JP7403570B2 - パッケージ構造 - Google Patents
パッケージ構造 Download PDFInfo
- Publication number
- JP7403570B2 JP7403570B2 JP2022053340A JP2022053340A JP7403570B2 JP 7403570 B2 JP7403570 B2 JP 7403570B2 JP 2022053340 A JP2022053340 A JP 2022053340A JP 2022053340 A JP2022053340 A JP 2022053340A JP 7403570 B2 JP7403570 B2 JP 7403570B2
- Authority
- JP
- Japan
- Prior art keywords
- seal ring
- package structure
- base
- chip
- reinforcing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 37
- 230000002787 reinforcement Effects 0.000 claims description 18
- 230000000295 complement effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Packages (AREA)
Description
110、410、510、610 ベース
111 マウントパッド
112 凹部
114、414 フレーム
120 チップ
130、330、430、530 シールリング
140、340、540、640 上蓋
140s 側壁
150、150A、250、250A、350、450、550、650 補強部
150g、250g 間隙
160 接着剤
130h、150h 高さ
130w、150w 幅
340a、414a 溝
C 密閉空洞
Claims (3)
- フレームと、前記フレームによって取り囲まれた凹状の空間とを有するベースと、
前記凹状の空間内部においてベース上に設置され、前記ベースに電気接続されたチップと、
前記フレームの上端に設置されたシールリングと、
前記シールリング上に設置され、且つ前記チップを覆うように前記凹状の空間の上部開口部を塞ぐ上蓋と、
前記上蓋と前記シールリングとの接触部において、前記上蓋から前記シールリング方向に凸設された凸部と、前記シールリングに設けられ前記凸部が嵌合する凹部とを有する補強部と、
を含み、
前記凸部と前記凹部との間は凹凸相補的な接合界面を有し、
前記シールリングが、パッケージ構造に密閉空洞を形成し、且つ前記シールリングが、前記チップと前記補強部を取り囲み、
平面視において、前記補強部が、複数のセグメントの輪郭により構成され、且つ隣接する前記輪郭の間には間隙があり、前記シールリングの一部が前記間隙内に配置されたパッケージ構造。 - 前記シールリングが、前記上蓋の一部の側壁を覆う請求項1に記載のパッケージ構造。
- 前記凹部と前記シールリング、及び/又は前記凸部と前記上蓋が、一体成型構造である請求項1に記載のパッケージ構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111103536A TWI797977B (zh) | 2022-01-27 | 2022-01-27 | 封裝結構 |
TW111103536 | 2022-01-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023109664A JP2023109664A (ja) | 2023-08-08 |
JP7403570B2 true JP7403570B2 (ja) | 2023-12-22 |
Family
ID=86945081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022053340A Active JP7403570B2 (ja) | 2022-01-27 | 2022-03-29 | パッケージ構造 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7403570B2 (ja) |
CN (1) | CN116564898A (ja) |
TW (1) | TWI797977B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117374014B (zh) * | 2023-12-07 | 2024-03-08 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144571A (ja) | 1999-11-11 | 2001-05-25 | Tdk Corp | 圧電振動部品 |
JP2002359535A (ja) | 2001-03-27 | 2002-12-13 | Seiko Epson Corp | 圧電デバイス |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3838572B2 (ja) * | 2003-09-03 | 2006-10-25 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
US20100013041A1 (en) * | 2008-07-15 | 2010-01-21 | Micron Technology, Inc. | Microelectronic imager packages with covers having non-planar surface features |
-
2022
- 2022-01-27 TW TW111103536A patent/TWI797977B/zh active
- 2022-03-29 JP JP2022053340A patent/JP7403570B2/ja active Active
- 2022-05-26 CN CN202210586721.XA patent/CN116564898A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001144571A (ja) | 1999-11-11 | 2001-05-25 | Tdk Corp | 圧電振動部品 |
JP2002359535A (ja) | 2001-03-27 | 2002-12-13 | Seiko Epson Corp | 圧電デバイス |
Also Published As
Publication number | Publication date |
---|---|
CN116564898A (zh) | 2023-08-08 |
TWI797977B (zh) | 2023-04-01 |
TW202331947A (zh) | 2023-08-01 |
JP2023109664A (ja) | 2023-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7403570B2 (ja) | パッケージ構造 | |
JP5906377B2 (ja) | プッシュスイッチ | |
CN1767186B (zh) | 引线框架及其半导体封装 | |
KR970063696A (ko) | 패키지 | |
US4587550A (en) | Press-packed semiconductor device with lateral fixing member | |
CN110767843A (zh) | 显示面板及制备方法、显示装置 | |
US7507035B2 (en) | Optical module with metal stem and metal cap resistance-welded to stem | |
JP2017511568A (ja) | 回路遮断装置 | |
JP2006287073A (ja) | 半導体装置およびその製造方法 | |
US11508672B2 (en) | Semiconductor device | |
US9526172B2 (en) | Wiring substrate | |
CN108962829B (zh) | 用于光发射器的盖 | |
JPH0241945Y2 (ja) | ||
TWI479615B (zh) | 半導體封裝結構及其散熱件 | |
JP2858482B2 (ja) | テープキャリア型半導体装置 | |
JPS6028391B2 (ja) | 半導体パツケージ | |
JPS63122250A (ja) | 半導体装置 | |
US4249668A (en) | Envelope for camera tube | |
EP4270440A1 (en) | Easy-to-assemble fuse | |
JP2020009976A (ja) | 樹脂封止金型および半導体装置の製造方法 | |
CN211166359U (zh) | 车窗组件 | |
JPH04168755A (ja) | 半導体装置 | |
JPH0341751A (ja) | 半導体装置用容器 | |
CN213717460U (zh) | 高压开关设备壳体以及高压断路器 | |
EP3754206B1 (en) | Outer shell member for accumulator, manufacturing method therefor, accumulator, and manufacturng method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220329 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230606 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230906 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231205 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7403570 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |