JP7377961B2 - 窒化珪素基板の製造方法 - Google Patents
窒化珪素基板の製造方法 Download PDFInfo
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- JP7377961B2 JP7377961B2 JP2022517842A JP2022517842A JP7377961B2 JP 7377961 B2 JP7377961 B2 JP 7377961B2 JP 2022517842 A JP2022517842 A JP 2022517842A JP 2022517842 A JP2022517842 A JP 2022517842A JP 7377961 B2 JP7377961 B2 JP 7377961B2
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- silicon nitride
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- 229910052581 Si3N4 Inorganic materials 0.000 title claims description 38
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 title claims description 36
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 claims description 49
- 239000000203 mixture Substances 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 33
- 239000000919 ceramic Substances 0.000 claims description 31
- 239000000654 additive Substances 0.000 claims description 22
- 239000002002 slurry Substances 0.000 claims description 22
- 230000000996 additive effect Effects 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 16
- 238000000498 ball milling Methods 0.000 claims description 13
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 12
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 12
- 238000005238 degreasing Methods 0.000 claims description 11
- 239000000395 magnesium oxide Substances 0.000 claims description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 10
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 7
- 239000004014 plasticizer Substances 0.000 claims description 7
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 230000000295 complement effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
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- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
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- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
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Description
特に、高出力用パワー素子として使用されるセラミック基板は、高い絶縁性、高い耐電圧性、高い熱伝導率、高い強度、及び低い誘電率が要求される。このような要求に適合なセラミック基板としては、窒化アルミニウム基板、アルミナ基板、窒化珪素基板等がある。
窒化珪素Si3N4基板は高強度(500MPa乃至800MPa)、高粘り強さ(5MPa・m乃至8MPa・m)、及びシリコン(Si)との熱膨張係数整合性が優秀である。さらに窒化珪素(Si3N4)基板は高い熱伝導率(70W/mK乃至170W/mK)を有する。即ち、窒化珪素(Si3N4)基板は次世代高出力パワー素子の素材で適合である。
本明細書の多様な実施形態で第1、第2、第3等の用語が多様な構成要素を技術するために使用されたが、これらの構成要素がこのような用語によって限定されてはならない。これらの用語は単なる一構成要素を他の構成要素と区別させるために使用されただけである。ここに説明され、例示される実施形態はそれの相補的な実施形態も含む。
本明細書で使用された用語は実施形態を説明するためのものであり、本発明を制限しようとすることではない。本明細書で、単数形は文句で特別に言及しない限り、複数形も含む。明細書で使用される‘含む(comprises)’及び/又は‘包含する(comprising)’は言及された構成要素は1つ以上の他の構成要素の存在又は追加を排除しない。
混合が完了された後、第1ボールBA1を除去することができる。第1混合物MI1を乾燥して、溶媒を全て蒸発させることができる。結果的に、粉末形態のセラミック添加剤SAを得ることができる(S110)。セラミック添加剤SAはイットリウム酸化物(Y2O3)、マグネシウム酸化物(MgO)、及びジルコニウム酸化物(ZrO2)を含むことができる。本発明の他の実施形態として、セラミック添加剤SAは内でジルコニウム酸化物(ZrO2)が省略されてもよい。
第2容器CON2の溶媒SVに、窒化珪素(Si3N4)粉末SNP、セラミック添加剤SA、及び分散剤DISを入れて第2混合物MI2が用意されることができる。セラミック添加剤SAは先に第1段階(S110)を通じて用意される。分散剤DISは商用の分散剤DISを使用することができ、例えばBYK-111を使用することができる。
積層シートSSHを加圧することができる。前記加圧工程は、温間静水圧プレス(Warm Isostatic Press、WIP)を利用することができる。前記加圧工程は約30MPaの圧力及び約70℃の温度で遂行される。最終的に、積層シートSSHの厚さTHは0.3mm乃至4mmである。
るつぼCRUを加熱して、積層構造体SSに焼結工程が遂行されることができる(S170)。したがって、積層シートSSHが焼結されて、窒化珪素基板が形成されることができる。前記焼結工程は約1900℃の温度で約6時間の間に遂行されることができる。前記焼結工程は窒素雰囲気で遂行されることができる。先に説明したように、積層シートSSHの底面上に第1ギャップGA1及び積層シートSSHの上面上に第2ギャップGA2が確保されることができる。積層シートSSHが下部プレートPLT1と上部プレートPLT2によってサンドイッチされても、第1ギャップGA1及び第2ギャップGA2を通じて焼結工程が円滑に遂行されることができる。
BA1 第1ボール
BA2 第2ボール
BI バインダー
BNP ベッディング粉末
CON1 第1容器
CON2 第2容器
CRU るつぼ
DIS 分散剤
GA1 第1ギャップ
GA2 第2ギャップ
MI1 第1混合物
MI2 第2混合物
MI3 第3混合物
PI ピッチ
PL 可塑剤
PLT1 下部プレート
PLT2 上部プレート
PP 突出部
RS リセス
SA セラミック添加剤
SH シート
SIT 攪拌器
SL スラリー
SNP 窒化珪素粉末
SS 積層構造体
SSH 積層シート
SV 溶媒
TH 厚さ
W1 第1幅
W2 第2幅
Claims (11)
- 窒化珪素粉末、セラミック添加剤、及び溶媒を混合してスラリーを形成する段階と、
前記スラリーを成形してシートを形成する段階と、
下部プレート及び上部プレートの間に少なくとも1つの前記シートをサンドイッチして 、積層構造体を形成する段階と、
前記積層構造体に脱脂工程を遂行する段階と、
前記積層構造体に焼結工程を遂行する段階と、を含み、
前記下部プレートは、その上面上に提供された複数の第1突出部を含み、
前記上部プレートは、その下面上に提供された複数の第2突出部を含み、
前記第1及び第2突出部は、一方向に互いに平行に延長され、
互いに隣接する前記第1突出部の間に第1リセスが定義され、
互いに隣接する前記第2突出部の間に第2リセスが定義され、
前記積層構造体は、前記互いに隣接する第1突出部、前記第1リセス及び前記シートの底面によって定義される第1ギャップ、および前記互いに隣接する第2突出部、前記第2リセス及び前記シートの上面によって定義される第2ギャップを含み、
前記焼結工程は、脱脂工程が行われた積層構造体をベッディング粉末内に埋めることを含み、
前記のベッディング粉末は、ボロン窒化物粉末及び窒化珪素粉末を含み、
前記のベッディング粉末は、前記第1ギャップ及び前記第2ギャップを通じて前記シートと接触することを特徴とする窒化珪素基板の製造方法。 - 前記セラミック添加剤は、イットリウム酸化物(Y2O3)、マグネシウム酸化物(MgO)、及びジルコニウム酸化物(ZrO2)を含み、
前記セラミック添加剤に対する前記イットリウム酸化物の質量比は、0.5乃至0.8であり、
前記セラミック添加剤に対する前記マグネシウム酸化物の質量比は、0.1乃至0.4であり、
前記セラミック添加剤に対する前記ジルコニウム酸化物の質量比は、0.3以下であることを特徴とする請求項1に記載の窒化珪素基板の製造方法。 - 前記スラリーを形成する段階は、バインダー及び可塑剤をさらに添加して混合することを含むことを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記スラリーを形成する段階は、
前記溶媒に前記窒化珪素粉末、前記セラミック添加剤及び分散剤を添加して第1混合物を形成することと、
前記第1混合物に第1ボールミリング工程を遂行することと、
前記第1ボールミリング工程が完了された前記第1混合物にバインダー及び可塑剤を添加して第2混合物を形成することと、
前記第2混合物に第2ボールミリング工程を遂行することと、を含むことを特徴とする請求項1に記載の窒化珪素基板の製造方法。 - 前記スラリーを成形することは、テープキャスティング工程を含むことを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記積層構造体を形成する前に、前記シートを複数積層し、ラミネーション工程を遂行して積層シートを形成する段階をさらに含むことを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記下部プレート及び前記上部プレートの各々の密度は、1.4g/cm3乃至1.7 g/cm3であることを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記下部プレート及び前記上部プレートの各々の面積は、前記シートの面積の1.00 倍乃至1.02倍であることを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記第1及び第2突出部の各々は、第1幅を有し、前記第1及び第2リセスの各々は、第2幅を有し、
前記第1幅は、4mm乃至15mmであり、
前記第2幅は、4mm乃至15mmであることを特徴とする請求項1に記載の窒化珪素基板の製造方法。 - 前記脱脂工程の間に、加熱された気体が前記第1及び第2ギャップを通じて前記シートの前記上面及び下面と接触することを特徴とする請求項1に記載の窒化珪素基板の製造方法。
- 前記第1及び第2突出部は、一定のピッチで配列されることを特徴とする請求項1に記載の窒化珪素基板の製造方法。
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