30分钟。然后加入5mL的浓硫酸,90℃下反应 3小时,然后精制得耐高温硅烷偶联剂。
G5:式2所示的硅烷偶联剂,R是三乙氧基;制备方法如下:在一个装有机械搅拌,温度计和回流冷凝管的100mL三颈瓶中加入 20mL(3-氨基丙基)三乙氧基硅烷,5mL邻苯二甲酸,10mL无水甲醇,于60℃混合搅拌30分钟。然后加入5mL的浓硫酸,90℃下反应3小时,然后精制得耐高温硅烷偶联剂。
胶黏剂
H1:丙烯酸胶黏剂:杭州得力科技股份有限公司产,型号DL5381,热传导率为0.34W/m·K。
H2:导热型环氧胶黏剂,热传导率为1.02W/m·K,制备方法如下:
1、将氧化镁D1与螯合剂EDTA-2Na水溶液(EDTA-2Na质量分数为0.5%)加热到60℃螯合30min,再加入硅烷偶联剂乙烯基三乙氧硅烷(硅烷偶联剂质量为填料的1%)中搅拌30min混合均匀,过滤烘干粉碎。
2、将双酚A环氧树脂和1中的氧化镁填料(质量为胶黏剂的2 倍)充分混合均匀,抽真空,再常温下加入乙二胺(质量为胶黏剂的 10%)即可。
H3:导热型聚丙烯胶黏剂,热传导率为1.20W/m·K,制备方法如下:
1、将片状氧化铝D2与螯合剂EDTA-2Na水溶液(EDTA-2Na 质量分数为0.5%)加热到60℃螯合30min,再加入硅烷偶联剂G2(硅烷偶联剂质量为填料的1%)中搅拌30min混合均匀,过滤烘干粉碎。
2、再将聚丙烯酸甲酯和1中片状氧化铝填料(质量为胶黏剂的 2倍)充分混合均匀,抽真空,常温下加入二特丁基过氧化物(质量为胶黏剂的10%)即可。
实施例1~14
加热板的制作步骤如下:
1、按照表1的配方将聚丙烯树脂、有机过氧化物和金属氧化物按照配比在挤出机中共混,并将其挤出到碳纤维长丝E的外周,得到包覆了如表3所示的绝缘层的碳纤维发热电缆;
2、按照表2的配方将聚丙烯树脂、金属氧化物和短切碳纤维按照配比混合均匀,再通过挤出机挤出制备出长×宽为100×80mm,厚度如表3所示的热扩散层;
3、用表3所示的胶黏剂将步骤1得到的相应碳纤维发热电缆按附图2所示的U型排列方式(碳纤维发热电缆沿平行于宽度方向排列,相邻电缆间距为电缆宽度的5倍)粘结到相应的热扩散层上;
4、用表3所示的发泡聚丙烯,机械加工得到长×宽=1000mm× 800mm的发泡聚丙烯层,并复合到步骤3得到的热扩散层粘有碳纤维发热电缆的一面,即可制得本发明加热板。
金属氧化物还经过表面硅烷偶联剂处理,具体处理方法为将是金属氧化物加入硅烷偶联剂的乙醇溶液中混合均匀,然后离心过滤烘干即可。其中硅烷偶联剂的质量与金属氧化物的质量比如表1和表2所示。
表1:绝缘层配方,其中,“-”表示不含有硅烷偶联剂。
表2:热扩散层原料和配方,其中,“-”表示不含有硅烷偶联剂。
表3:碳纤维发热电缆原料和配方,其中,“-”表示不含有硅烷偶联剂。
实施例15~28
在实施例14的基础上,改变硅烷偶联剂的种类和含量,其他的保持不变,制备出加热板,硅烷偶联剂的种类和含量的如表4所示。
表4以实施例14为基础,改变的硅烷偶联剂的种类和含量;其中,“-”表示不含有硅烷偶联剂。
对比例1
1、将聚丙烯B用挤出机挤出得到制备出长×宽为1000mm× 800mm,厚度为5mm的2块聚丙烯板。
2、用胶黏剂H1将碳纤维长丝E按照附图2的U型排列方式(碳纤维发热电缆主要沿平行于宽度方向排列,相邻间距为电缆宽度的5 倍)粘在其中一块聚丙烯板上。
3、将另一块聚丙烯板复合到上述聚丙烯板粘有碳纤维发热电缆的一面,即可制得加热板。
对比例2
1、将聚丙烯B用挤出机挤出得到制备出长×宽=1000mm× 800mm,厚度为5mm的聚丙烯板。
2、用胶黏剂H1将碳纤维长丝E按照附图2的U型排列方式(碳纤维发热电缆主要沿平行于宽度方向排列,相邻间距为电缆宽度的5 倍)粘在聚丙烯板上。
3、将长×宽为1000mm×800mm,厚为5mm的聚乙烯发泡板(上海先优新材料科技有限公司产,热传导率为0.035W/m·K)复合到聚丙烯板粘有碳纤维发热电缆的一面,即可制得加热板。
对实施例和对比例的加热板样品进行导热性能及其均匀性测试测试结果如表5所示。
表5加热板样品进行导热性能及其均匀性测试测试结果
从表1可以看出,本发明的加热板具有很好的加热效果,传热效率高,节约能源。并且传热均匀,不会因为出现局部过热,影响加热板的使用体验和使用寿命。加热板材料耐高温性能优越,力学性能好,使用寿命长。
对比例1的加热板上下表面温度相差不大,热量利用率低,浪费能源并且不易操作。对比例2的加热板中聚乙烯板耐热性较差,且力学强度不够,不具备很好的实用效果。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此。任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (10)
1.一种加热板,其特征在于,具有发泡聚丙烯层、热扩散层,以及设置在发泡聚丙烯层和热扩散层中的碳纤维发热电缆,所述碳纤维发热电缆表面包覆有绝缘层,所述绝缘层通过导热型胶粘剂粘结在热扩散层的内表面。
2.根据权利要求1所述的加热板,其特征在于,所述发泡聚丙烯层的厚度为5~30mm,热传导率小于0.1 W/m・K。
3.根据权利要求1所述的加热板,其特征在于,所述热扩散层的热传导率高于0.8 W/m・K。
4.根据权利要求1所述的加热板,其特征在于,所述导热型胶粘剂选自聚丙烯热熔胶、导热型环氧胶黏剂和导热型聚丙烯胶黏剂中的任意一种,导热型胶粘剂热传导率高于0.8W/m・K。
5.根据权利要求1所述的加热板,其特征在于,所述碳纤维发热电缆表面包覆的绝缘层由以下重量份物质组成:
交联聚丙烯树脂100重量份;
金属氧化物I 20~40重量份。
6.根据权利要求5所述的加热板,其特征在于,所述交联聚丙烯树脂由聚丙烯树脂与有机过氧化物反应交联制成,所述金属氧化物I选自粉末状氧化镁或片状氧化铝,所述片状氧化铝表面经过硅烷偶联剂I处理。
7.根据权利要求6所述的加热板,其特征在于,所述硅烷偶联剂I为具有如下式1结构的硅烷偶联剂:
式1,
其中:R1、R2、R3或R4表示含1~8个碳原子的烷基;X表示含1~18个碳原子的烷基、环烷基、芳基、杂环芳基、乙烯基或醚基,优选为芳基、杂环芳基、乙烯基或醚基;Y表示含有环氧基、丙烯酰氧基、氨基、巯基、酯基、脲基、氨基甲酸酯基或杂环烷烃的基团,优选为环氧基、丙烯酰氧基、酯基、脲基和氨基甲酸酯基;m表示1~9中的任意一个整数;n表示1~4中的任意一个整数。
8.根据权利要求1所述的加热板,其特征在于,所述热扩散层由以下重量份物质组成:
聚丙烯100重量份;
短切碳纤维10~40重量份;
金属氧化物II 20~40重量份。
9.根据权利要求8所述的加热板,其特征在于,所述金属氧化物II选自粉末状氧化镁或针状氧化铝,所述针状氧化铝表面经过硅烷偶联剂II处理。
10.根据权利要求9所述的加热板,其特征在于,所述硅烷偶联剂II为具有如下式2结构的硅烷偶联剂:
式2,
其中,R是三甲氧基、三乙氧基、乙氧基二甲氧基、甲氧基二乙氧基中的一种或多种,优选为三甲氧基。
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