JP7328223B2 - 電子装置の製造方法、電子装置及びその製造ツール - Google Patents
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Description
Claims (18)
- 引き伸ばし領域及び前記引き伸ばし領域の両側に位置する非引き伸ばし領域を備える電子装置の製造方法であって、
引き伸ばし部及び前記引き伸ばし部の両側に位置する非引き伸ばし部を備え、前記引き伸ばし部及び前記非引き伸ばし部がそれぞれ前記引き伸ばし領域及び前記非引き伸ばし領域に対応するフレキシブル基板を提供するステップと、
前記引き伸ばし部の長さ方向に垂直に前記引き伸ばし部を引き伸ばさせて固定し、且つ前記引き伸ばし部を引き伸ばし状態に維持するステップと、
前記非引き伸ばし部上に回路構造を形成するステップと、
前記引き伸ばし部に対する固定を解除して、引き伸ばされた前記引き伸ばし部を復元させるステップと、を含み、
前記引き伸ばし部を引き伸ばさせる前に、前記引き伸ばし部を変性処理して、その引き伸ばし性能を前記非引き伸ばし部よりも高くするステップをさらに含む、電子装置の製造方法。 - 前記引き伸ばし部を引き伸ばさせるステップは、前記引き伸ばし部と前記非引き伸ばし部との境界に沿って前記非引き伸ばし部を固定し、前記境界位置で前記引き伸ばし部を引き伸ばさせることを含む請求項1に記載の電子装置の製造方法。
- 前記引き伸ばし部を引き伸ばさせた後、前記フレキシブル基板をリジッド基板と固定し、前記引き伸ばし部を引き伸ばし状態に維持する請求項1又は2に記載の電子装置の製造方法。
- 前記回路構造を形成した後、前記フレキシブル基板と前記リジッド基板を分離して前記引き伸ばし部に対する固定を解除する請求項3に記載の電子装置の製造方法。
- 前記リジッド基板上に犠牲層を形成して前記フレキシブル基板と前記リジッド基板を接着固定し、前記フレキシブル基板と前記リジッド基板を分離する際に前記犠牲層を除去する請求項4に記載の電子装置の製造方法。
- 前記引き伸ばし部の両側の前記非引き伸ばし部上に前記回路構造を同時に作製する請求項1~5のいずれか一項に記載の電子装置の製造方法。
- 前記回路構造を同時に作製するプロセスでは、遮蔽部を備えるマスクを用いて前記フレキシブル基板を被覆し、前記遮蔽部が前記引き伸ばし部に対応して前記引き伸ばし部を遮蔽する請求項6に記載の電子装置の製造方法。
- 前記フレキシブル基板上に前記回路構造を備える構造層を形成し、その後、前記引き伸ばし領域中の構造層を除去して前記引き伸ばし部を露出させる請求項6に記載の電子装置の製造方法。
- 前記引き伸ばし部に配線を形成して前記引き伸ばし部の両側の前記回路構造を接続するステップをさらに含む請求項6に記載の電子装置の製造方法。
- 前記回路構造を形成した後、前記方法は、
前記引き伸ばし領域において、前記回路構造の側縁に第1封止層を形成するステップをさらに含む請求項6に記載の電子装置の製造方法。 - 前記引き伸ばし部を復元させた後、前記方法は、
前記回路構造の前記フレキシブル基板から離れた一方側にフレキシブルカバープレートを形成して前記回路構造を被覆するステップをさらに含む請求項1~10のいずれか一項に記載の電子装置の製造方法。 - 引き伸ばし領域及び前記引き伸ばし領域の両側に位置する非引き伸ばし領域を有する電子装置であって、
引き伸ばし部及び前記引き伸ばし部の両側に位置する非引き伸ばし部を備え、前記引き伸ばし部及び前記非引き伸ばし部がそれぞれ前記引き伸ばし領域及び前記非引き伸ばし領域に位置するフレキシブル基板と、
前記非引き伸ばし部上に設けられる回路構造と、を備え、
前記引き伸ばし部は前記電子装置の製造中に引き伸ばし可能であり、前記電子装置は前記引き伸ばし領域によって折り曲げ可能であり、
前記引き伸ばし部は、前記引き伸ばし部が引き伸ばされる前、前記非引き伸ばし部の引き伸ばし性能よりも高い引き伸ばし性能を有するように、変性処理が施される、電子装置。 - 前記回路構造の前記フレキシブル基板から離れた一方側に設けられ、前記回路構造を被覆するフレキシブルカバープレートをさらに備える請求項12に記載の電子装置。
- それぞれ前記引き伸ばし領域の両側の前記非引き伸ばし領域に設けられ、それぞれ前記非引き伸ばし領域中の前記回路構造に駆動信号を提供する少なくとも2セットの駆動回路をさらに備える請求項12又は13に記載の電子装置。
- 前記引き伸ばし領域に設けられ、前記引き伸ばし領域の両側の前記回路構造を接続する配線をさらに備える請求項12~14のいずれか一項に記載の電子装置。
- 前記回路構造の前記引き伸ばし領域に近い側縁に設けられる第1封止層をさらに備える請求項12~15のいずれか一項に記載の電子装置。
- 電子装置の製造ツールであって、
引き伸ばし部の両側に引き伸ばし部および非引き伸ばし部を含むフレキシブル基板を載置する載置台と、
前記フレキシブル基板を前記載置台に着脱可能に固定する少なくとも1つの固定部と、を備え、
前記載置台は少なくとも2つの部分を備え、且つ隣接する2つの部分間の隙間が調整可能であり、前記少なくとも1つの固定部は、固定された前記フレキシブル基板を前記隙間のみで引き伸ばさせることを可能にするように、それぞれ前記2つの部分の前記隙間に近いエッジ位置に設けられ、
前記フレキシブル基板が引き伸ばされる前、前記製造ツールは、その引き伸ばし性能が前記非引き伸ばし部よりも高くなるように、前記引き伸ばし部に変性処理を行う手段をさらに備える、電子装置の製造ツール。 - 前記載置台に駆動接続され、前記載置台の隣接する2つの部分間の隙間の大きさを調整して、固定された前記フレキシブル基板を引き伸ばし又は復元させる駆動装置をさらに備える請求項17に記載の電子装置の製造ツール。
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PCT/CN2019/072715 WO2019237741A1 (zh) | 2018-06-15 | 2019-01-22 | 电子装置的制备方法、电子装置及其制备工具 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004260146A (ja) | 2003-02-04 | 2004-09-16 | Toray Ind Inc | 回路基板の製造方法および製造装置 |
US20040192082A1 (en) | 2003-03-28 | 2004-09-30 | Sigurd Wagner | Stretchable and elastic interconnects |
JP2014067609A (ja) | 2012-09-26 | 2014-04-17 | Nitto Denko Corp | プロトン伝導性の電解質膜およびその製造方法、ならびにそれを用いた膜・電極接合体および燃料電池 |
JP2014228347A (ja) | 2013-05-21 | 2014-12-08 | 日本電産リード株式会社 | 基板固定装置、及びこれを備える基板検査装置 |
US20160315291A1 (en) | 2015-04-27 | 2016-10-27 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Method for manufacturing flexible display device |
US20170094774A1 (en) | 2015-09-25 | 2017-03-30 | Adel Elsherbini | Method of fabricating a stretchable computing device |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
US6869424B1 (en) * | 2000-10-27 | 2005-03-22 | Kimberly-Clark Worldwide, Inc. | Stretchable absorbent garment with non-stretchable liner |
US6771010B2 (en) | 2001-04-30 | 2004-08-03 | Hewlett-Packard Development Company, L.P. | Silicon emitter with low porosity heavily doped contact layer |
US6771020B1 (en) * | 2003-02-21 | 2004-08-03 | Wintek Corporation | Double-face lighting electro luminescent device |
JP5743553B2 (ja) * | 2008-03-05 | 2015-07-01 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 伸張可能及び折畳み可能な電子デバイス |
GB201218004D0 (en) * | 2012-10-08 | 2012-11-21 | Plastic Logic Ltd | Foldable electronic display |
US9674949B1 (en) * | 2013-08-27 | 2017-06-06 | Flextronics Ap, Llc | Method of making stretchable interconnect using magnet wires |
KR20170075006A (ko) * | 2014-10-28 | 2017-06-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 장치 |
CN104766820B (zh) * | 2015-04-27 | 2018-07-10 | 深圳市华星光电技术有限公司 | 柔性显示装置的制造方法 |
KR101820470B1 (ko) * | 2016-06-28 | 2018-01-19 | 엘지전자 주식회사 | 이동 단말기 |
CN106206384B (zh) * | 2016-09-18 | 2023-04-14 | 桂林电子科技大学 | 一种制备可延展柔性无机电子器件的装置及方法 |
CN106448466B (zh) * | 2016-10-21 | 2017-12-01 | 京东方科技集团股份有限公司 | 可折叠显示装置 |
TWM552596U (zh) * | 2017-03-05 | 2017-12-01 | Iboson Technology Co Ltd | 擬真可撓式基材彎曲測試系統 |
KR101939462B1 (ko) * | 2017-05-19 | 2019-01-16 | 경희대학교 산학협력단 | 스트레처블 전자 소자 및 그의 제조 방법 |
CN107564415B (zh) | 2017-08-28 | 2019-06-21 | 上海天马有机发光显示技术有限公司 | 柔性显示面板、显示装置及其制作方法 |
CN208271903U (zh) * | 2018-06-15 | 2018-12-21 | 京东方科技集团股份有限公司 | 电子装置及其制备工具 |
CN108898953B (zh) * | 2018-07-04 | 2020-12-22 | 京东方科技集团股份有限公司 | 柔性显示面板的制备方法、柔性显示面板和显示装置 |
-
2018
- 2018-06-15 CN CN201810621420.XA patent/CN110611051B/zh active Active
-
2019
- 2019-01-22 US US16/497,897 patent/US11349106B2/en active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004260146A (ja) | 2003-02-04 | 2004-09-16 | Toray Ind Inc | 回路基板の製造方法および製造装置 |
US20040192082A1 (en) | 2003-03-28 | 2004-09-30 | Sigurd Wagner | Stretchable and elastic interconnects |
JP2014067609A (ja) | 2012-09-26 | 2014-04-17 | Nitto Denko Corp | プロトン伝導性の電解質膜およびその製造方法、ならびにそれを用いた膜・電極接合体および燃料電池 |
JP2014228347A (ja) | 2013-05-21 | 2014-12-08 | 日本電産リード株式会社 | 基板固定装置、及びこれを備える基板検査装置 |
US20160315291A1 (en) | 2015-04-27 | 2016-10-27 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Method for manufacturing flexible display device |
US20170094774A1 (en) | 2015-09-25 | 2017-03-30 | Adel Elsherbini | Method of fabricating a stretchable computing device |
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US20210359283A1 (en) | 2021-11-18 |
US11349106B2 (en) | 2022-05-31 |
CN110611051A (zh) | 2019-12-24 |
CN110611051B (zh) | 2024-07-16 |
EP3809483A1 (en) | 2021-04-21 |
WO2019237741A1 (zh) | 2019-12-19 |
JP2021526307A (ja) | 2021-09-30 |
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