TW202328622A - 蒸氣腔及電子機器 - Google Patents

蒸氣腔及電子機器 Download PDF

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Publication number
TW202328622A
TW202328622A TW111146813A TW111146813A TW202328622A TW 202328622 A TW202328622 A TW 202328622A TW 111146813 A TW111146813 A TW 111146813A TW 111146813 A TW111146813 A TW 111146813A TW 202328622 A TW202328622 A TW 202328622A
Authority
TW
Taiwan
Prior art keywords
sheet
steam
groove
steam chamber
region
Prior art date
Application number
TW111146813A
Other languages
English (en)
Chinese (zh)
Inventor
高橋伸一郎
小田和範
太田貴之
山木誠
小鶴洋次
武田利彦
木浦伸哉
寺内崇之
高橋直大
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2022/036767 external-priority patent/WO2023054692A1/ja
Priority claimed from PCT/JP2022/042105 external-priority patent/WO2023085401A1/ja
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202328622A publication Critical patent/TW202328622A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Structure Of Printed Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Casings For Electric Apparatus (AREA)
  • Laminated Bodies (AREA)
TW111146813A 2021-12-06 2022-12-06 蒸氣腔及電子機器 TW202328622A (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2021-198039 2021-12-06
JP2021198039 2021-12-06
JP2021-204523 2021-12-16
JP2021204523 2021-12-16
JP2021-208635 2021-12-22
JP2021208635 2021-12-22
JP2022-028635 2022-02-25
JP2022028635 2022-02-25
PCT/JP2022/036767 WO2023054692A1 (ja) 2021-09-30 2022-09-30 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
WOPCT/JP2022/036767 2022-09-30
PCT/JP2022/042105 WO2023085401A1 (ja) 2021-11-12 2022-11-11 ベーパーチャンバ、電子機器およびベーパーチャンバ用の本体シート
WOPCT/JP2022/042105 2022-11-11

Publications (1)

Publication Number Publication Date
TW202328622A true TW202328622A (zh) 2023-07-16

Family

ID=86730435

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111146813A TW202328622A (zh) 2021-12-06 2022-12-06 蒸氣腔及電子機器

Country Status (6)

Country Link
US (1) US20250048591A1 (https=)
JP (4) JP7344481B1 (https=)
KR (1) KR20240122797A (https=)
CN (1) CN118401802A (https=)
TW (1) TW202328622A (https=)
WO (1) WO2023106285A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118401802A (zh) * 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备
TWI834500B (zh) * 2023-02-17 2024-03-01 邁萪科技股份有限公司 均溫板及其單件式支撐結構

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4057455B2 (ja) * 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
TWI633267B (zh) * 2017-10-25 2018-08-21 神基科技股份有限公司 可彎折式熱板
JP7211021B2 (ja) * 2017-11-06 2023-01-24 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
JP6801700B2 (ja) 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7011938B2 (ja) 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US20190354148A1 (en) * 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
WO2019235552A1 (ja) 2018-06-08 2019-12-12 国立大学法人名古屋大学 装置、熱交換器、および蒸発体収容器
CN119812143A (zh) 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片
TWI763989B (zh) * 2019-04-12 2022-05-11 雙鴻科技股份有限公司 可撓動之均溫板
WO2021232134A1 (en) * 2020-05-18 2021-11-25 Huawei Technologies Co., Ltd Heat pipe for electronic device, and method of manufacturing therefor
CN118401802A (zh) 2021-12-06 2024-07-26 大日本印刷株式会社 蒸发室和电子设备

Also Published As

Publication number Publication date
JP7344481B1 (ja) 2023-09-14
JP2026049011A (ja) 2026-03-17
WO2023106285A1 (ja) 2023-06-15
JP7568017B2 (ja) 2024-10-16
CN118401802A (zh) 2024-07-26
KR20240122797A (ko) 2024-08-13
JP2023169214A (ja) 2023-11-29
JPWO2023106285A1 (https=) 2023-06-15
JP7800847B2 (ja) 2026-01-16
JP2025011160A (ja) 2025-01-23
US20250048591A1 (en) 2025-02-06

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