TWI872241B - 墊溫度調整裝置、墊溫度調整方法、及研磨裝置 - Google Patents

墊溫度調整裝置、墊溫度調整方法、及研磨裝置 Download PDF

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Publication number
TWI872241B
TWI872241B TW110115344A TW110115344A TWI872241B TW I872241 B TWI872241 B TW I872241B TW 110115344 A TW110115344 A TW 110115344A TW 110115344 A TW110115344 A TW 110115344A TW I872241 B TWI872241 B TW I872241B
Authority
TW
Taiwan
Prior art keywords
pad
temperature
heat exchanger
polishing pad
polishing
Prior art date
Application number
TW110115344A
Other languages
English (en)
Chinese (zh)
Other versions
TW202146160A (zh
Inventor
魚住修司
丸山徹
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202146160A publication Critical patent/TW202146160A/zh
Application granted granted Critical
Publication of TWI872241B publication Critical patent/TWI872241B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW110115344A 2020-05-08 2021-04-28 墊溫度調整裝置、墊溫度調整方法、及研磨裝置 TWI872241B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-082423 2020-05-08
JP2020082423A JP7421413B2 (ja) 2020-05-08 2020-05-08 パッド温度調整装置、パッド温度調整方法、および研磨装置

Publications (2)

Publication Number Publication Date
TW202146160A TW202146160A (zh) 2021-12-16
TWI872241B true TWI872241B (zh) 2025-02-11

Family

ID=78377954

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115344A TWI872241B (zh) 2020-05-08 2021-04-28 墊溫度調整裝置、墊溫度調整方法、及研磨裝置

Country Status (6)

Country Link
US (1) US11826871B2 (enExample)
JP (1) JP7421413B2 (enExample)
KR (1) KR102763996B1 (enExample)
CN (1) CN113618622B (enExample)
SG (1) SG10202104335VA (enExample)
TW (1) TWI872241B (enExample)

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* Cited by examiner, † Cited by third party
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KR102752330B1 (ko) * 2021-04-30 2025-01-10 어플라이드 머티어리얼스, 인코포레이티드 열 이미지의 머신 러닝 기반 처리를 사용하는 화학 기계적 연마 공정 모니터링
JP7781683B2 (ja) * 2022-03-09 2025-12-08 キオクシア株式会社 半導体製造装置及び半導体装置の製造方法
CN118721017B (zh) * 2024-06-27 2025-10-10 西安奕斯伟材料科技股份有限公司 一种抛光液补液设备、方法以及装置

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JPH10156708A (ja) * 1996-11-29 1998-06-16 Matsushita Electric Ind Co Ltd 研磨方法及び研磨装置
US20080311823A1 (en) * 2007-06-13 2008-12-18 Shunichi Aiyoshizawa Apparatus for heating or cooling a polishing surface of a polishing appratus
JP2012245581A (ja) * 2011-05-26 2012-12-13 Mitsubishi Materials Corp 表面被覆炭窒化チタン基サーメット製切削インサートおよびその製造方法
JP2013022664A (ja) * 2011-07-19 2013-02-04 Ebara Corp 研磨装置および方法
US20150079881A1 (en) * 2013-08-27 2015-03-19 Ebara Corporation Polishing method and polishing apparatus
JP2018027582A (ja) * 2016-08-17 2018-02-22 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータプログラムを記録した記録媒体
TWI649159B (zh) * 2014-02-20 2019-02-01 日商荏原製作所股份有限公司 研磨墊的修整方法及裝置
JP2019109588A (ja) * 2017-12-15 2019-07-04 ヤフー株式会社 決定装置、決定方法、および決定プログラム
US20190287826A1 (en) * 2018-03-15 2019-09-19 Toshiba Memory Corporation Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

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JPH09123057A (ja) * 1995-10-31 1997-05-13 Sony Corp 基板研磨装置
JP2001062706A (ja) 1999-08-25 2001-03-13 Nikon Corp 研磨装置
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
JP2005056987A (ja) * 2003-08-01 2005-03-03 Nitta Haas Inc 研磨装置および研磨方法
JP5454513B2 (ja) 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
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JP6929072B2 (ja) 2016-02-22 2021-09-01 株式会社荏原製作所 研磨パッドの表面温度を調整するための装置および方法
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JP6752657B2 (ja) * 2016-08-23 2020-09-09 株式会社荏原製作所 研磨方法および研磨装置
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KR102591906B1 (ko) * 2017-10-31 2023-10-20 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
JP7059117B2 (ja) * 2017-10-31 2022-04-25 株式会社荏原製作所 研磨パッドの研磨面の温度を調整するための熱交換器、該熱交換器を備えた研磨装置、該熱交換器を用いた基板の研磨方法、および研磨パッドの研磨面の温度を調整するためのプログラムを記録したコンピュータ読み取り可能な記録媒体
CN111902924B (zh) * 2018-03-13 2024-11-29 应用材料公司 用于半导体处理的监测的机器学习系统

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10156708A (ja) * 1996-11-29 1998-06-16 Matsushita Electric Ind Co Ltd 研磨方法及び研磨装置
US20080311823A1 (en) * 2007-06-13 2008-12-18 Shunichi Aiyoshizawa Apparatus for heating or cooling a polishing surface of a polishing appratus
JP2012245581A (ja) * 2011-05-26 2012-12-13 Mitsubishi Materials Corp 表面被覆炭窒化チタン基サーメット製切削インサートおよびその製造方法
JP2013022664A (ja) * 2011-07-19 2013-02-04 Ebara Corp 研磨装置および方法
US20150079881A1 (en) * 2013-08-27 2015-03-19 Ebara Corporation Polishing method and polishing apparatus
TWI649159B (zh) * 2014-02-20 2019-02-01 日商荏原製作所股份有限公司 研磨墊的修整方法及裝置
JP2018027582A (ja) * 2016-08-17 2018-02-22 株式会社荏原製作所 研磨方法、研磨装置、およびコンピュータプログラムを記録した記録媒体
JP2019109588A (ja) * 2017-12-15 2019-07-04 ヤフー株式会社 決定装置、決定方法、および決定プログラム
US20190287826A1 (en) * 2018-03-15 2019-09-19 Toshiba Memory Corporation Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JP7421413B2 (ja) 2024-01-24
CN113618622A (zh) 2021-11-09
CN113618622B (zh) 2025-10-17
JP2021176664A (ja) 2021-11-11
US20210347004A1 (en) 2021-11-11
KR20210136859A (ko) 2021-11-17
KR102763996B1 (ko) 2025-02-07
SG10202104335VA (en) 2021-12-30
TW202146160A (zh) 2021-12-16
US11826871B2 (en) 2023-11-28

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