JPWO2020262607A1 - - Google Patents

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Publication number
JPWO2020262607A1
JPWO2020262607A1 JP2021527770A JP2021527770A JPWO2020262607A1 JP WO2020262607 A1 JPWO2020262607 A1 JP WO2020262607A1 JP 2021527770 A JP2021527770 A JP 2021527770A JP 2021527770 A JP2021527770 A JP 2021527770A JP WO2020262607 A1 JPWO2020262607 A1 JP WO2020262607A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021527770A
Other languages
Japanese (ja)
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JP7344290B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2020262607A1 publication Critical patent/JPWO2020262607A1/ja
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Publication of JP7344290B2 publication Critical patent/JP7344290B2/ja
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Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021527770A 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法 Active JP7344290B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019121208 2019-06-28
JP2019121208 2019-06-28
PCT/JP2020/025204 WO2020262607A1 (ja) 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2020262607A1 true JPWO2020262607A1 (https=) 2020-12-30
JP7344290B2 JP7344290B2 (ja) 2023-09-13

Family

ID=74061269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021527770A Active JP7344290B2 (ja) 2019-06-28 2020-06-26 弾性波装置及び弾性波装置の製造方法

Country Status (4)

Country Link
US (1) US20220329228A1 (https=)
JP (1) JP7344290B2 (https=)
CN (1) CN114128144A (https=)
WO (1) WO2020262607A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196565A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
WO2013027760A1 (ja) * 2011-08-22 2013-02-28 京セラ株式会社 弾性波装置および電子部品
JP2014057124A (ja) * 2012-09-11 2014-03-27 Panasonic Corp 弾性表面波デバイスおよびその製造方法
JP2014212466A (ja) * 2013-04-19 2014-11-13 パナソニック株式会社 弾性波装置およびその製造方法
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール
JP2021016035A (ja) * 2019-07-10 2021-02-12 株式会社村田製作所 弾性波装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4722204B2 (ja) * 2009-07-27 2011-07-13 京セラ株式会社 弾性表面波装置及び弾性表面波装置の製造方法
CN104767499B (zh) * 2010-12-16 2017-09-22 天工滤波方案日本有限公司 弹性波装置
JP5797356B2 (ja) * 2013-09-26 2015-10-21 京セラ株式会社 弾性波装置および弾性波モジュール
JP6142023B2 (ja) * 2016-02-08 2017-06-07 京セラ株式会社 弾性波装置、電子部品および弾性波装置の製造方法
JP6185125B2 (ja) * 2016-08-29 2017-08-23 スカイワークスフィルターソリューションズジャパン株式会社 弾性表面波デバイスの製造方法
US20190181828A1 (en) * 2017-12-12 2019-06-13 Murata Manufacturing Co., Ltd. Electronic component module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196565A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
WO2013027760A1 (ja) * 2011-08-22 2013-02-28 京セラ株式会社 弾性波装置および電子部品
JP2014057124A (ja) * 2012-09-11 2014-03-27 Panasonic Corp 弾性表面波デバイスおよびその製造方法
JP2014212466A (ja) * 2013-04-19 2014-11-13 パナソニック株式会社 弾性波装置およびその製造方法
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール
JP2021016035A (ja) * 2019-07-10 2021-02-12 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
JP7344290B2 (ja) 2023-09-13
CN114128144A (zh) 2022-03-01
US20220329228A1 (en) 2022-10-13
WO2020262607A1 (ja) 2020-12-30

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