KR20240122797A - 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버 및 전자 기기 Download PDF

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Publication number
KR20240122797A
KR20240122797A KR1020247021958A KR20247021958A KR20240122797A KR 20240122797 A KR20240122797 A KR 20240122797A KR 1020247021958 A KR1020247021958 A KR 1020247021958A KR 20247021958 A KR20247021958 A KR 20247021958A KR 20240122797 A KR20240122797 A KR 20240122797A
Authority
KR
South Korea
Prior art keywords
sheet
vapor
groove
vapor chamber
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247021958A
Other languages
English (en)
Korean (ko)
Inventor
신이치로 다카하시
가즈노리 오다
다카유키 오타
마코토 야마키
요우지 고즈루
도시히코 다케다
신야 기우라
다카유키 데라우치
나오히로 다카하시
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2022/036767 external-priority patent/WO2023054692A1/ja
Priority claimed from PCT/JP2022/042105 external-priority patent/WO2023085401A1/ja
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20240122797A publication Critical patent/KR20240122797A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structure Of Printed Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
KR1020247021958A 2021-12-06 2022-12-06 베이퍼 챔버 및 전자 기기 Pending KR20240122797A (ko)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2021198039 2021-12-06
JPJP-P-2021-198039 2021-12-06
JPJP-P-2021-204523 2021-12-16
JP2021204523 2021-12-16
JPJP-P-2021-208635 2021-12-22
JP2021208635 2021-12-22
JP2022028635 2022-02-25
JPJP-P-2022-028635 2022-02-25
PCT/JP2022/036767 WO2023054692A1 (ja) 2021-09-30 2022-09-30 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JPPCT/JP2022/036767 2022-09-30
PCT/JP2022/042105 WO2023085401A1 (ja) 2021-11-12 2022-11-11 ベーパーチャンバ、電子機器およびベーパーチャンバ用の本体シート
JPPCT/JP2022/042105 2022-11-11
PCT/JP2022/044874 WO2023106285A1 (ja) 2021-12-06 2022-12-06 ベーパーチャンバおよび電子機器

Publications (1)

Publication Number Publication Date
KR20240122797A true KR20240122797A (ko) 2024-08-13

Family

ID=86730435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247021958A Pending KR20240122797A (ko) 2021-12-06 2022-12-06 베이퍼 챔버 및 전자 기기

Country Status (6)

Country Link
US (1) US20250048591A1 (https=)
JP (4) JP7344481B1 (https=)
KR (1) KR20240122797A (https=)
CN (1) CN118401802A (https=)
TW (1) TW202328622A (https=)
WO (1) WO2023106285A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
TWI834500B (zh) * 2023-02-17 2024-03-01 邁萪科技股份有限公司 均溫板及其單件式支撐結構

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018204841A (ja) 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4057455B2 (ja) * 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
TWI633267B (zh) * 2017-10-25 2018-08-21 神基科技股份有限公司 可彎折式熱板
JP7211021B2 (ja) * 2017-11-06 2023-01-24 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
JP6801700B2 (ja) 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7011938B2 (ja) 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US20190354148A1 (en) * 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
WO2019235552A1 (ja) 2018-06-08 2019-12-12 国立大学法人名古屋大学 装置、熱交換器、および蒸発体収容器
CN119812143A (zh) 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
TWI763989B (zh) * 2019-04-12 2022-05-11 雙鴻科技股份有限公司 可撓動之均溫板
WO2021232134A1 (en) * 2020-05-18 2021-11-25 Huawei Technologies Co., Ltd Heat pipe for electronic device, and method of manufacturing therefor
CN118401802A (zh) 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018204841A (ja) 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ

Also Published As

Publication number Publication date
JP7344481B1 (ja) 2023-09-14
JP2026049011A (ja) 2026-03-17
WO2023106285A1 (ja) 2023-06-15
JP7568017B2 (ja) 2024-10-16
CN118401802A (zh) 2024-07-26
JP2023169214A (ja) 2023-11-29
TW202328622A (zh) 2023-07-16
JPWO2023106285A1 (https=) 2023-06-15
JP7800847B2 (ja) 2026-01-16
JP2025011160A (ja) 2025-01-23
US20250048591A1 (en) 2025-02-06

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000