JP7383464B2 - 音響振動板、及び音響振動板の製造方法 - Google Patents
音響振動板、及び音響振動板の製造方法 Download PDFInfo
- Publication number
- JP7383464B2 JP7383464B2 JP2019213495A JP2019213495A JP7383464B2 JP 7383464 B2 JP7383464 B2 JP 7383464B2 JP 2019213495 A JP2019213495 A JP 2019213495A JP 2019213495 A JP2019213495 A JP 2019213495A JP 7383464 B2 JP7383464 B2 JP 7383464B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- acoustic diaphragm
- resin film
- metal foil
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005992 thermoplastic resin Polymers 0.000 claims description 103
- 239000011888 foil Substances 0.000 claims description 87
- 229910052751 metal Inorganic materials 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 76
- 229920001721 polyimide Polymers 0.000 claims description 26
- 230000005484 gravity Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 238000003475 lamination Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000013441 quality evaluation Methods 0.000 description 4
- 229920001646 UPILEX Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000491 Polyphenylsulfone Polymers 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- 239000012814 acoustic material Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/025—Diaphragms comprising polymeric materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/027—Diaphragms comprising metallic materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Laminated Bodies (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019213495A JP7383464B2 (ja) | 2019-11-26 | 2019-11-26 | 音響振動板、及び音響振動板の製造方法 |
| EP20892453.0A EP4068803A4 (de) | 2019-11-26 | 2020-11-13 | Akustische vibrationsplatte und verfahren für die herstellung einer akustischen vibrationsplatte |
| CN202080081492.5A CN114731470A (zh) | 2019-11-26 | 2020-11-13 | 声学振动板及声学振动板的制造方法 |
| PCT/JP2020/042412 WO2021106628A1 (ja) | 2019-11-26 | 2020-11-13 | 音響振動板、及び音響振動板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019213495A JP7383464B2 (ja) | 2019-11-26 | 2019-11-26 | 音響振動板、及び音響振動板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021087067A JP2021087067A (ja) | 2021-06-03 |
| JP7383464B2 true JP7383464B2 (ja) | 2023-11-20 |
Family
ID=76088145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019213495A Active JP7383464B2 (ja) | 2019-11-26 | 2019-11-26 | 音響振動板、及び音響振動板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4068803A4 (de) |
| JP (1) | JP7383464B2 (de) |
| CN (1) | CN114731470A (de) |
| WO (1) | WO2021106628A1 (de) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001313993A (ja) | 2000-04-28 | 2001-11-09 | Fujitsu Ten Ltd | 薄形平板スピーカの振動板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5336096Y2 (de) * | 1972-08-15 | 1978-09-04 | ||
| JPS5558698A (en) * | 1978-10-25 | 1980-05-01 | Toshiba Corp | Speaker diaphragm |
| JP3911935B2 (ja) * | 1999-11-19 | 2007-05-09 | 松下電器産業株式会社 | スピーカ |
| JP4389338B2 (ja) | 2000-03-28 | 2009-12-24 | 宇部興産株式会社 | フレキシブル金属箔積層体の製造法 |
| JP4756393B2 (ja) * | 2008-05-28 | 2011-08-24 | オンキヨー株式会社 | スピーカー振動板およびこれを用いた動電型スピーカー |
| WO2013021893A1 (ja) * | 2011-08-09 | 2013-02-14 | 宇部日東化成株式会社 | 積層体製造装置及び積層体の製造方法 |
| JP2017189894A (ja) * | 2016-04-12 | 2017-10-19 | 宇部エクシモ株式会社 | 金属積層体及び金属成形体 |
-
2019
- 2019-11-26 JP JP2019213495A patent/JP7383464B2/ja active Active
-
2020
- 2020-11-13 CN CN202080081492.5A patent/CN114731470A/zh active Pending
- 2020-11-13 EP EP20892453.0A patent/EP4068803A4/de active Pending
- 2020-11-13 WO PCT/JP2020/042412 patent/WO2021106628A1/ja unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001313993A (ja) | 2000-04-28 | 2001-11-09 | Fujitsu Ten Ltd | 薄形平板スピーカの振動板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114731470A (zh) | 2022-07-08 |
| JP2021087067A (ja) | 2021-06-03 |
| WO2021106628A1 (ja) | 2021-06-03 |
| EP4068803A4 (de) | 2023-12-20 |
| EP4068803A1 (de) | 2022-10-05 |
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