JPWO2023106285A1 - - Google Patents

Info

Publication number
JPWO2023106285A1
JPWO2023106285A1 JP2023541845A JP2023541845A JPWO2023106285A1 JP WO2023106285 A1 JPWO2023106285 A1 JP WO2023106285A1 JP 2023541845 A JP2023541845 A JP 2023541845A JP 2023541845 A JP2023541845 A JP 2023541845A JP WO2023106285 A1 JPWO2023106285 A1 JP WO2023106285A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023541845A
Other languages
Japanese (ja)
Other versions
JP7344481B1 (ja
JPWO2023106285A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2022/036767 external-priority patent/WO2023054692A1/ja
Priority claimed from PCT/JP2022/042105 external-priority patent/WO2023085401A1/ja
Application filed filed Critical
Publication of JPWO2023106285A1 publication Critical patent/JPWO2023106285A1/ja
Priority to JP2023142567A priority Critical patent/JP7568017B2/ja
Application granted granted Critical
Publication of JP7344481B1 publication Critical patent/JP7344481B1/ja
Publication of JPWO2023106285A5 publication Critical patent/JPWO2023106285A5/ja
Priority to JP2024172796A priority patent/JP7800847B2/ja
Priority to JP2025282471A priority patent/JP2026049011A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structure Of Printed Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
JP2023541845A 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器 Active JP7344481B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023142567A JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2021198039 2021-12-06
JP2021198039 2021-12-06
JP2021204523 2021-12-16
JP2021204523 2021-12-16
JP2021208635 2021-12-22
JP2021208635 2021-12-22
JP2022028635 2022-02-25
JP2022028635 2022-02-25
PCT/JP2022/036767 WO2023054692A1 (ja) 2021-09-30 2022-09-30 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JPPCT/JP2022/036767 2022-09-30
PCT/JP2022/042105 WO2023085401A1 (ja) 2021-11-12 2022-11-11 ベーパーチャンバ、電子機器およびベーパーチャンバ用の本体シート
JPPCT/JP2022/042105 2022-11-11
PCT/JP2022/044874 WO2023106285A1 (ja) 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023142567A Division JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器

Publications (3)

Publication Number Publication Date
JPWO2023106285A1 true JPWO2023106285A1 (https=) 2023-06-15
JP7344481B1 JP7344481B1 (ja) 2023-09-14
JPWO2023106285A5 JPWO2023106285A5 (https=) 2023-11-10

Family

ID=86730435

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2023541845A Active JP7344481B1 (ja) 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器
JP2023142567A Active JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A Active JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A Pending JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2023142567A Active JP7568017B2 (ja) 2021-12-06 2023-09-01 ベーパーチャンバおよび電子機器
JP2024172796A Active JP7800847B2 (ja) 2021-12-06 2024-10-01 ベーパーチャンバおよび電子機器
JP2025282471A Pending JP2026049011A (ja) 2021-12-06 2025-12-25 ベーパーチャンバおよび電子機器

Country Status (6)

Country Link
US (1) US20250048591A1 (https=)
JP (4) JP7344481B1 (https=)
KR (1) KR20240122797A (https=)
CN (1) CN118401802A (https=)
TW (1) TW202328622A (https=)
WO (1) WO2023106285A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
TWI834500B (zh) * 2023-02-17 2024-03-01 邁萪科技股份有限公司 均溫板及其單件式支撐結構

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4057455B2 (ja) * 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
TWI633267B (zh) * 2017-10-25 2018-08-21 神基科技股份有限公司 可彎折式熱板
JP7211021B2 (ja) * 2017-11-06 2023-01-24 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
JP6801700B2 (ja) 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7011938B2 (ja) 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US20190354148A1 (en) * 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
WO2019235552A1 (ja) 2018-06-08 2019-12-12 国立大学法人名古屋大学 装置、熱交換器、および蒸発体収容器
CN119812143A (zh) 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
TWI763989B (zh) * 2019-04-12 2022-05-11 雙鴻科技股份有限公司 可撓動之均溫板
WO2021232134A1 (en) * 2020-05-18 2021-11-25 Huawei Technologies Co., Ltd Heat pipe for electronic device, and method of manufacturing therefor
CN118401802A (zh) 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备

Also Published As

Publication number Publication date
JP7344481B1 (ja) 2023-09-14
JP2026049011A (ja) 2026-03-17
WO2023106285A1 (ja) 2023-06-15
JP7568017B2 (ja) 2024-10-16
CN118401802A (zh) 2024-07-26
KR20240122797A (ko) 2024-08-13
JP2023169214A (ja) 2023-11-29
TW202328622A (zh) 2023-07-16
JP7800847B2 (ja) 2026-01-16
JP2025011160A (ja) 2025-01-23
US20250048591A1 (en) 2025-02-06

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