JP7374613B2 - 樹脂モールド回路体、金型、製造方法、及び回路基板 - Google Patents

樹脂モールド回路体、金型、製造方法、及び回路基板 Download PDF

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Publication number
JP7374613B2
JP7374613B2 JP2019095590A JP2019095590A JP7374613B2 JP 7374613 B2 JP7374613 B2 JP 7374613B2 JP 2019095590 A JP2019095590 A JP 2019095590A JP 2019095590 A JP2019095590 A JP 2019095590A JP 7374613 B2 JP7374613 B2 JP 7374613B2
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circuit
resin
resin molded
mold
circuit body
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JP2019095590A
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Japanese (ja)
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JP2020191372A (ja
Inventor
克美 水野
恵 佐藤
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NHK Spring Co Ltd
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NHK Spring Co Ltd
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Priority to JP2019095590A priority Critical patent/JP7374613B2/ja
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Priority to JP2023026678A priority patent/JP2023054285A/ja
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Priority to JP2024180307A priority patent/JP2024180571A/ja
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  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2019095590A 2019-05-21 2019-05-21 樹脂モールド回路体、金型、製造方法、及び回路基板 Active JP7374613B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019095590A JP7374613B2 (ja) 2019-05-21 2019-05-21 樹脂モールド回路体、金型、製造方法、及び回路基板
JP2023026678A JP2023054285A (ja) 2019-05-21 2023-02-22 回路基板の製造方法
JP2024180307A JP2024180571A (ja) 2019-05-21 2024-10-15 回路基板の製造方法

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JP2019095590A JP7374613B2 (ja) 2019-05-21 2019-05-21 樹脂モールド回路体、金型、製造方法、及び回路基板

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JP2023026678A Division JP2023054285A (ja) 2019-05-21 2023-02-22 回路基板の製造方法

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JP2020191372A JP2020191372A (ja) 2020-11-26
JP7374613B2 true JP7374613B2 (ja) 2023-11-07

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JP2019095590A Active JP7374613B2 (ja) 2019-05-21 2019-05-21 樹脂モールド回路体、金型、製造方法、及び回路基板
JP2023026678A Pending JP2023054285A (ja) 2019-05-21 2023-02-22 回路基板の製造方法
JP2024180307A Pending JP2024180571A (ja) 2019-05-21 2024-10-15 回路基板の製造方法

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JP2023026678A Pending JP2023054285A (ja) 2019-05-21 2023-02-22 回路基板の製造方法
JP2024180307A Pending JP2024180571A (ja) 2019-05-21 2024-10-15 回路基板の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451827B2 (ja) * 2022-03-30 2024-03-18 デンカ株式会社 回路基板の製造方法及び回路基板
EP4615174A4 (en) * 2022-10-31 2026-03-04 Nhk Spring Co Ltd PRINTED CIRCUIT BOARD PRODUCTION METHOD

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188200A (ja) 2001-12-14 2003-07-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004235233A (ja) 2003-01-28 2004-08-19 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2007335702A (ja) 2006-06-16 2007-12-27 Apic Yamada Corp 転写基板の製造方法
JP2008218907A (ja) 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2016184647A (ja) 2015-03-26 2016-10-20 住友ベークライト株式会社 有機樹脂基板の製造方法、有機樹脂基板および半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61258716A (ja) * 1985-05-13 1986-11-17 Japan Steel Works Ltd:The 射出成形における電子部品の金型装着方法およびその金型
JP2516650B2 (ja) * 1987-12-25 1996-07-24 古河電気工業株式会社 モ―ルド回路基板の製造方法
JPS6446997A (en) * 1988-02-16 1989-02-21 Sankyo Kasei Kk Plastic molded piece
JPWO2015174198A1 (ja) * 2014-05-13 2017-04-20 三菱電機株式会社 半導体装置とその製造方法
JP6080929B2 (ja) * 2015-10-08 2017-02-15 三菱電機株式会社 半導体モジュール
WO2019059384A1 (ja) * 2017-09-22 2019-03-28 日立化成株式会社 保護材付き厚銅回路

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188200A (ja) 2001-12-14 2003-07-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2004235233A (ja) 2003-01-28 2004-08-19 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP2007335702A (ja) 2006-06-16 2007-12-27 Apic Yamada Corp 転写基板の製造方法
JP2008218907A (ja) 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2016184647A (ja) 2015-03-26 2016-10-20 住友ベークライト株式会社 有機樹脂基板の製造方法、有機樹脂基板および半導体装置

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JP2024180571A (ja) 2024-12-26
JP2020191372A (ja) 2020-11-26
JP2023054285A (ja) 2023-04-13

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