JP7356432B2 - ポリアミド及びポリアミド組成物 - Google Patents

ポリアミド及びポリアミド組成物 Download PDF

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JP7356432B2
JP7356432B2 JP2020538481A JP2020538481A JP7356432B2 JP 7356432 B2 JP7356432 B2 JP 7356432B2 JP 2020538481 A JP2020538481 A JP 2020538481A JP 2020538481 A JP2020538481 A JP 2020538481A JP 7356432 B2 JP7356432 B2 JP 7356432B2
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polyamide
mass
polyamide composition
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JPWO2020040282A5 (cg-RX-API-DMAC7.html
JPWO2020040282A1 (ja
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健治 關口
篤 南谷
延弘 大矢
詩門 金井
宇治 重松
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Kuraray Co Ltd
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    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
JP2020538481A 2018-08-24 2019-08-23 ポリアミド及びポリアミド組成物 Active JP7356432B2 (ja)

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Application Number Priority Date Filing Date Title
JP2018157352 2018-08-24
JP2018157347 2018-08-24
JP2018157352 2018-08-24
JP2018157347 2018-08-24
JP2019119068 2019-06-26
JP2019119068 2019-06-26
PCT/JP2019/033003 WO2020040282A1 (ja) 2018-08-24 2019-08-23 ポリアミド及びポリアミド組成物

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JPWO2020040282A1 JPWO2020040282A1 (ja) 2021-08-10
JPWO2020040282A5 JPWO2020040282A5 (cg-RX-API-DMAC7.html) 2022-08-03
JP7356432B2 true JP7356432B2 (ja) 2023-10-04

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EP (1) EP3842471A1 (cg-RX-API-DMAC7.html)
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KR (1) KR20210048486A (cg-RX-API-DMAC7.html)
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JP7141015B2 (ja) * 2018-08-24 2022-09-22 株式会社クラレ ポリアミド組成物
JP7141016B2 (ja) * 2018-08-24 2022-09-22 株式会社クラレ ポリアミド組成物
JP7141017B2 (ja) * 2018-08-24 2022-09-22 株式会社クラレ ポリアミド組成物
EP3848419A4 (en) * 2018-09-07 2022-06-01 Kuraray Co., Ltd. Thermoplastic resin composition
CN115443309B (zh) * 2020-04-09 2024-10-29 株式会社可乐丽 经着色的聚酰胺树脂组合物及其成形体
US20240141165A1 (en) * 2021-03-16 2024-05-02 Mitsui Chemicals, Inc. Polyamide resin composition and polyamide molded article
KR102831840B1 (ko) * 2021-03-30 2025-07-08 미쓰이 가가쿠 가부시키가이샤 폴리아마이드 수지 조성물 및 폴리아마이드 성형체
EP4455214A4 (en) * 2021-12-20 2025-11-26 Kuraray Co POLYAMIDE COMPOSITION
EP4455217A4 (en) * 2021-12-20 2025-11-26 Kuraray Co POLYAMIDE COMPOSITION
WO2023120463A1 (ja) * 2021-12-20 2023-06-29 株式会社クラレ ポリアミド組成物及び成形品
JPWO2023120461A1 (cg-RX-API-DMAC7.html) * 2021-12-20 2023-06-29
EP4455216A4 (en) * 2021-12-20 2025-11-26 Kuraray Co POLYAMIDE COMPOSITION
KR20240127355A (ko) * 2021-12-20 2024-08-22 주식회사 쿠라레 폴리아미드 조성물
JPWO2023120460A1 (cg-RX-API-DMAC7.html) * 2021-12-20 2023-06-29
KR102971562B1 (ko) * 2022-01-12 2026-06-01 미쓰이 가가쿠 가부시키가이샤 폴리아마이드 수지 조성물 및 폴리아마이드 성형체
EP4715012A1 (en) * 2023-05-19 2026-03-25 Kuraray Co., Ltd. Polyamide composition
CN117050298B (zh) * 2023-07-21 2026-06-30 北京智芯微电子科技有限公司 尼龙改性树脂及其制备方法、电磁屏蔽材料及电子设备
CN120118514B (zh) * 2025-04-18 2026-02-03 临海富为管业科技有限公司 一种具有优异导热性能的尼龙及制备方法
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