JP7465805B2 - 金属化フィルム - Google Patents
金属化フィルム Download PDFInfo
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- JP7465805B2 JP7465805B2 JP2020532931A JP2020532931A JP7465805B2 JP 7465805 B2 JP7465805 B2 JP 7465805B2 JP 2020532931 A JP2020532931 A JP 2020532931A JP 2020532931 A JP2020532931 A JP 2020532931A JP 7465805 B2 JP7465805 B2 JP 7465805B2
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- Prior art keywords
- metallized film
- film
- silicon
- metal
- protective layer
- Prior art date
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- 239000011104 metalized film Substances 0.000 title claims description 107
- 229910052751 metal Inorganic materials 0.000 claims description 105
- 239000002184 metal Substances 0.000 claims description 105
- 239000011241 protective layer Substances 0.000 claims description 68
- 239000010410 layer Substances 0.000 claims description 66
- 239000010408 film Substances 0.000 claims description 51
- 229910052782 aluminium Inorganic materials 0.000 claims description 45
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 45
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 41
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 39
- 239000011701 zinc Substances 0.000 claims description 38
- -1 polysiloxane Polymers 0.000 claims description 33
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 31
- 229910052725 zinc Inorganic materials 0.000 claims description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 25
- 229910052760 oxygen Inorganic materials 0.000 claims description 25
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 22
- 239000011737 fluorine Substances 0.000 claims description 22
- 229910052731 fluorine Inorganic materials 0.000 claims description 22
- 229920001296 polysiloxane Polymers 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 19
- 238000011282 treatment Methods 0.000 claims description 18
- 238000004458 analytical method Methods 0.000 claims description 11
- 239000010702 perfluoropolyether Substances 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 claims description 8
- 238000002042 time-of-flight secondary ion mass spectrometry Methods 0.000 claims description 8
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 230000033558 biomineral tissue development Effects 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
- 239000002033 PVDF binder Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 150000008064 anhydrides Chemical group 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 58
- 238000000034 method Methods 0.000 description 35
- 239000000463 material Substances 0.000 description 22
- 238000009832 plasma treatment Methods 0.000 description 16
- 239000002210 silicon-based material Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 12
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 11
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 229910001882 dioxygen Inorganic materials 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 238000009826 distribution Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 150000003376 silicon Chemical class 0.000 description 6
- 238000010998 test method Methods 0.000 description 6
- 208000027418 Wounds and injury Diseases 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000005211 surface analysis Methods 0.000 description 5
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910004530 SIMS 5 Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004255 ion exchange chromatography Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004441 surface measurement Methods 0.000 description 2
- 238000004876 x-ray fluorescence Methods 0.000 description 2
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- QHGSGZLLHBKSAH-UHFFFAOYSA-N hydridosilicon Chemical group [SiH] QHGSGZLLHBKSAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000007130 inorganic reaction Methods 0.000 description 1
- 229910021331 inorganic silicon compound Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004846 x-ray emission Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
Description
ΔC/C=(C処理後―C処理前)/C処理前
を計算した。
Al%=ADAl/(ADZn+ADAl)
ADF=CF×(D基材フィルム×10-4×ρ基材フィルム)×106
ここで、D基材フィルムとρ基材フィルムはそれぞれ基材フィルムの厚さと密度であり、単位はそれぞれμmとg/cm3である。計算過程において、金属層の量は基材フィルムに比べ非常に低いため、計算に入れなかった。
Claims (12)
- 基材フィルムの少なくとも片面に、金属単体または金属化合物を含有する層である金属層を有し、
105℃、100%RHで3hr処理した後の、XPSで測定された490eVの位置の強度の、498eVの位置の強度に対する比は0.2より大きく、
前記金属層の外表面は、保護層を有し、
前記保護層は、変性ポリシロキサンを含有しており、
前記変性ポリシロキサンは、SiH基、エポキシ基、ヒドロキシ基、カルボキシル基、アミノ基、エチレン基、チオール基、炭素原子数4以上のアルキル基、無水酸基のうちの1つまたは複数を有するポリシロキサンである
ことを特徴とする金属化フィルム。 - 前記金属化フィルムは酸素を含有し、金属層の断面方向において少なくとも2箇所の酸素濃化を有する
ことを特徴とする請求項1に記載の金属化フィルム。 - 前記金属化フィルムはアルミニウムを含有し、アルミニウムと亜鉛の重量比は、1:99~10:90である
ことを特徴とする請求項1に記載の金属化フィルム。 - 前記金属化フィルムの断面方向において少なくとも2箇所のアルミニウム濃化を有する
ことを特徴とする請求項3に記載の金属化フィルム。 - 前記金属層または金属層の外表面は、ケイ素および/またはフッ素を含有する
ことを特徴とする請求項1に記載の金属化フィルム。 - 前記金属化フィルムの断面方向において少なくとも1箇所のケイ素濃化を有する
ことを特徴とする請求項5に記載の金属化フィルム。 - XPS分析により、金属化フィルムにおいて無機化したケイ素を表すピークが存在することが示される
ことを特徴とする請求項5に記載の金属化フィルム。 - ケイ素の含有量が0.005~0.3μg/cm2である
ことを特徴とする請求項5に記載の金属化フィルム。 - 飛行時間型二次イオン質量分析で測定されたケイ素の無機化度は0.1以上である
ことを特徴とする請求項6に記載の金属化フィルム。 - フッ素の含有量が5~40μg/cm2である
ことを特徴とする請求項5に記載の金属化フィルム。 - 前記基材フィルムは、ポリプロピレン、ポリエチレン、ポリエステル、ポリフェニレンサルファイド、ポリカーボネート、ポリスチレン、ポリフッ化ビリニデンフィルムのうちの1つである
ことを特徴とする請求項1に記載の金属化フィルム。 - 前記保護層は、さらにパーフロロポリエーテルを含有している
ことを特徴とする請求項1に記載の金属化フィルム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810392006.6 | 2018-04-27 | ||
CN201810392006 | 2018-04-27 | ||
PCT/CN2019/083601 WO2019206058A1 (zh) | 2018-04-27 | 2019-04-22 | 一种金属化薄膜 |
Publications (2)
Publication Number | Publication Date |
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JP2021520058A JP2021520058A (ja) | 2021-08-12 |
JP7465805B2 true JP7465805B2 (ja) | 2024-04-11 |
Family
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JP2020532931A Active JP7465805B2 (ja) | 2018-04-27 | 2019-04-22 | 金属化フィルム |
Country Status (3)
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JP (1) | JP7465805B2 (ja) |
CN (1) | CN111225994B (ja) |
WO (1) | WO2019206058A1 (ja) |
Families Citing this family (1)
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CN112863868B (zh) * | 2021-01-13 | 2022-07-22 | 佛山易事达电容材料有限公司 | 一种耐高温高湿安全膜的制作方法 |
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JP2007109845A (ja) | 2005-10-13 | 2007-04-26 | Toray Ind Inc | コンデンサ用金属蒸着フィルムおよびコンデンサ |
JP2011146553A (ja) | 2010-01-15 | 2011-07-28 | Ulvac Japan Ltd | フィルムコンデンサ用金属化フィルムの製造方法 |
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JP3307067B2 (ja) * | 1994-04-15 | 2002-07-24 | 東レ株式会社 | 蒸着フィルムおよびそれを用いてなるコンデンサ |
JP3769842B2 (ja) * | 1996-11-05 | 2006-04-26 | 東レ株式会社 | 金属蒸着フィルム、その製造方法、およびそれを用いたコンデンサ |
JP2003017355A (ja) * | 2001-06-28 | 2003-01-17 | Toray Ind Inc | コンデンサ用金属化フィルム及びコンデンサ |
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2019
- 2019-04-22 CN CN201980004289.5A patent/CN111225994B/zh active Active
- 2019-04-22 JP JP2020532931A patent/JP7465805B2/ja active Active
- 2019-04-22 WO PCT/CN2019/083601 patent/WO2019206058A1/zh active Application Filing
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JP2007109845A (ja) | 2005-10-13 | 2007-04-26 | Toray Ind Inc | コンデンサ用金属蒸着フィルムおよびコンデンサ |
JP2011146553A (ja) | 2010-01-15 | 2011-07-28 | Ulvac Japan Ltd | フィルムコンデンサ用金属化フィルムの製造方法 |
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