JP7344290B2 - 弾性波装置及び弾性波装置の製造方法 - Google Patents

弾性波装置及び弾性波装置の製造方法 Download PDF

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Publication number
JP7344290B2
JP7344290B2 JP2021527770A JP2021527770A JP7344290B2 JP 7344290 B2 JP7344290 B2 JP 7344290B2 JP 2021527770 A JP2021527770 A JP 2021527770A JP 2021527770 A JP2021527770 A JP 2021527770A JP 7344290 B2 JP7344290 B2 JP 7344290B2
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cover
substrate
chip
conductor
layer
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Japanese (ja)
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JPWO2020262607A1 (https=
Inventor
雅樹 南部
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021527770A 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法 Active JP7344290B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019121208 2019-06-28
JP2019121208 2019-06-28
PCT/JP2020/025204 WO2020262607A1 (ja) 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法

Publications (2)

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JPWO2020262607A1 JPWO2020262607A1 (https=) 2020-12-30
JP7344290B2 true JP7344290B2 (ja) 2023-09-13

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JP2021527770A Active JP7344290B2 (ja) 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法

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US (1) US20220329228A1 (https=)
JP (1) JP7344290B2 (https=)
CN (1) CN114128144A (https=)
WO (1) WO2020262607A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196565A (ja) 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
WO2013027760A1 (ja) 2011-08-22 2013-02-28 京セラ株式会社 弾性波装置および電子部品
JP2014212466A (ja) 2013-04-19 2014-11-13 パナソニック株式会社 弾性波装置およびその製造方法
JP2019106698A (ja) 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4722204B2 (ja) * 2009-07-27 2011-07-13 京セラ株式会社 弾性表面波装置及び弾性表面波装置の製造方法
CN104767499B (zh) * 2010-12-16 2017-09-22 天工滤波方案日本有限公司 弹性波装置
JP6026829B2 (ja) * 2012-09-11 2016-11-16 スカイワークスフィルターソリューションズジャパン株式会社 弾性表面波デバイス
JP5797356B2 (ja) * 2013-09-26 2015-10-21 京セラ株式会社 弾性波装置および弾性波モジュール
JP6142023B2 (ja) * 2016-02-08 2017-06-07 京セラ株式会社 弾性波装置、電子部品および弾性波装置の製造方法
JP6185125B2 (ja) * 2016-08-29 2017-08-23 スカイワークスフィルターソリューションズジャパン株式会社 弾性表面波デバイスの製造方法
US20190181828A1 (en) * 2017-12-12 2019-06-13 Murata Manufacturing Co., Ltd. Electronic component module
JP2021016035A (ja) * 2019-07-10 2021-02-12 株式会社村田製作所 弾性波装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196565A (ja) 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
WO2013027760A1 (ja) 2011-08-22 2013-02-28 京セラ株式会社 弾性波装置および電子部品
JP2014212466A (ja) 2013-04-19 2014-11-13 パナソニック株式会社 弾性波装置およびその製造方法
JP2019106698A (ja) 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Also Published As

Publication number Publication date
CN114128144A (zh) 2022-03-01
US20220329228A1 (en) 2022-10-13
JPWO2020262607A1 (https=) 2020-12-30
WO2020262607A1 (ja) 2020-12-30

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