JP7381335B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP7381335B2 JP7381335B2 JP2019235773A JP2019235773A JP7381335B2 JP 7381335 B2 JP7381335 B2 JP 7381335B2 JP 2019235773 A JP2019235773 A JP 2019235773A JP 2019235773 A JP2019235773 A JP 2019235773A JP 7381335 B2 JP7381335 B2 JP 7381335B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating
- section
- semiconductor
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 106
- 239000012212 insulator Substances 0.000 claims description 5
- 239000011800 void material Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 239000005368 silicate glass Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 73
- 238000004519 manufacturing process Methods 0.000 description 24
- 238000009792 diffusion process Methods 0.000 description 19
- 239000012535 impurity Substances 0.000 description 15
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 230000003071 parasitic effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000005380 borophosphosilicate glass Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/407—Recessed field plates, e.g. trench field plates, buried field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66484—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with multiple gate, at least one gate being an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66553—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using inside spacers, permanent or not
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66666—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
- H01L29/7828—Vertical transistors without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
Description
Claims (5)
- 第1電極と、
前記第1電極に対向して設けられる第2電極と、
前記第1電極と前記第2電極との間に設けられる半導体部と、
前記半導体部中に設けられる第3電極と、
前記第1電極と前記第3電極との間において、前記半導体部中に設けられる第4電極と、
前記半導体部と前記第3電極との間に設けられ、前記半導体部から前記第3電極を電気的に絶縁する第1絶縁部と、
前記第2電極と前記第3電極との間に設けられ、前記第2電極から前記第3電極を電気的に絶縁する第2絶縁部と、
前記半導体部と前記第4電極との間に設けられ、前記半導体部から前記第4電極を電気的に絶縁する第3絶縁部と、
前記第3電極と前記第4電極との間に設けられ、前記第3電極から前記第4電極を電気的に絶縁する第4絶縁部と、
前記第4電極内に位置し、前記第1電極から前記第2電極に向かう第1方向に延伸する第5絶縁部と、
を備え、
前記半導体部は、第1導電形の第1半導体層と、第2導電形の第2半導体層と、前記第1導電形の第3半導体層と、を含み、
前記第2半導体層は、前記第1半導体層と前記第2電極との間に設けられ、前記第1絶縁部を介して前記第3電極に向き合い、
前記第3半導体層は、前記第2半導体層と前記第2電極との間に設けられ、前記第1絶縁部に接する位置に配置され、
前記第3電極は、前記第1方向と交差する第2方向に並んだ第1制御部および第2制御部を含み、
前記第4絶縁部は、前記第1制御部と前記第2制御部と間に延伸し、前記第2絶縁部につながるように設けられ、
前記第5絶縁部は、前記第4電極中から前記第1制御部と前記第2制御部との間に延伸する絶縁体を含む半導体装置。 - 前記第4電極は、前記第1電極と前記第5絶縁部との間に位置する底部と、前記底部から前記第1方向に延びる側壁部と、を有し、
前記絶縁体は、前記第4電極の前記底部および前記側壁部に囲まれた部分から前記第3電極の前記第1制御部と前記第2制御部との間に延伸する請求項1記載の半導体装置。 - 前記第3電極は、前記第1制御部と前記第2制御部との間に位置する中間部をさらに含み、
前記第4電極は、前記第1電極と前記第3電極の前記中間部との間に位置し、
前記第4絶縁部は、前記第1制御部と前記中間部との間、および、前記第2制御部と前記中間部との間に延伸し、
前記絶縁体は、前記第4電極中から前記第3電極の前記中間部まで延伸する請求項1または2に記載の半導体装置。 - 前記絶縁体は、ボロンおよびリンを含むシリケートガラスである請求項1~3のいずれか1つに記載の半導体装置。
- 前記第5絶縁部は、空隙を含む請求項1~4のいずれか1つに記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019235773A JP7381335B2 (ja) | 2019-12-26 | 2019-12-26 | 半導体装置 |
CN202010799886.6A CN113053995A (zh) | 2019-12-26 | 2020-08-11 | 半导体装置 |
US17/005,694 US11430884B2 (en) | 2019-12-26 | 2020-08-28 | Semiconductor device |
US17/865,246 US11824112B2 (en) | 2019-12-26 | 2022-07-14 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019235773A JP7381335B2 (ja) | 2019-12-26 | 2019-12-26 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021106179A JP2021106179A (ja) | 2021-07-26 |
JP7381335B2 true JP7381335B2 (ja) | 2023-11-15 |
Family
ID=76507631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019235773A Active JP7381335B2 (ja) | 2019-12-26 | 2019-12-26 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11430884B2 (ja) |
JP (1) | JP7381335B2 (ja) |
CN (1) | CN113053995A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7249269B2 (ja) * | 2019-12-27 | 2023-03-30 | 株式会社東芝 | 半導体装置およびその製造方法 |
US11437507B2 (en) * | 2020-08-04 | 2022-09-06 | Semiconductor Components Industries, Llc | Semiconductor devices with low resistance gate and shield electrodes and methods |
US11444167B2 (en) * | 2020-11-18 | 2022-09-13 | Advanced Power Electronics Corp. | Method of manufacturing trench type semiconductor device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007512700A (ja) | 2003-11-29 | 2007-05-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | トレンチ絶縁ゲート電界効果トランジスタ |
US20120313161A1 (en) | 2011-06-13 | 2012-12-13 | Grivna Gordon M | Semiconductor device with enhanced mobility and method |
JP2013115225A (ja) | 2011-11-29 | 2013-06-10 | Toshiba Corp | 電力用半導体装置およびその製造方法 |
US20150008515A1 (en) | 2012-07-13 | 2015-01-08 | Ubiq Semiconductor Corp. | Trench gate mosfet |
US20160300914A1 (en) | 2012-03-26 | 2016-10-13 | Infineon Technologies Austria Ag | Method for Forming a Stress-Reduced Field-Effect Semiconductor Device |
JP2019176104A (ja) | 2018-03-29 | 2019-10-10 | トヨタ自動車株式会社 | スイッチング素子 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005041285B4 (de) * | 2005-08-31 | 2009-06-25 | Infineon Technologies Ag | Grabenstrukturhalbleitereinrichtung und Verfahren zu deren Herstellung |
DE102007004323A1 (de) | 2007-01-29 | 2008-07-31 | Infineon Technologies Austria Ag | Bauelementanordnung mit einem eine Feldelektrode aufweisenden MOS-Transistor |
JP5183959B2 (ja) * | 2007-04-23 | 2013-04-17 | 新日本無線株式会社 | Mosfet型半導体装置の製造方法 |
JP5627494B2 (ja) * | 2011-02-09 | 2014-11-19 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP2013065774A (ja) | 2011-09-20 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
US8796760B2 (en) * | 2012-03-14 | 2014-08-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor and method of manufacturing the same |
JP2014146666A (ja) * | 2013-01-28 | 2014-08-14 | Toshiba Corp | 半導体装置 |
JP5799046B2 (ja) * | 2013-03-22 | 2015-10-21 | 株式会社東芝 | 半導体装置 |
JP2014225693A (ja) * | 2014-08-04 | 2014-12-04 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP6203697B2 (ja) * | 2014-09-30 | 2017-09-27 | 株式会社東芝 | 半導体装置およびその製造方法 |
DE102017107020B3 (de) * | 2017-03-31 | 2018-07-05 | Infineon Technologies Ag | Halbleitervorrichtung mit einer feldelektrode und einer gateelektrode in einer grabenstruktur und herstellungsverfahren |
JP6744270B2 (ja) | 2017-09-20 | 2020-08-19 | 株式会社東芝 | 半導体装置及びその製造方法 |
US10600879B2 (en) * | 2018-03-12 | 2020-03-24 | Nxp Usa, Inc. | Transistor trench structure with field plate structures |
JP6818712B2 (ja) * | 2018-03-22 | 2021-01-20 | 株式会社東芝 | 半導体装置 |
JP7352360B2 (ja) | 2019-02-12 | 2023-09-28 | 株式会社東芝 | 半導体装置 |
-
2019
- 2019-12-26 JP JP2019235773A patent/JP7381335B2/ja active Active
-
2020
- 2020-08-11 CN CN202010799886.6A patent/CN113053995A/zh active Pending
- 2020-08-28 US US17/005,694 patent/US11430884B2/en active Active
-
2022
- 2022-07-14 US US17/865,246 patent/US11824112B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007512700A (ja) | 2003-11-29 | 2007-05-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | トレンチ絶縁ゲート電界効果トランジスタ |
US20120313161A1 (en) | 2011-06-13 | 2012-12-13 | Grivna Gordon M | Semiconductor device with enhanced mobility and method |
JP2013115225A (ja) | 2011-11-29 | 2013-06-10 | Toshiba Corp | 電力用半導体装置およびその製造方法 |
US20160300914A1 (en) | 2012-03-26 | 2016-10-13 | Infineon Technologies Austria Ag | Method for Forming a Stress-Reduced Field-Effect Semiconductor Device |
US20150008515A1 (en) | 2012-07-13 | 2015-01-08 | Ubiq Semiconductor Corp. | Trench gate mosfet |
JP2019176104A (ja) | 2018-03-29 | 2019-10-10 | トヨタ自動車株式会社 | スイッチング素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2021106179A (ja) | 2021-07-26 |
US20210202736A1 (en) | 2021-07-01 |
US20220352367A1 (en) | 2022-11-03 |
US11824112B2 (en) | 2023-11-21 |
US11430884B2 (en) | 2022-08-30 |
CN113053995A (zh) | 2021-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7381335B2 (ja) | 半導体装置 | |
US20160211348A1 (en) | Trench lateral diffusion metal oxide semiconductor device and manufacturing method of the same | |
JP7383760B2 (ja) | 半導体装置 | |
CN110299411B (zh) | 半导体装置 | |
CN107887446B (zh) | 复合屏蔽自对准的沟槽mosfet器件的制备方法 | |
US20130221431A1 (en) | Semiconductor device and method of manufacture thereof | |
JP7249269B2 (ja) | 半導体装置およびその製造方法 | |
US8872244B1 (en) | Contact structure employing a self-aligned gate cap | |
US20130221498A1 (en) | Semiconductor device and method for manufacturing the same | |
JP7252860B2 (ja) | 半導体装置 | |
JP4992211B2 (ja) | 半導体素子の製造方法 | |
JP7365306B2 (ja) | 半導体装置 | |
JP7256770B2 (ja) | 半導体装置 | |
CN109411536B (zh) | 具有周围有基础绝缘结构的有源柱的半导体装置 | |
TWI567977B (zh) | 金氧半場效電晶體及其製造方法 | |
JP2012059781A (ja) | 半導体装置及びその製造方法 | |
JP5388495B2 (ja) | 半導体装置 | |
JP2009081427A (ja) | 半導体装置および半導体装置の製造方法 | |
JP7246287B2 (ja) | 半導体装置およびその製造方法 | |
JP5502468B2 (ja) | 半導体装置の製造方法および半導体装置 | |
JP2009176953A (ja) | 半導体装置 | |
CN115910795B (zh) | 一种屏蔽栅功率器件及其制备方法 | |
CN113782429B (zh) | 用于掺杂区的导电通道的制造方法、沟槽型mosfet器件及其制造方法 | |
JP2018081949A (ja) | 半導体装置及びその製造方法 | |
JP2022135310A (ja) | 半導体装置およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211207 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221019 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221021 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20221216 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230208 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230516 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7421 Effective date: 20230623 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230704 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20231005 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231102 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7381335 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |