JP7393873B2 - 電気的接触子及びプローブカード - Google Patents
電気的接触子及びプローブカード Download PDFInfo
- Publication number
- JP7393873B2 JP7393873B2 JP2019065829A JP2019065829A JP7393873B2 JP 7393873 B2 JP7393873 B2 JP 7393873B2 JP 2019065829 A JP2019065829 A JP 2019065829A JP 2019065829 A JP2019065829 A JP 2019065829A JP 7393873 B2 JP7393873 B2 JP 7393873B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- probe
- electrical
- substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims description 75
- 239000000758 substrate Substances 0.000 claims description 60
- 238000012360 testing method Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 16
- 238000012937 correction Methods 0.000 claims description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 241001422033 Thestylus Species 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019065829A JP7393873B2 (ja) | 2019-03-29 | 2019-03-29 | 電気的接触子及びプローブカード |
TW109103447A TWI743670B (zh) | 2019-03-29 | 2020-02-05 | 電性接觸元件及探針卡 |
KR1020200020772A KR102265641B1 (ko) | 2019-03-29 | 2020-02-20 | 전기적 접촉자 및 프로브 카드 |
CN202010216399.2A CN111751584B (zh) | 2019-03-29 | 2020-03-25 | 悬臂型探针及探针卡 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019065829A JP7393873B2 (ja) | 2019-03-29 | 2019-03-29 | 電気的接触子及びプローブカード |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020165773A JP2020165773A (ja) | 2020-10-08 |
JP2020165773A5 JP2020165773A5 (enrdf_load_stackoverflow) | 2022-03-18 |
JP7393873B2 true JP7393873B2 (ja) | 2023-12-07 |
Family
ID=72673146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019065829A Active JP7393873B2 (ja) | 2019-03-29 | 2019-03-29 | 電気的接触子及びプローブカード |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7393873B2 (enrdf_load_stackoverflow) |
KR (1) | KR102265641B1 (enrdf_load_stackoverflow) |
CN (1) | CN111751584B (enrdf_load_stackoverflow) |
TW (1) | TWI743670B (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102409029B1 (ko) * | 2022-04-12 | 2022-06-14 | 이시훈 | 프로브 핀 |
KR102791729B1 (ko) * | 2022-12-26 | 2025-04-08 | 주식회사 코리아 인스트루먼트 | 본딩 안정성이 개선된 프로브 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011117761A (ja) | 2009-12-01 | 2011-06-16 | Japan Electronic Materials Corp | プローブカードおよびプローブカードの製造方法 |
JP2016148566A (ja) | 2015-02-12 | 2016-08-18 | 日本電子材料株式会社 | プローブカード |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3675989B2 (ja) * | 1995-11-17 | 2005-07-27 | 株式会社テセック | 電子部品用コネクタ |
JP3307823B2 (ja) * | 1996-02-23 | 2002-07-24 | 松下電器産業株式会社 | 電子部品検査用接触体の製造方法 |
US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
JP2006132982A (ja) * | 2004-11-02 | 2006-05-25 | Tokyo Electron Ltd | プローブ |
US8253430B2 (en) * | 2005-04-22 | 2012-08-28 | Hewlett-Packard Development Company | Circuit board testing using a probe |
KR20060124562A (ko) * | 2005-05-31 | 2006-12-05 | 가부시키가이샤 니혼 마이크로닉스 | 통전시험용 프로브 |
JP4792465B2 (ja) * | 2005-08-09 | 2011-10-12 | 株式会社日本マイクロニクス | 通電試験用プローブ |
JP5113392B2 (ja) * | 2007-01-22 | 2013-01-09 | 株式会社日本マイクロニクス | プローブおよびそれを用いた電気的接続装置 |
JP2008203036A (ja) * | 2007-02-19 | 2008-09-04 | Micronics Japan Co Ltd | 電気的接続装置 |
KR101369406B1 (ko) * | 2008-01-21 | 2014-03-04 | (주) 미코에스앤피 | 탐침 구조물 및 이를 갖는 전기적 검사 장치 |
KR100876077B1 (ko) * | 2008-04-14 | 2008-12-26 | 이억기 | 초소형 프로브 구조체 |
JP5968158B2 (ja) * | 2012-08-10 | 2016-08-10 | 株式会社日本マイクロニクス | コンタクトプローブ及びプローブカード |
JP2015032285A (ja) * | 2013-08-07 | 2015-02-16 | 三菱鉛筆株式会社 | タッチパネルに用いられるスタイラスペン |
JP6532755B2 (ja) * | 2014-07-29 | 2019-06-19 | 日置電機株式会社 | プローブユニット、プローブユニット製造方法および検査方法 |
JP2018028494A (ja) * | 2016-08-19 | 2018-02-22 | 株式会社日本マイクロニクス | 電気的接続装置及びプローブ支持体 |
JP2018179721A (ja) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN107243543A (zh) * | 2017-06-30 | 2017-10-13 | 昆山杰顺通精密组件有限公司 | 弹性探针的制造方法 |
CN109330038B (zh) * | 2018-12-24 | 2021-05-11 | 常州市派腾电子技术服务有限公司 | 雾化器及电子烟 |
-
2019
- 2019-03-29 JP JP2019065829A patent/JP7393873B2/ja active Active
-
2020
- 2020-02-05 TW TW109103447A patent/TWI743670B/zh active
- 2020-02-20 KR KR1020200020772A patent/KR102265641B1/ko active Active
- 2020-03-25 CN CN202010216399.2A patent/CN111751584B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011117761A (ja) | 2009-12-01 | 2011-06-16 | Japan Electronic Materials Corp | プローブカードおよびプローブカードの製造方法 |
JP2016148566A (ja) | 2015-02-12 | 2016-08-18 | 日本電子材料株式会社 | プローブカード |
Also Published As
Publication number | Publication date |
---|---|
JP2020165773A (ja) | 2020-10-08 |
CN111751584B (zh) | 2024-02-09 |
CN111751584A (zh) | 2020-10-09 |
TW202104906A (zh) | 2021-02-01 |
KR102265641B1 (ko) | 2021-06-16 |
KR20200115103A (ko) | 2020-10-07 |
TWI743670B (zh) | 2021-10-21 |
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