JP7379135B2 - 熱処理装置 - Google Patents
熱処理装置 Download PDFInfo
- Publication number
- JP7379135B2 JP7379135B2 JP2019229861A JP2019229861A JP7379135B2 JP 7379135 B2 JP7379135 B2 JP 7379135B2 JP 2019229861 A JP2019229861 A JP 2019229861A JP 2019229861 A JP2019229861 A JP 2019229861A JP 7379135 B2 JP7379135 B2 JP 7379135B2
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- Prior art keywords
- heat treatment
- transport
- opening
- rod
- treatment furnace
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- 238000010438 heat treatment Methods 0.000 title claims description 105
- 238000012546 transfer Methods 0.000 claims description 74
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
- F27D2007/063—Special atmospheres, e.g. high pressure atmospheres
Description
図1(A)、図1(B)、図2に示すように、熱処理装置10は、熱処理炉20、搬送室30、搬送用ロッド41、搬送用ロッド42、搬送装置50、および、切替装置60を備える。
図4(A)、図4(B)は、搬送用ロッドおよび支持部材の挙動を示す図である。図4(A)は、支持部材によって被処理物を支持する第1態様を示し、図4(B)は、支持部材によって被処理物が支持されていない第2態様を示す。
なお、上述の説明では、搬送用ロッド41、42を回転させることによって、高さ方向(z方向)における支持部材412、422の先端の位置を変化させる態様を示した。しかしながら、他の構成によって、高さ方向における支持部材412、422の先端の位置を変化させることもできる。図9(A)、図9(B)は、支持部材の別の一例を概念的に示す図である。図9(A)、図9(B)は、支持部材の第1端部側から視た図である。
20:熱処理炉
21:前壁
30:搬送室
31:前壁
32:遮熱壁
39:投入口
41,42:搬送用ロッド
50:搬送装置
51:ロッド保持部材
60:切替装置
63:結合板
200:熱処理炉20の内部空間
201:開口
230:処理台
240:熱源
300:搬送室30の内部空間
301:開口
302:開口
411:搬送用ロッド41の側面
412,422:支持部材
421:搬送用ロッド42の側面
423:支持部材422の外周端
601:軸部材
602:アクチュエータ
611:シャフト
612:摺動板
613:摺動板612の溝
614:ピン
621:シャフト
622:摺動板
623:摺動板622の溝
624:ピン
4111:搬送用ロッド41の第1端部
4112:搬送用ロッド41の第2端部
4211:搬送用ロッド42の第1端部
4212:搬送用ロッド42の第2端部
WK:被処理物
Claims (6)
- 被処理物が搬送される第1開口を有し、前記被処理物を熱処理する熱処理炉と、
前記熱処理炉の内外に移動可能であり、前記熱処理炉側の第1端部と前記熱処理炉と反対側の第2端部とを備え、前記第1開口を挿通する棒状の搬送用ロッドと、
前記第2端部に接続され、前記第1端部を前記熱処理炉内に移動させる搬送装置と、
前記第1端部に配置され、前記搬送用ロッドの上端よりも上側に突出し、前記被処理物が載置可能な第1態様と、前記上端よりも下側に配置される第2態様とが切り替えられる支持部材と、
前記搬送用ロッドを介して前記支持部材の前記第1態様と前記第2態様とを切り替える切替装置と、
を備える、
熱処理装置。 - 前記支持部材は、前記第1端部の側面に配置された棒状体である、
請求項1に記載の熱処理装置。 - 前記切替装置は、前記第2端部に接続され、前記搬送用ロッドを前記側面に沿った方向に回転させる回転補助機構を備える、
請求項2に記載の熱処理装置。 - 前記第1開口を介して前記熱処理炉に接続し、前記第1開口と反対側の壁に第2開口を有する搬送室を備え、
前記搬送用ロッドは、前記第1開口と前記第2開口を挿通して移動する、
請求項1乃至請求項3のいずれかに記載の熱処理装置。 - 前記搬送室は、前記被処理物が投入される、開閉可能な投入口を備え、
前記投入口は閉じられた状態において、前記搬送室の雰囲気は、不活性ガスによって置換される、
請求項4に記載の熱処理装置。 - 前記第2開口は、前記搬送用ロッドの外形に沿った形状である、
請求項4または請求項5に記載の熱処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019229861A JP7379135B2 (ja) | 2019-12-20 | 2019-12-20 | 熱処理装置 |
TW109138342A TW202124897A (zh) | 2019-12-20 | 2020-11-04 | 熱處理裝置 |
KR1020200164722A KR20210080209A (ko) | 2019-12-20 | 2020-11-30 | 열처리장치 |
CN202011493831.9A CN113008032B (zh) | 2019-12-20 | 2020-12-17 | 热处理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019229861A JP7379135B2 (ja) | 2019-12-20 | 2019-12-20 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021099170A JP2021099170A (ja) | 2021-07-01 |
JP7379135B2 true JP7379135B2 (ja) | 2023-11-14 |
Family
ID=76383643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019229861A Active JP7379135B2 (ja) | 2019-12-20 | 2019-12-20 | 熱処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7379135B2 (ja) |
KR (1) | KR20210080209A (ja) |
CN (1) | CN113008032B (ja) |
TW (1) | TW202124897A (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191412A (ja) | 2003-12-26 | 2005-07-14 | Hitachi Kokusai Electric Inc | 基板処理装置及び基板の製造方法 |
JP2007225173A (ja) | 2006-02-22 | 2007-09-06 | Ngk Insulators Ltd | 熱処理炉及び太陽電池セル |
JP2011156654A (ja) | 2010-02-02 | 2011-08-18 | Samsung Mobile Display Co Ltd | 基板移送ロボット |
JP2012064852A (ja) | 2010-09-17 | 2012-03-29 | Toyota Motor Corp | 基板の熱処理方法および熱処理装置 |
JP2016200378A (ja) | 2015-04-14 | 2016-12-01 | 株式会社デンソー | 加熱装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1281747C (en) * | 1987-03-30 | 1991-03-19 | Herbert E. Gladish | Load accumulating system |
JP2700817B2 (ja) * | 1989-04-04 | 1998-01-21 | 本田技研工業株式会社 | パレット搬送転換装置 |
JPH07161652A (ja) | 1993-12-10 | 1995-06-23 | Kosho Seisakusho:Kk | 高温熱処理炉及び炉内搬送装置 |
IT1404530B1 (it) * | 2011-02-24 | 2013-11-22 | Comau Spa | Robot manipolatore. |
CN105318724B (zh) * | 2015-11-30 | 2017-07-25 | 郑州轻工业学院 | 一种大型熔炼炉用均匀自动加料装置 |
JP6298569B1 (ja) * | 2017-10-20 | 2018-03-20 | 株式会社松浦機械製作所 | パレット交換装置 |
CN108069235A (zh) * | 2017-12-22 | 2018-05-25 | 大连佳林设备制造有限公司 | 卷料自动翻转卸料机 |
CN208036285U (zh) * | 2018-01-18 | 2018-11-02 | 中车长春轨道客车股份有限公司 | 货运动车智能装载系统及智能货运动车 |
CN208171030U (zh) * | 2018-05-07 | 2018-11-30 | 无锡亿帆管业有限公司 | 步进炉加料装置 |
-
2019
- 2019-12-20 JP JP2019229861A patent/JP7379135B2/ja active Active
-
2020
- 2020-11-04 TW TW109138342A patent/TW202124897A/zh unknown
- 2020-11-30 KR KR1020200164722A patent/KR20210080209A/ko active Search and Examination
- 2020-12-17 CN CN202011493831.9A patent/CN113008032B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191412A (ja) | 2003-12-26 | 2005-07-14 | Hitachi Kokusai Electric Inc | 基板処理装置及び基板の製造方法 |
JP2007225173A (ja) | 2006-02-22 | 2007-09-06 | Ngk Insulators Ltd | 熱処理炉及び太陽電池セル |
JP2011156654A (ja) | 2010-02-02 | 2011-08-18 | Samsung Mobile Display Co Ltd | 基板移送ロボット |
JP2012064852A (ja) | 2010-09-17 | 2012-03-29 | Toyota Motor Corp | 基板の熱処理方法および熱処理装置 |
JP2016200378A (ja) | 2015-04-14 | 2016-12-01 | 株式会社デンソー | 加熱装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2021099170A (ja) | 2021-07-01 |
KR20210080209A (ko) | 2021-06-30 |
CN113008032A (zh) | 2021-06-22 |
CN113008032B (zh) | 2024-02-06 |
TW202124897A (zh) | 2021-07-01 |
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