SG10202104335VA - Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus - Google Patents

Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus

Info

Publication number
SG10202104335VA
SG10202104335VA SG10202104335VA SG10202104335VA SG10202104335VA SG 10202104335V A SG10202104335V A SG 10202104335VA SG 10202104335V A SG10202104335V A SG 10202104335VA SG 10202104335V A SG10202104335V A SG 10202104335VA SG 10202104335V A SG10202104335V A SG 10202104335VA
Authority
SG
Singapore
Prior art keywords
pad
temperature regulating
polishing apparatus
regulating method
polishing
Prior art date
Application number
SG10202104335VA
Inventor
Uozumi Shuji
Maruyama Toru
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202104335VA publication Critical patent/SG10202104335VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10202104335VA 2020-05-08 2021-04-28 Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus SG10202104335VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020082423A JP7421413B2 (en) 2020-05-08 2020-05-08 Pad temperature adjustment device, pad temperature adjustment method, and polishing device

Publications (1)

Publication Number Publication Date
SG10202104335VA true SG10202104335VA (en) 2021-12-30

Family

ID=78377954

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202104335VA SG10202104335VA (en) 2020-05-08 2021-04-28 Pad-temperature regulating apparatus, pad-temperature regulating method, and polishing apparatus

Country Status (6)

Country Link
US (1) US11826871B2 (en)
JP (1) JP7421413B2 (en)
KR (1) KR20210136859A (en)
CN (1) CN113618622A (en)
SG (1) SG10202104335VA (en)
TW (1) TW202146160A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115884848A (en) 2021-04-30 2023-03-31 应用材料公司 Monitoring a chemical mechanical polishing process using machine learning based thermal image processing
JP2023131702A (en) * 2022-03-09 2023-09-22 キオクシア株式会社 Semiconductor manufacturing device and method for manufacturing semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5390807A (en) 1977-01-21 1978-08-10 Nec Corp Trunk circuit
JP3672685B2 (en) * 1996-11-29 2005-07-20 松下電器産業株式会社 Polishing method and polishing apparatus
JP2001062706A (en) 1999-08-25 2001-03-13 Nikon Corp Polishing device
JP4902433B2 (en) * 2007-06-13 2012-03-21 株式会社荏原製作所 Polishing surface heating and cooling device for polishing equipment
JP5454513B2 (en) 2011-05-27 2014-03-26 信越半導体株式会社 Method for adjusting position of polishing head in height direction and method for polishing workpiece
JP5791987B2 (en) 2011-07-19 2015-10-07 株式会社荏原製作所 Polishing apparatus and method
JP6161999B2 (en) * 2013-08-27 2017-07-12 株式会社荏原製作所 Polishing method and polishing apparatus
JP6929072B2 (en) 2016-02-22 2021-09-01 株式会社荏原製作所 Equipment and methods for adjusting the surface temperature of the polishing pad
KR101722555B1 (en) * 2016-03-08 2017-04-03 주식회사 케이씨텍 Chemical mechanical polishing apparatus and method
JP2018027582A (en) 2016-08-17 2018-02-22 株式会社荏原製作所 Polishing method, polishing device, and recording medium with computer program recorded thereon
US10350724B2 (en) 2017-07-31 2019-07-16 Taiwan Semiconductor Manufacturing Company, Ltd. Temperature control in chemical mechanical polish
CN111902924A (en) 2018-03-13 2020-11-06 应用材料公司 Machine learning system for monitoring of semiconductor processing
JP6975078B2 (en) * 2018-03-15 2021-12-01 キオクシア株式会社 Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment

Also Published As

Publication number Publication date
US20210347004A1 (en) 2021-11-11
CN113618622A (en) 2021-11-09
JP2021176664A (en) 2021-11-11
KR20210136859A (en) 2021-11-17
JP7421413B2 (en) 2024-01-24
US11826871B2 (en) 2023-11-28
TW202146160A (en) 2021-12-16

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