JP7437525B2 - 回転式カソードユニット用の駆動ブロック - Google Patents

回転式カソードユニット用の駆動ブロック Download PDF

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Publication number
JP7437525B2
JP7437525B2 JP2022555271A JP2022555271A JP7437525B2 JP 7437525 B2 JP7437525 B2 JP 7437525B2 JP 2022555271 A JP2022555271 A JP 2022555271A JP 2022555271 A JP2022555271 A JP 2022555271A JP 7437525 B2 JP7437525 B2 JP 7437525B2
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Japan
Prior art keywords
hollow tube
inner cylinder
drive block
target
electrode
Prior art date
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Active
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JP2022555271A
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English (en)
Japanese (ja)
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JPWO2022074893A1 (zh
Inventor
雄一 織井
大介 吉田
晋輔 立川
大 ▲高▼木
泰樹 西ノ坊
孔 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
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Publication date
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Publication of JPWO2022074893A1 publication Critical patent/JPWO2022074893A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2022555271A 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック Active JP7437525B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020170773 2020-10-08
JP2020170773 2020-10-08
PCT/JP2021/026577 WO2022074893A1 (ja) 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック

Publications (2)

Publication Number Publication Date
JPWO2022074893A1 JPWO2022074893A1 (zh) 2022-04-14
JP7437525B2 true JP7437525B2 (ja) 2024-02-22

Family

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Family Applications (1)

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JP2022555271A Active JP7437525B2 (ja) 2020-10-08 2021-07-15 回転式カソードユニット用の駆動ブロック

Country Status (5)

Country Link
JP (1) JP7437525B2 (zh)
KR (1) KR20230012046A (zh)
CN (1) CN116057199B (zh)
TW (1) TWI853183B (zh)
WO (1) WO2022074893A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007191756A (ja) 2006-01-19 2007-08-02 Raiku:Kk 成膜装置及び成膜方法
JP2009513818A (ja) 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
JP2010150579A (ja) 2008-12-24 2010-07-08 Canon Anelva Corp スパッタリング装置
JP2015510039A (ja) 2012-02-13 2015-04-02 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー オンライン調整可能マグネットバー
JP2017519899A (ja) 2014-04-28 2017-07-20 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
JP2020007575A (ja) 2018-07-02 2020-01-16 キヤノン株式会社 成膜装置およびそれを用いた成膜方法
JP2020019990A (ja) 2018-07-31 2020-02-06 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016185714A (ja) 2015-03-27 2016-10-27 矢崎総業株式会社 ハーネス配索構造
CN107614743B (zh) * 2015-05-19 2019-10-22 株式会社爱发科 磁控溅射装置用的旋转阴极单元
KR20170076314A (ko) * 2015-12-24 2017-07-04 (주)에스엔텍 증착 장치용 캐소드 전극
JP6701455B2 (ja) * 2017-11-01 2020-05-27 株式会社アルバック スパッタリング装置及び成膜方法
KR102666846B1 (ko) * 2018-10-17 2024-05-20 가부시키가이샤 아루박 접촉식 급전장치 및 접촉유닛

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009513818A (ja) 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
JP2007191756A (ja) 2006-01-19 2007-08-02 Raiku:Kk 成膜装置及び成膜方法
JP2010150579A (ja) 2008-12-24 2010-07-08 Canon Anelva Corp スパッタリング装置
JP2015510039A (ja) 2012-02-13 2015-04-02 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー オンライン調整可能マグネットバー
JP2017519899A (ja) 2014-04-28 2017-07-20 スパッタリング・コンポーネンツ・インコーポレーテッド スパッタリング装置
JP2020007575A (ja) 2018-07-02 2020-01-16 キヤノン株式会社 成膜装置およびそれを用いた成膜方法
JP2020019990A (ja) 2018-07-31 2020-02-06 キヤノントッキ株式会社 成膜装置、および、電子デバイスの製造方法

Also Published As

Publication number Publication date
TWI853183B (zh) 2024-08-21
CN116057199B (zh) 2024-09-03
WO2022074893A1 (ja) 2022-04-14
CN116057199A (zh) 2023-05-02
JPWO2022074893A1 (zh) 2022-04-14
KR20230012046A (ko) 2023-01-25
TW202231895A (zh) 2022-08-16

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