JP7344481B1 - ベーパーチャンバおよび電子機器 - Google Patents

ベーパーチャンバおよび電子機器 Download PDF

Info

Publication number
JP7344481B1
JP7344481B1 JP2023541845A JP2023541845A JP7344481B1 JP 7344481 B1 JP7344481 B1 JP 7344481B1 JP 2023541845 A JP2023541845 A JP 2023541845A JP 2023541845 A JP2023541845 A JP 2023541845A JP 7344481 B1 JP7344481 B1 JP 7344481B1
Authority
JP
Japan
Prior art keywords
sheet
flow path
groove
steam
vapor chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023541845A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023106285A5 (https=
JPWO2023106285A1 (https=
Inventor
伸一郎 高橋
和範 小田
貴之 太田
誠 山木
洋次 小鶴
利彦 武田
伸哉 木浦
崇之 寺内
直大 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2022/036767 external-priority patent/WO2023054692A1/ja
Priority claimed from PCT/JP2022/042105 external-priority patent/WO2023085401A1/ja
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JPWO2023106285A1 publication Critical patent/JPWO2023106285A1/ja
Priority to JP2023142567A priority Critical patent/JP7568017B2/ja
Application granted granted Critical
Publication of JP7344481B1 publication Critical patent/JP7344481B1/ja
Publication of JPWO2023106285A5 publication Critical patent/JPWO2023106285A5/ja
Priority to JP2024172796A priority patent/JP7800847B2/ja
Priority to JP2025282471A priority patent/JP2026049011A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structure Of Printed Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
JP2023541845A 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器 Active JP7344481B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023142567A JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2021198039 2021-12-06
JP2021198039 2021-12-06
JP2021204523 2021-12-16
JP2021204523 2021-12-16
JP2021208635 2021-12-22
JP2021208635 2021-12-22
JP2022028635 2022-02-25
JP2022028635 2022-02-25
PCT/JP2022/036767 WO2023054692A1 (ja) 2021-09-30 2022-09-30 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JPPCT/JP2022/036767 2022-09-30
PCT/JP2022/042105 WO2023085401A1 (ja) 2021-11-12 2022-11-11 ベーパーチャンバ、電子機器およびベーパーチャンバ用の本体シート
JPPCT/JP2022/042105 2022-11-11
PCT/JP2022/044874 WO2023106285A1 (ja) 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023142567A Division JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2023106285A1 JPWO2023106285A1 (https=) 2023-06-15
JP7344481B1 true JP7344481B1 (ja) 2023-09-14
JPWO2023106285A5 JPWO2023106285A5 (https=) 2023-11-10

Family

ID=86730435

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2023541845A Active JP7344481B1 (ja) 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器
JP2023142567A Active JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A Active JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A Pending JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2023142567A Active JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A Active JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A Pending JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Country Status (6)

Country Link
US (1) US20250048591A1 (https=)
JP (4) JP7344481B1 (https=)
KR (1) KR20240122797A (https=)
CN (1) CN118401802A (https=)
TW (1) TW202328622A (https=)
WO (1) WO2023106285A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
TWI834500B (zh) * 2023-02-17 2024-03-01 邁萪科技股份有限公司 均溫板及其單件式支撐結構

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US20170363366A1 (en) * 2016-06-15 2017-12-21 Delta Electronics, Inc. Temperature plate and heat dissipation device
JP2019086280A (ja) * 2017-11-06 2019-06-06 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
US20190354148A1 (en) * 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
WO2020184620A1 (ja) * 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
US20200326134A1 (en) * 2019-04-12 2020-10-15 Auras Technology Co., Ltd. Flexible vapor chamber
WO2021232134A1 (en) * 2020-05-18 2021-11-25 Huawei Technologies Co., Ltd Heat pipe for electronic device, and method of manufacturing therefor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
TWI633267B (zh) * 2017-10-25 2018-08-21 神基科技股份有限公司 可彎折式熱板
JP6801700B2 (ja) 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7011938B2 (ja) 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
WO2019235552A1 (ja) 2018-06-08 2019-12-12 国立大学法人名古屋大学 装置、熱交換器、および蒸発体収容器
CN118401802A (zh) 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004028557A (ja) * 2002-05-08 2004-01-29 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US20170363366A1 (en) * 2016-06-15 2017-12-21 Delta Electronics, Inc. Temperature plate and heat dissipation device
JP2019086280A (ja) * 2017-11-06 2019-06-06 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
US20190354148A1 (en) * 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
WO2020184620A1 (ja) * 2019-03-11 2020-09-17 大日本印刷株式会社 ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート
US20200326134A1 (en) * 2019-04-12 2020-10-15 Auras Technology Co., Ltd. Flexible vapor chamber
WO2021232134A1 (en) * 2020-05-18 2021-11-25 Huawei Technologies Co., Ltd Heat pipe for electronic device, and method of manufacturing therefor

Also Published As

Publication number Publication date
JP2026049011A (ja) 2026-03-17
WO2023106285A1 (ja) 2023-06-15
JP7568017B2 (ja) 2024-10-16
CN118401802A (zh) 2024-07-26
KR20240122797A (ko) 2024-08-13
JP2023169214A (ja) 2023-11-29
TW202328622A (zh) 2023-07-16
JPWO2023106285A1 (https=) 2023-06-15
JP7800847B2 (ja) 2026-01-16
JP2025011160A (ja) 2025-01-23
US20250048591A1 (en) 2025-02-06

Similar Documents

Publication Publication Date Title
JP7800847B2 (ja) ベーパーチャンバおよび電子機器
JP7675348B2 (ja) ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
CN114846290B (zh) 蒸发室用的芯部片、蒸发室以及电子设备
JP7723915B2 (ja) ベーパーチャンバおよび電子機器
JP7552744B2 (ja) ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
JP7780721B2 (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
JP2025148370A (ja) ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7816407B2 (ja) ベーパーチャンバおよび電子機器
WO2021070544A1 (ja) ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器
KR20240169006A (ko) 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기
JP7525076B2 (ja) ベーパーチャンバ、電子機器およびベーパーチャンバ用の本体シート
KR20230175276A (ko) 베이퍼 챔버, 베이퍼 챔버용의 윅 시트 및 전자 기기
JP7800453B2 (ja) ベーパーチャンバ用の本体シート、ベーパーチャンバおよび電子機器
CN117980684A (zh) 蒸发室、电子设备以及蒸发室的制造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230710

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230710

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20230710

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230804

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230817

R150 Certificate of patent or registration of utility model

Ref document number: 7344481

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150