CN114128144A - 弹性波装置以及弹性波装置的制造方法 - Google Patents

弹性波装置以及弹性波装置的制造方法 Download PDF

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Publication number
CN114128144A
CN114128144A CN202080044422.2A CN202080044422A CN114128144A CN 114128144 A CN114128144 A CN 114128144A CN 202080044422 A CN202080044422 A CN 202080044422A CN 114128144 A CN114128144 A CN 114128144A
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CN
China
Prior art keywords
chip
substrate
conductor
cover
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202080044422.2A
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English (en)
Chinese (zh)
Inventor
南部雅树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN114128144A publication Critical patent/CN114128144A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202080044422.2A 2019-06-28 2020-06-26 弹性波装置以及弹性波装置的制造方法 Pending CN114128144A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-121208 2019-06-28
JP2019121208 2019-06-28
PCT/JP2020/025204 WO2020262607A1 (ja) 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法

Publications (1)

Publication Number Publication Date
CN114128144A true CN114128144A (zh) 2022-03-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080044422.2A Pending CN114128144A (zh) 2019-06-28 2020-06-26 弹性波装置以及弹性波装置的制造方法

Country Status (4)

Country Link
US (1) US20220329228A1 (https=)
JP (1) JP7344290B2 (https=)
CN (1) CN114128144A (https=)
WO (1) WO2020262607A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009247012A (ja) * 2009-07-27 2009-10-22 Kyocera Corp 弾性表面波装置及び弾性表面波装置の製造方法
JP2014057124A (ja) * 2012-09-11 2014-03-27 Panasonic Corp 弾性表面波デバイスおよびその製造方法
WO2015046402A1 (ja) * 2013-09-26 2015-04-02 京セラ株式会社 弾性波装置および弾性波モジュール
CN104767499A (zh) * 2010-12-16 2015-07-08 天工松下滤波方案日本有限公司 弹性波装置
JP2016119701A (ja) * 2016-02-08 2016-06-30 京セラ株式会社 弾性波装置、電子部品および弾性波装置の製造方法
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196565A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
JP5259024B1 (ja) * 2011-08-22 2013-08-07 京セラ株式会社 弾性波装置および電子部品
JP6336248B2 (ja) * 2013-04-19 2018-06-06 スカイワークスフィルターソリューションズジャパン株式会社 弾性波装置およびその製造方法
JP6185125B2 (ja) * 2016-08-29 2017-08-23 スカイワークスフィルターソリューションズジャパン株式会社 弾性表面波デバイスの製造方法
US20190181828A1 (en) * 2017-12-12 2019-06-13 Murata Manufacturing Co., Ltd. Electronic component module
JP2021016035A (ja) * 2019-07-10 2021-02-12 株式会社村田製作所 弾性波装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009247012A (ja) * 2009-07-27 2009-10-22 Kyocera Corp 弾性表面波装置及び弾性表面波装置の製造方法
CN104767499A (zh) * 2010-12-16 2015-07-08 天工松下滤波方案日本有限公司 弹性波装置
JP2014057124A (ja) * 2012-09-11 2014-03-27 Panasonic Corp 弾性表面波デバイスおよびその製造方法
WO2015046402A1 (ja) * 2013-09-26 2015-04-02 京セラ株式会社 弾性波装置および弾性波モジュール
JP2016119701A (ja) * 2016-02-08 2016-06-30 京セラ株式会社 弾性波装置、電子部品および弾性波装置の製造方法
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Also Published As

Publication number Publication date
JP7344290B2 (ja) 2023-09-13
US20220329228A1 (en) 2022-10-13
JPWO2020262607A1 (https=) 2020-12-30
WO2020262607A1 (ja) 2020-12-30

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