JP7494913B2 - 吸着パッド - Google Patents
吸着パッド Download PDFInfo
- Publication number
- JP7494913B2 JP7494913B2 JP2022539807A JP2022539807A JP7494913B2 JP 7494913 B2 JP7494913 B2 JP 7494913B2 JP 2022539807 A JP2022539807 A JP 2022539807A JP 2022539807 A JP2022539807 A JP 2022539807A JP 7494913 B2 JP7494913 B2 JP 7494913B2
- Authority
- JP
- Japan
- Prior art keywords
- plate material
- suction
- foaming member
- suction pad
- skirt portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011521 glass Substances 0.000 claims description 72
- 238000005187 foaming Methods 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 45
- 230000005489 elastic deformation Effects 0.000 claims description 10
- 239000006260 foam Substances 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 8
- 238000000926 separation method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Manipulator (AREA)
Description
2 吸着パッド
3 真空ポンプ
4 パッド本体
5 第一発泡部材
5a 当接面
6 排気口
7 スカート部
7a 先端部
8 配管
9 外縁部
10 中心部
11 排気孔
12 貫通孔
13 第二発泡部材
G ガラス板
Ga 表面
S 気密空間
Claims (6)
- 板材を吸着する吸着パッドであって、
前記板材との間に気密空間を形成するパッド本体と、前記気密空間内に配置されて前記板材と接触する第一発泡部材と、を備え、
前記パッド本体は、前記気密空間内の気体を排出するための排気口と、前記第一発泡部材の外縁部の外側で前記板材と接触するスカート部と、を備え、
前記スカート部は、内側から外側に向かって漸次厚みが薄くなる円錐状であり、
前記スカート部は、前記第一発泡部材の外縁部を覆うとともに、
前記スカート部の先端部は、前記第一発泡部材の外縁部から吸引方向の反対側に食み出しており、
前記第一発泡部材の外縁部は、内側から外側に向かって漸次薄くなっており、
前記スカート部は、前記板材との接触により前記板材の表面に倣って反るように弾性変形可能であり、かつ、前記弾性変形の復元力により前記板材から分離可能であることを特徴とする吸着パッド。 - 前記第一発泡部材の外縁部は、前記第一発泡部材の外縁部の内側の中心部よりも厚みが薄いことを特徴とする請求項1に記載の吸着パッド。
- 前記第一発泡部材は、前記排気口から前記板材に向かって厚み方向に貫通した排気孔を有することを特徴とする請求項1又は2に記載の吸着パッド。
- 前記排気口の内壁が、第二発泡部材で構成されていることを特徴とする請求項3に記載の吸着パッド。
- 前記排気口の内径が、30mm以下であることを特徴とする請求項1~4のいずれか1項に記載の吸着パッド。
- 前記板材が、ガラス板であることを特徴とする請求項1~5のいずれか1項に記載の吸着パッド。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/028720 WO2022024186A1 (ja) | 2020-07-27 | 2020-07-27 | 吸着パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022024186A1 JPWO2022024186A1 (ja) | 2022-02-03 |
JP7494913B2 true JP7494913B2 (ja) | 2024-06-04 |
Family
ID=80037824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022539807A Active JP7494913B2 (ja) | 2020-07-27 | 2020-07-27 | 吸着パッド |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7494913B2 (ja) |
KR (1) | KR20230041717A (ja) |
CN (1) | CN115867415A (ja) |
WO (1) | WO2022024186A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100555726B1 (ko) | 2005-01-11 | 2006-03-03 | 세크론 주식회사 | 반도체 패키지 흡착용 진공패드 |
JP2006089235A (ja) | 2004-09-24 | 2006-04-06 | Kao Corp | 物品の移動装置 |
JP2006142441A (ja) | 2004-11-22 | 2006-06-08 | Koganei Corp | 真空吸着具 |
JP2008238306A (ja) | 2007-03-26 | 2008-10-09 | Stella Giken Kk | 真空吸着パッド |
JP2012110982A (ja) | 2010-11-22 | 2012-06-14 | Smc Corp | 真空吸着装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187143U (ja) * | 1984-05-23 | 1985-12-11 | 丸山 一郎 | 吸着具 |
-
2020
- 2020-07-27 KR KR1020237003339A patent/KR20230041717A/ko unknown
- 2020-07-27 CN CN202080102624.8A patent/CN115867415A/zh active Pending
- 2020-07-27 JP JP2022539807A patent/JP7494913B2/ja active Active
- 2020-07-27 WO PCT/JP2020/028720 patent/WO2022024186A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006089235A (ja) | 2004-09-24 | 2006-04-06 | Kao Corp | 物品の移動装置 |
JP2006142441A (ja) | 2004-11-22 | 2006-06-08 | Koganei Corp | 真空吸着具 |
KR100555726B1 (ko) | 2005-01-11 | 2006-03-03 | 세크론 주식회사 | 반도체 패키지 흡착용 진공패드 |
JP2008238306A (ja) | 2007-03-26 | 2008-10-09 | Stella Giken Kk | 真空吸着パッド |
JP2012110982A (ja) | 2010-11-22 | 2012-06-14 | Smc Corp | 真空吸着装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2022024186A1 (ja) | 2022-02-03 |
WO2022024186A1 (ja) | 2022-02-03 |
CN115867415A (zh) | 2023-03-28 |
KR20230041717A (ko) | 2023-03-24 |
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