JP7464498B2 - エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物 Download PDF

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Publication number
JP7464498B2
JP7464498B2 JP2020180372A JP2020180372A JP7464498B2 JP 7464498 B2 JP7464498 B2 JP 7464498B2 JP 2020180372 A JP2020180372 A JP 2020180372A JP 2020180372 A JP2020180372 A JP 2020180372A JP 7464498 B2 JP7464498 B2 JP 7464498B2
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Japan
Prior art keywords
compound
photosensitive resin
epoxy
formula
resin composition
Prior art date
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JP2020180372A
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English (en)
Japanese (ja)
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JP2022071418A (ja
Inventor
大樹 加賀
貴文 水口
麻央 竹田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2020180372A priority Critical patent/JP7464498B2/ja
Priority to KR1020210135846A priority patent/KR20220056794A/ko
Priority to TW110139881A priority patent/TW202227520A/zh
Priority to CN202111253397.1A priority patent/CN114488689A/zh
Publication of JP2022071418A publication Critical patent/JP2022071418A/ja
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Publication of JP7464498B2 publication Critical patent/JP7464498B2/ja
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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/016Diazonium salts or compounds
    • G03F7/021Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G03F7/0217Polyurethanes; Epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2020180372A 2020-10-28 2020-10-28 エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物 Active JP7464498B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020180372A JP7464498B2 (ja) 2020-10-28 2020-10-28 エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物
KR1020210135846A KR20220056794A (ko) 2020-10-28 2021-10-13 에폭시 수지를 함유하는 감광성 수지 조성물 및 그의 경화물
TW110139881A TW202227520A (zh) 2020-10-28 2021-10-27 含有環氧樹脂的感光性樹脂組成物及其硬化物
CN202111253397.1A CN114488689A (zh) 2020-10-28 2021-10-27 感光性树脂组合物及其硬化物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020180372A JP7464498B2 (ja) 2020-10-28 2020-10-28 エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JP2022071418A JP2022071418A (ja) 2022-05-16
JP7464498B2 true JP7464498B2 (ja) 2024-04-09

Family

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Family Applications (1)

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JP2020180372A Active JP7464498B2 (ja) 2020-10-28 2020-10-28 エポキシ樹脂を含有する感光性樹脂組成物及びその硬化物

Country Status (4)

Country Link
JP (1) JP7464498B2 (ko)
KR (1) KR20220056794A (ko)
CN (1) CN114488689A (ko)
TW (1) TW202227520A (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008250307A (ja) 2007-03-05 2008-10-16 Nippon Shokubai Co Ltd 画像形成用感光性樹脂組成物
JP2010280812A (ja) 2009-06-04 2010-12-16 Nippon Kayaku Co Ltd 反応性ウレタン化合物、それを含む活性エネルギー線硬化型樹脂組成物、及びその用途
WO2012176694A1 (ja) 2011-06-24 2012-12-27 東京応化工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化膜、絶縁膜、カラーフィルタ、及び表示装置
JP2017036379A (ja) 2015-08-07 2017-02-16 日本化薬株式会社 新規反応性カルボキシレート化合物、それを用いた硬化性樹脂組成物、およびその用途

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0952925A (ja) 1995-08-11 1997-02-25 Takeda Chem Ind Ltd 光重合性樹脂組成物および硬化物
JP5027357B2 (ja) 2001-03-30 2012-09-19 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物及びプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008250307A (ja) 2007-03-05 2008-10-16 Nippon Shokubai Co Ltd 画像形成用感光性樹脂組成物
JP2010280812A (ja) 2009-06-04 2010-12-16 Nippon Kayaku Co Ltd 反応性ウレタン化合物、それを含む活性エネルギー線硬化型樹脂組成物、及びその用途
WO2012176694A1 (ja) 2011-06-24 2012-12-27 東京応化工業株式会社 ネガ型感光性樹脂組成物、パターン形成方法、硬化膜、絶縁膜、カラーフィルタ、及び表示装置
US20140231729A1 (en) 2011-06-24 2014-08-21 Tokyo Ohka Kogyo Co., Ltd. Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device
JP2017036379A (ja) 2015-08-07 2017-02-16 日本化薬株式会社 新規反応性カルボキシレート化合物、それを用いた硬化性樹脂組成物、およびその用途

Also Published As

Publication number Publication date
CN114488689A (zh) 2022-05-13
KR20220056794A (ko) 2022-05-06
TW202227520A (zh) 2022-07-16
JP2022071418A (ja) 2022-05-16

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