JPS6446997A - Plastic molded piece - Google Patents

Plastic molded piece

Info

Publication number
JPS6446997A
JPS6446997A JP3172088A JP3172088A JPS6446997A JP S6446997 A JPS6446997 A JP S6446997A JP 3172088 A JP3172088 A JP 3172088A JP 3172088 A JP3172088 A JP 3172088A JP S6446997 A JPS6446997 A JP S6446997A
Authority
JP
Japan
Prior art keywords
molding
molded piece
exposed
plastic
plastic molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3172088A
Other languages
Japanese (ja)
Inventor
Tetsuo Yumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sankyo Kasei Co Ltd
Original Assignee
Sankyo Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Kasei Co Ltd filed Critical Sankyo Kasei Co Ltd
Priority to JP3172088A priority Critical patent/JPS6446997A/en
Publication of JPS6446997A publication Critical patent/JPS6446997A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Abstract

PURPOSE:To provide a plastic molded piece applicable to products having functionality such as a circuit board, connector or the like and enabling such products to be manufactured reliably at a low cost, by integrally molding a secondary molding with predetermined parts of a primary molding exposed, and plating the exposed parts. CONSTITUTION:A plastic molded piece comprises a plastic primary molding 1 the surfaces of which are wholly roughened, a plastic secondary molding 2 integrally joined to the primary molding 1 with predetermined parts 1a of the primary molding 1 exposed and plating layers 1b formed on the exposed parts 1a. Such plastic molded piece is applicable not only to planar applications but also to three-dimensional applications such as electronic components, circuit boards for example, except ornamental applications. Further, a molding material incorporating a filler such as glass fibers or the like for improving thermal resistance or strength may be used for the molded piece. Thus, a partially plated product can be manufactured reliably and still at a low cost, whether a material therefor contains a filler or not.
JP3172088A 1988-02-16 1988-02-16 Plastic molded piece Pending JPS6446997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3172088A JPS6446997A (en) 1988-02-16 1988-02-16 Plastic molded piece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3172088A JPS6446997A (en) 1988-02-16 1988-02-16 Plastic molded piece

Publications (1)

Publication Number Publication Date
JPS6446997A true JPS6446997A (en) 1989-02-21

Family

ID=12338884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3172088A Pending JPS6446997A (en) 1988-02-16 1988-02-16 Plastic molded piece

Country Status (1)

Country Link
JP (1) JPS6446997A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191372A (en) * 2019-05-21 2020-11-26 日本発條株式会社 Resin mold circuit body, mold, manufacturing method, and circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020191372A (en) * 2019-05-21 2020-11-26 日本発條株式会社 Resin mold circuit body, mold, manufacturing method, and circuit board

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