JP7459937B2 - 共振子及び共振装置 - Google Patents

共振子及び共振装置 Download PDF

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Publication number
JP7459937B2
JP7459937B2 JP2022518594A JP2022518594A JP7459937B2 JP 7459937 B2 JP7459937 B2 JP 7459937B2 JP 2022518594 A JP2022518594 A JP 2022518594A JP 2022518594 A JP2022518594 A JP 2022518594A JP 7459937 B2 JP7459937 B2 JP 7459937B2
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JP
Japan
Prior art keywords
base
resonator
support arm
vibrating
arm
Prior art date
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Active
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JP2022518594A
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English (en)
Japanese (ja)
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JPWO2021220535A5 (https=
JPWO2021220535A1 (https=
Inventor
ヴィレ カーヤカリ
良太 河合
敬之 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2021220535A1 publication Critical patent/JPWO2021220535A1/ja
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1057Mounting in enclosures for microelectro-mechanical devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/0595Holders or supports the holder support and resonator being formed in one body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468Tuning fork resonators
    • H03H9/2478Single-Ended Tuning Fork resonators
    • H03H9/2489Single-Ended Tuning Fork resonators with more than two fork tines
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02244Details of microelectro-mechanical resonators
    • H03H2009/02488Vibration modes
    • H03H2009/02511Vertical, i.e. perpendicular to the substrate plane

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2022518594A 2020-04-27 2020-11-11 共振子及び共振装置 Active JP7459937B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020078246 2020-04-27
JP2020078246 2020-04-27
PCT/JP2020/041997 WO2021220535A1 (ja) 2020-04-27 2020-11-11 共振子及び共振装置

Publications (3)

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JPWO2021220535A1 JPWO2021220535A1 (https=) 2021-11-04
JPWO2021220535A5 JPWO2021220535A5 (https=) 2022-10-19
JP7459937B2 true JP7459937B2 (ja) 2024-04-02

Family

ID=78373509

Family Applications (1)

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JP2022518594A Active JP7459937B2 (ja) 2020-04-27 2020-11-11 共振子及び共振装置

Country Status (4)

Country Link
US (1) US11824517B2 (https=)
JP (1) JP7459937B2 (https=)
CN (1) CN115398802B (https=)
WO (1) WO2021220535A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116601870A (zh) * 2020-12-17 2023-08-15 株式会社村田制作所 谐振子以及谐振装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016174789A1 (ja) 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2017064916A1 (ja) 2015-10-13 2017-04-20 株式会社村田製作所 共振子及び共振装置
WO2018216264A1 (ja) 2017-05-25 2018-11-29 株式会社村田製作所 共振子及び共振装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102498666B (zh) * 2009-09-18 2015-10-14 株式会社大真空 压电振动片以及压电振动片的制造方法
WO2016175218A1 (ja) 2015-04-28 2016-11-03 株式会社村田製作所 共振子及び共振装置
JP6742601B2 (ja) * 2016-06-01 2020-08-19 株式会社村田製作所 共振子及び共振装置
CN108490216A (zh) * 2018-01-31 2018-09-04 嘉兴市纳杰微电子技术有限公司 一种硅微谐振式加速度计

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016174789A1 (ja) 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2017064916A1 (ja) 2015-10-13 2017-04-20 株式会社村田製作所 共振子及び共振装置
WO2018216264A1 (ja) 2017-05-25 2018-11-29 株式会社村田製作所 共振子及び共振装置

Also Published As

Publication number Publication date
CN115398802B (zh) 2025-11-11
CN115398802A (zh) 2022-11-25
JPWO2021220535A1 (https=) 2021-11-04
WO2021220535A1 (ja) 2021-11-04
US20230014350A1 (en) 2023-01-19
US11824517B2 (en) 2023-11-21

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