JP7421413B2 - パッド温度調整装置、パッド温度調整方法、および研磨装置 - Google Patents

パッド温度調整装置、パッド温度調整方法、および研磨装置 Download PDF

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Publication number
JP7421413B2
JP7421413B2 JP2020082423A JP2020082423A JP7421413B2 JP 7421413 B2 JP7421413 B2 JP 7421413B2 JP 2020082423 A JP2020082423 A JP 2020082423A JP 2020082423 A JP2020082423 A JP 2020082423A JP 7421413 B2 JP7421413 B2 JP 7421413B2
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Japan
Prior art keywords
pad
temperature
heat exchanger
polishing pad
polishing
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JP2020082423A
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English (en)
Japanese (ja)
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JP2021176664A5 (enExample
JP2021176664A (ja
Inventor
修司 魚住
徹 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2020082423A priority Critical patent/JP7421413B2/ja
Priority to SG10202104335VA priority patent/SG10202104335VA/en
Priority to US17/242,886 priority patent/US11826871B2/en
Priority to TW110115344A priority patent/TWI872241B/zh
Priority to KR1020210057045A priority patent/KR102763996B1/ko
Priority to CN202110494699.1A priority patent/CN113618622B/zh
Publication of JP2021176664A publication Critical patent/JP2021176664A/ja
Publication of JP2021176664A5 publication Critical patent/JP2021176664A5/ja
Application granted granted Critical
Publication of JP7421413B2 publication Critical patent/JP7421413B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2020082423A 2020-05-08 2020-05-08 パッド温度調整装置、パッド温度調整方法、および研磨装置 Active JP7421413B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020082423A JP7421413B2 (ja) 2020-05-08 2020-05-08 パッド温度調整装置、パッド温度調整方法、および研磨装置
US17/242,886 US11826871B2 (en) 2020-05-08 2021-04-28 Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus
TW110115344A TWI872241B (zh) 2020-05-08 2021-04-28 墊溫度調整裝置、墊溫度調整方法、及研磨裝置
SG10202104335VA SG10202104335VA (en) 2020-05-08 2021-04-28 Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus
KR1020210057045A KR102763996B1 (ko) 2020-05-08 2021-05-03 패드 온도 조정 장치, 패드 온도 조정 방법 및 연마 장치
CN202110494699.1A CN113618622B (zh) 2020-05-08 2021-05-07 垫温度调节装置、垫温度调节方法及研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020082423A JP7421413B2 (ja) 2020-05-08 2020-05-08 パッド温度調整装置、パッド温度調整方法、および研磨装置

Publications (3)

Publication Number Publication Date
JP2021176664A JP2021176664A (ja) 2021-11-11
JP2021176664A5 JP2021176664A5 (enExample) 2022-09-15
JP7421413B2 true JP7421413B2 (ja) 2024-01-24

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JP2020082423A Active JP7421413B2 (ja) 2020-05-08 2020-05-08 パッド温度調整装置、パッド温度調整方法、および研磨装置

Country Status (6)

Country Link
US (1) US11826871B2 (enExample)
JP (1) JP7421413B2 (enExample)
KR (1) KR102763996B1 (enExample)
CN (1) CN113618622B (enExample)
SG (1) SG10202104335VA (enExample)
TW (1) TWI872241B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102752330B1 (ko) * 2021-04-30 2025-01-10 어플라이드 머티어리얼스, 인코포레이티드 열 이미지의 머신 러닝 기반 처리를 사용하는 화학 기계적 연마 공정 모니터링
JP7781683B2 (ja) * 2022-03-09 2025-12-08 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法
CN118721017B (zh) * 2024-06-27 2025-10-10 西安奕斯伟材料科技股份有限公司 一种抛光液补液设备、方法以及装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012245584A (ja) 2011-05-27 2012-12-13 Shin Etsu Handotai Co Ltd 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
JP2013022664A (ja) 2011-07-19 2013-02-04 Ebara Corp 研磨装置および方法
JP2018027582A (ja) 2016-08-17 2018-02-22 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータプログラムを記録した記録媒体
US20190030675A1 (en) 2017-07-31 2019-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature Control in Chemical Mechanical Polish
US20190286075A1 (en) 2018-03-13 2019-09-19 Graham Yennie Machine Learning Systems for Monitoring of Semiconductor Processing

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390807A (en) 1977-01-21 1978-08-10 Nec Corp Trunk circuit
JPH09123057A (ja) * 1995-10-31 1997-05-13 Sony Corp 基板研磨装置
JP3672685B2 (ja) * 1996-11-29 2005-07-20 松下電器産業株式会社 研磨方法及び研磨装置
JP2001062706A (ja) 1999-08-25 2001-03-13 Nikon Corp 研磨装置
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
JP2005056987A (ja) * 2003-08-01 2005-03-03 Nitta Haas Inc 研磨装置および研磨方法
JP4902433B2 (ja) * 2007-06-13 2012-03-21 株式会社荏原製作所 研磨装置の研磨面加熱、冷却装置
JP2012245581A (ja) * 2011-05-26 2012-12-13 Mitsubishi Materials Corp 表面被覆炭窒化チタン基サーメット製切削インサートおよびその製造方法
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
JP6340205B2 (ja) * 2014-02-20 2018-06-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
US10414018B2 (en) * 2016-02-22 2019-09-17 Ebara Corporation Apparatus and method for regulating surface temperature of polishing pad
JP6929072B2 (ja) 2016-02-22 2021-09-01 株式会社荏原製作所 研磨パッドの表面温度を調整するための装置および方法
KR101722555B1 (ko) * 2016-03-08 2017-04-03 주식회사 케이씨텍 화학 기계적 연마장치 및 방법
JP6752657B2 (ja) * 2016-08-23 2020-09-09 株式会社荏原製作所 研磨方法および研磨装置
KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP7059117B2 (ja) * 2017-10-31 2022-04-25 株式会社荏原製作所 研磨パッドの研磨面の温度を調整するための熱交換器、該熱交換器を備えた研磨装置、該熱交換器を用いた基板の研磨方法、および研磨パッドの研磨面の温度を調整するためのプログラムを記録したコンピュータ読み取り可能な記録媒体
JP6545244B2 (ja) * 2017-12-15 2019-07-17 ヤフー株式会社 決定装置、決定方法、および決定プログラム
JP6975078B2 (ja) * 2018-03-15 2021-12-01 キオクシア株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012245584A (ja) 2011-05-27 2012-12-13 Shin Etsu Handotai Co Ltd 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
JP2013022664A (ja) 2011-07-19 2013-02-04 Ebara Corp 研磨装置および方法
JP2018027582A (ja) 2016-08-17 2018-02-22 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータプログラムを記録した記録媒体
US20190030675A1 (en) 2017-07-31 2019-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature Control in Chemical Mechanical Polish
US20190286075A1 (en) 2018-03-13 2019-09-19 Graham Yennie Machine Learning Systems for Monitoring of Semiconductor Processing

Also Published As

Publication number Publication date
CN113618622A (zh) 2021-11-09
CN113618622B (zh) 2025-10-17
JP2021176664A (ja) 2021-11-11
US20210347004A1 (en) 2021-11-11
KR20210136859A (ko) 2021-11-17
TWI872241B (zh) 2025-02-11
KR102763996B1 (ko) 2025-02-07
SG10202104335VA (en) 2021-12-30
TW202146160A (zh) 2021-12-16
US11826871B2 (en) 2023-11-28

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