JP7382621B2 - 基板洗浄装置 - Google Patents
基板洗浄装置 Download PDFInfo
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- JP7382621B2 JP7382621B2 JP2019089277A JP2019089277A JP7382621B2 JP 7382621 B2 JP7382621 B2 JP 7382621B2 JP 2019089277 A JP2019089277 A JP 2019089277A JP 2019089277 A JP2019089277 A JP 2019089277A JP 7382621 B2 JP7382621 B2 JP 7382621B2
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- substrate
- cylindrical member
- cleaning liquid
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- 239000000758 substrate Substances 0.000 title claims description 337
- 238000004140 cleaning Methods 0.000 title claims description 146
- 239000007788 liquid Substances 0.000 claims description 92
- 230000002093 peripheral effect Effects 0.000 claims description 82
- 239000007921 spray Substances 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 description 14
- 230000007723 transport mechanism Effects 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000032258 transport Effects 0.000 description 5
- 239000003595 mist Substances 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
また、本発明の態様では、天面に基板を吸着する吸着部を有し、前記基板の外周部が前記吸着部から径方向外側に突出した状態で前記基板を保持しかつ鉛直軸周りに回転する基板支持部と、前記基板の上面に洗浄液を供給する上部供給部と、前記基板支持部の径方向外側に設けられ、前記基板の外周部の下面に対して洗浄液を吹き付ける下部供給部と、前記基板支持部の径方向外側、かつ前記下部供給部の径方向内側に設けられ、前記基板の下側で上下方向に延びる筒状部材と、を備える基板洗浄装置が提供される。
Claims (11)
- 天面に基板を吸着する吸着部を有し、前記基板の外周部が前記吸着部から径方向外側に突出した状態で前記基板を保持しかつ鉛直軸周りに回転する基板支持部と、
前記基板の上面に洗浄液を供給する上部供給部と、
前記基板支持部の径方向外側に設けられ、前記基板の外周部の下面に対して洗浄液を吹き付ける下部供給部と、
前記基板支持部の径方向外側、かつ前記下部供給部の径方向内側に設けられ、前記基板の下側で上下方向に延びる筒状部材と、を備え、
前記基板は、矩形状であり、
前記基板支持部で前記基板を保持した際、平面視で前記基板の4つの角部が前記基板支持部から外側にはみ出した状態となり、
前記基板支持部から径方向外側に向かって延びるように設けられ、前記角部を支持する基板外周支持部をさらに備えており、
前記基板外周支持部は、アーム本体とアーム基部とを有し、
前記筒状部材は、前記アーム本体と前記アーム基部との間に配置され、
前記アーム基部は、前記基板の4つの角部に対応する前記基板支持部の外周部に固定され、
前記アーム本体は、前記アーム基部に対応する4個所から、前記基板の角部に向かって延びるよう前記アーム基部とで前記筒状部材を挟んで連結して成る、基板洗浄装置。 - 前記基板支持部は、円盤状である、請求項1に記載の基板洗浄装置。
- 前記筒状部材は、前記基板支持部の外周面との間に、径方向に間隔をあけて設けられている、請求項1又は請求項2に記載の基板洗浄装置。
- 前記筒状部材は、上端が前記基板の下面との間に隙間をあけて設けられている、請求項1から請求項3のいずれか一項に記載の基板洗浄装置。
- 前記筒状部材は、前記基板支持部に支持され、前記基板支持部と一体で回転する、請求項1から請求項4のいずれか一項に記載の基板洗浄装置。
- 前記筒状部材は、鉛直軸周りにおける周方向の複数個所に設けられて基端が前記基板支持部に固定された支持部材によって支持されている、請求項5に記載の基板洗浄装置。
- 前記基板支持部の外周面と前記筒状部材との間において前記基板の下面に洗浄液を吹き付ける内周側供給部をさらに備える、請求項1から請求項6のいずれか一項に記載の基板洗浄装置。
- 前記内周側供給部は、前記下部供給部に対して鉛直軸周りの位置がずれている、請求項7に記載の基板洗浄装置。
- 前記内周側供給部で吹き付ける洗浄液の流量は、前記下部供給部で吹き付ける洗浄液の流量よりも少ない、請求項7又は請求項8に記載の基板洗浄装置。
- 前記内周側供給部は、前記筒状部材の径方向外側に配置された本体部と、前記本体部から前記筒状部材の下方を介して前記筒状部材の径方向内側に延び、前記基板の下面に洗浄液を吹き付けるノズルと、を備える、請求項7から請求項9のいずれか一項に記載の基板洗浄装置。
- 前記基板支持部、前記上部供給部、前記下部供給部、及び前記筒状部材を収容し、前記基板支持部に対して前記基板を搬入又は搬出するための開口部を有するケースを備える、請求項1から請求項10のいずれか一項に記載の基板洗浄装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019089277A JP7382621B2 (ja) | 2019-05-09 | 2019-05-09 | 基板洗浄装置 |
TW109106857A TW202103803A (zh) | 2019-05-09 | 2020-03-03 | 基板洗淨裝置 |
KR1020200036287A KR20200130094A (ko) | 2019-05-09 | 2020-03-25 | 기판 세정 장치 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2019089277A JP7382621B2 (ja) | 2019-05-09 | 2019-05-09 | 基板洗浄装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020188034A JP2020188034A (ja) | 2020-11-19 |
JP7382621B2 true JP7382621B2 (ja) | 2023-11-17 |
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JP2019089277A Active JP7382621B2 (ja) | 2019-05-09 | 2019-05-09 | 基板洗浄装置 |
Country Status (3)
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JP (1) | JP7382621B2 (ja) |
KR (1) | KR20200130094A (ja) |
TW (1) | TW202103803A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7422383B2 (ja) * | 2019-05-09 | 2024-01-26 | Aiメカテック株式会社 | 基板支持装置及び基板洗浄装置 |
CN113035743B (zh) * | 2021-02-25 | 2022-01-25 | 无锡亚电智能装备有限公司 | 一种逐步抬升晶圆的晶圆清洗方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000035681A (ja) | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 現像装置及び現像方法 |
JP2000331974A (ja) | 1999-05-21 | 2000-11-30 | Sony Corp | 基板回転処理装置 |
JP2002204999A (ja) | 2001-01-05 | 2002-07-23 | Shibaura Mechatronics Corp | スピン処理装置 |
JP2004022783A (ja) | 2002-06-17 | 2004-01-22 | Sharp Corp | 処理装置 |
JP2004146587A (ja) | 2002-10-24 | 2004-05-20 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
JP2015138859A (ja) | 2014-01-22 | 2015-07-30 | 三菱電機株式会社 | ウエハチャックおよびウエハチャック補助具 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4540457B2 (ja) | 2004-12-03 | 2010-09-08 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2019
- 2019-05-09 JP JP2019089277A patent/JP7382621B2/ja active Active
-
2020
- 2020-03-03 TW TW109106857A patent/TW202103803A/zh unknown
- 2020-03-25 KR KR1020200036287A patent/KR20200130094A/ko not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000035681A (ja) | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 現像装置及び現像方法 |
JP2000331974A (ja) | 1999-05-21 | 2000-11-30 | Sony Corp | 基板回転処理装置 |
JP2002204999A (ja) | 2001-01-05 | 2002-07-23 | Shibaura Mechatronics Corp | スピン処理装置 |
JP2004022783A (ja) | 2002-06-17 | 2004-01-22 | Sharp Corp | 処理装置 |
JP2004146587A (ja) | 2002-10-24 | 2004-05-20 | Shibaura Mechatronics Corp | スピン処理装置及びスピン処理方法 |
JP2015138859A (ja) | 2014-01-22 | 2015-07-30 | 三菱電機株式会社 | ウエハチャックおよびウエハチャック補助具 |
Also Published As
Publication number | Publication date |
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KR20200130094A (ko) | 2020-11-18 |
TW202103803A (zh) | 2021-02-01 |
JP2020188034A (ja) | 2020-11-19 |
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