JP7424745B2 - 電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板およびその製造方法 - Google Patents
電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板およびその製造方法 Download PDFInfo
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- JP7424745B2 JP7424745B2 JP2018192723A JP2018192723A JP7424745B2 JP 7424745 B2 JP7424745 B2 JP 7424745B2 JP 2018192723 A JP2018192723 A JP 2018192723A JP 2018192723 A JP2018192723 A JP 2018192723A JP 7424745 B2 JP7424745 B2 JP 7424745B2
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Images
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018192723A JP7424745B2 (ja) | 2018-10-11 | 2018-10-11 | 電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板およびその製造方法 |
| CN201921689233.1U CN211509708U (zh) | 2018-10-11 | 2019-10-10 | 电磁波屏蔽膜及带电磁波屏蔽膜的印刷线路板 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018192723A JP7424745B2 (ja) | 2018-10-11 | 2018-10-11 | 電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020061487A JP2020061487A (ja) | 2020-04-16 |
| JP7424745B2 true JP7424745B2 (ja) | 2024-01-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2018192723A Active JP7424745B2 (ja) | 2018-10-11 | 2018-10-11 | 電磁波シールドフィルム、電磁波シールドフィルム付きプリント配線板およびその製造方法 |
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| Country | Link |
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| JP (1) | JP7424745B2 (zh) |
| CN (1) | CN211509708U (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114882790B (zh) * | 2022-04-24 | 2023-06-16 | 绵阳惠科光电科技有限公司 | 异方性导电胶和显示装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015135949A (ja) | 2013-12-16 | 2015-07-27 | デクセリアルズ株式会社 | 実装体の製造方法、及び異方性導電フィルム |
| JP2016115937A (ja) | 2014-12-11 | 2016-06-23 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、プリント配線板、および電子機器 |
| JP2017220592A (ja) | 2016-06-08 | 2017-12-14 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6098688B1 (ja) * | 2015-09-17 | 2017-03-22 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| JP6554618B2 (ja) * | 2017-02-13 | 2019-07-31 | タツタ電線株式会社 | シールドプリント配線板及びシールドプリント配線板の製造方法 |
-
2018
- 2018-10-11 JP JP2018192723A patent/JP7424745B2/ja active Active
-
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- 2019-10-10 CN CN201921689233.1U patent/CN211509708U/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015135949A (ja) | 2013-12-16 | 2015-07-27 | デクセリアルズ株式会社 | 実装体の製造方法、及び異方性導電フィルム |
| JP2016115937A (ja) | 2014-12-11 | 2016-06-23 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシート、プリント配線板、および電子機器 |
| JP2017220592A (ja) | 2016-06-08 | 2017-12-14 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板 |
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| Publication number | Publication date |
|---|---|
| JP2020061487A (ja) | 2020-04-16 |
| CN211509708U (zh) | 2020-09-15 |
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