JP7406314B2 - 電子モジュール及び機器 - Google Patents

電子モジュール及び機器 Download PDF

Info

Publication number
JP7406314B2
JP7406314B2 JP2019116631A JP2019116631A JP7406314B2 JP 7406314 B2 JP7406314 B2 JP 7406314B2 JP 2019116631 A JP2019116631 A JP 2019116631A JP 2019116631 A JP2019116631 A JP 2019116631A JP 7406314 B2 JP7406314 B2 JP 7406314B2
Authority
JP
Japan
Prior art keywords
electronic module
conductivity member
component
substrate
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019116631A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021002627A5 (https=
JP2021002627A (ja
Inventor
悠 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019116631A priority Critical patent/JP7406314B2/ja
Priority to US16/904,675 priority patent/US11798855B2/en
Publication of JP2021002627A publication Critical patent/JP2021002627A/ja
Publication of JP2021002627A5 publication Critical patent/JP2021002627A5/ja
Application granted granted Critical
Publication of JP7406314B2 publication Critical patent/JP7406314B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/656—Fan-in layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2019116631A 2019-06-24 2019-06-24 電子モジュール及び機器 Active JP7406314B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019116631A JP7406314B2 (ja) 2019-06-24 2019-06-24 電子モジュール及び機器
US16/904,675 US11798855B2 (en) 2019-06-24 2020-06-18 Electronic module and equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019116631A JP7406314B2 (ja) 2019-06-24 2019-06-24 電子モジュール及び機器

Publications (3)

Publication Number Publication Date
JP2021002627A JP2021002627A (ja) 2021-01-07
JP2021002627A5 JP2021002627A5 (https=) 2022-07-01
JP7406314B2 true JP7406314B2 (ja) 2023-12-27

Family

ID=73995432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019116631A Active JP7406314B2 (ja) 2019-06-24 2019-06-24 電子モジュール及び機器

Country Status (2)

Country Link
US (1) US11798855B2 (https=)
JP (1) JP7406314B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
JP7551558B2 (ja) 2021-04-01 2024-09-17 キヤノン株式会社 信号処理装置
JP2023101235A (ja) * 2022-01-07 2023-07-20 キヤノン株式会社 電子モジュール、装置及び電子モジュールの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359327A (ja) 2001-03-28 2002-12-13 Kyocera Corp 電子回路モジュール
JP2005353867A (ja) 2004-06-11 2005-12-22 Mitsubishi Electric Corp 半導体装置
JP2010500754A (ja) 2006-08-10 2010-01-07 ヴィシャイ ジェネラル セミコンダクター エルエルシー 放熱能力を向上させた半導体装置
WO2013080441A1 (ja) 2011-11-30 2013-06-06 富士電機株式会社 電力変換装置

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290564A (en) * 1963-02-26 1966-12-06 Texas Instruments Inc Semiconductor device
US5841190A (en) * 1995-05-19 1998-11-24 Ibiden Co., Ltd. High density multi-layered printed wiring board, multi-chip carrier and semiconductor package
US6175149B1 (en) * 1998-02-13 2001-01-16 Micron Technology, Inc. Mounting multiple semiconductor dies in a package
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2005011837A (ja) * 2003-06-16 2005-01-13 Nippon Micron Kk 半導体装置用基板、半導体装置およびその製造方法
JP2005101711A (ja) * 2003-09-22 2005-04-14 Renesas Technology Corp 固体撮像装置およびその製造方法
TWI321342B (en) * 2004-11-05 2010-03-01 Altus Technology Inc An integrate circuit chip encapsulation and the method of manufacturing it
JP2007012706A (ja) * 2005-06-28 2007-01-18 Kyocera Corp 電子部品収納用パッケージおよび電子装置
US7279795B2 (en) * 2005-12-29 2007-10-09 Intel Corporation Stacked die semiconductor package
US8895440B2 (en) * 2010-08-06 2014-11-25 Stats Chippac, Ltd. Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
JP5875313B2 (ja) * 2011-09-30 2016-03-02 キヤノン株式会社 電子部品および電子機器ならびにこれらの製造方法。
DE102011088969A1 (de) * 2011-12-19 2013-06-20 Robert Bosch Gmbh Getriebesteuermodul
WO2013118501A1 (ja) * 2012-02-07 2013-08-15 株式会社ニコン 撮像ユニットおよび撮像装置
JP5885690B2 (ja) * 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP2013243340A (ja) * 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP6192312B2 (ja) * 2013-02-28 2017-09-06 キヤノン株式会社 実装部材の製造方法および電子部品の製造方法。
US20140264808A1 (en) * 2013-03-15 2014-09-18 Andreas Wolter Chip arrangements, chip packages, and a method for manufacturing a chip arrangement
US9123685B2 (en) * 2013-07-15 2015-09-01 Freescale Semiconductor Inc. Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof
US9111870B2 (en) * 2013-10-17 2015-08-18 Freescale Semiconductor Inc. Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof
JP2015084378A (ja) * 2013-10-25 2015-04-30 キヤノン株式会社 電子部品、電子機器、実装部材の製造方法、電子部品の製造方法
JP6214337B2 (ja) * 2013-10-25 2017-10-18 キヤノン株式会社 電子部品、電子機器および電子部品の製造方法。
CN111432106B (zh) * 2013-12-27 2022-05-13 株式会社尼康 摄像单元以及摄像装置
US9190399B2 (en) * 2014-03-06 2015-11-17 International Business Machines Corporation Thermally enhanced three-dimensional integrated circuit package
US20180190622A1 (en) * 2014-03-07 2018-07-05 Bridge Semiconductor Corporation 3-d stacking semiconductor assembly having heat dissipation characteristics
CN106663731B (zh) * 2014-08-05 2019-08-06 西铁城电子株式会社 半导体装置及其制造方法
JP6423685B2 (ja) * 2014-10-23 2018-11-14 キヤノン株式会社 電子部品、モジュール及びカメラ
JP6582754B2 (ja) * 2015-08-31 2019-10-02 日亜化学工業株式会社 複合基板、発光装置、及び発光装置の製造方法
US9721859B2 (en) * 2015-09-01 2017-08-01 Texas Instruments Incorporated Semi-hermetic semiconductor package
US9978675B2 (en) * 2015-11-20 2018-05-22 Canon Kabushiki Kaisha Package, electronic component, and electronic apparatus
EP3203509B1 (en) * 2016-02-04 2021-01-20 Services Pétroliers Schlumberger Double-sided hermetic multichip module
US10068817B2 (en) * 2016-03-18 2018-09-04 Macom Technology Solutions Holdings, Inc. Semiconductor package
US20180130719A1 (en) * 2016-11-09 2018-05-10 Advanced Semiconductor Engineering, Inc. Semiconductor device packages and method of manufacturing the same
JP7057635B2 (ja) * 2017-08-15 2022-04-20 キヤノン株式会社 撮像装置、カメラおよび輸送機器
JP2019102494A (ja) * 2017-11-28 2019-06-24 キヤノン株式会社 光電変換装置およびその製造方法、機器
JP6703029B2 (ja) * 2018-03-26 2020-06-03 キヤノン株式会社 電子モジュールおよび撮像システム
JP7072644B2 (ja) * 2018-04-26 2022-05-20 京セラ株式会社 電子素子実装用基板、電子装置、および電子モジュール
JP7292828B2 (ja) * 2018-04-27 2023-06-19 キヤノン株式会社 撮像素子モジュール、撮像システム、撮像素子パッケージ及び製造方法
US10861785B2 (en) * 2018-06-18 2020-12-08 Canon Kabushiki Kaisha Electronic module, electronic device, manufacturing method for electronic module, and manufacturing method for electronic device
JP7134763B2 (ja) * 2018-07-23 2022-09-12 キヤノン株式会社 モジュール及びその製造方法
JP7218126B2 (ja) * 2018-08-30 2023-02-06 キヤノン株式会社 配線板を備えるユニット、モジュールおよび機器
JP7378923B2 (ja) * 2018-10-31 2023-11-14 キヤノン株式会社 半導体装置、モジュール、カメラおよび機器
JP7336261B2 (ja) * 2019-05-22 2023-08-31 キヤノン株式会社 撮像ユニット及び撮像装置
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359327A (ja) 2001-03-28 2002-12-13 Kyocera Corp 電子回路モジュール
JP2005353867A (ja) 2004-06-11 2005-12-22 Mitsubishi Electric Corp 半導体装置
JP2010500754A (ja) 2006-08-10 2010-01-07 ヴィシャイ ジェネラル セミコンダクター エルエルシー 放熱能力を向上させた半導体装置
WO2013080441A1 (ja) 2011-11-30 2013-06-06 富士電機株式会社 電力変換装置

Also Published As

Publication number Publication date
JP2021002627A (ja) 2021-01-07
US20200402872A1 (en) 2020-12-24
US11798855B2 (en) 2023-10-24

Similar Documents

Publication Publication Date Title
CN110265368B (zh) 拍摄单元及拍摄装置
CN109616485B (zh) 基板、拍摄单元及拍摄装置
RU2575944C2 (ru) Электронный компонент и электронное устройство
JP7336261B2 (ja) 撮像ユニット及び撮像装置
JP5730678B2 (ja) 撮像装置及びこれを用いた電子機器
JP2020017561A (ja) モジュール及びその製造方法
CN108391451B (zh) 图像拾取元件封装件及其制造方法、图像拾取装置
JP7406314B2 (ja) 電子モジュール及び機器
JP2015084377A (ja) 電子部品、電子機器および電子部品の製造方法。
TWI758549B (zh) 基板積層體、及攝像裝置
JP2004274164A (ja) 光モジュール及びその製造方法並びに電子機器
JP7781571B2 (ja) モジュールおよび機器
JP2011109225A (ja) 半導体装置
JP2005210409A (ja) カメラモジュール
CN113543457A (zh) 摄像单元和摄像设备
KR102879987B1 (ko) 카메라 모듈
JP2004282227A (ja) 光モジュール及びその製造方法並びに電子機器
JP4998689B2 (ja) 光学機器モジュール
JP2022105818A (ja) 電子機器
JP2011199511A (ja) 固体撮像装置
JP2013145823A (ja) 固体撮像装置及びこれを用いた電子カメラ

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20210103

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220623

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220623

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230808

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231117

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231215

R151 Written notification of patent or utility model registration

Ref document number: 7406314

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151