JP7319549B2 - 光学部材、発光装置及び光学部材の製造方法 - Google Patents

光学部材、発光装置及び光学部材の製造方法 Download PDF

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JP7319549B2
JP7319549B2 JP2019561611A JP2019561611A JP7319549B2 JP 7319549 B2 JP7319549 B2 JP 7319549B2 JP 2019561611 A JP2019561611 A JP 2019561611A JP 2019561611 A JP2019561611 A JP 2019561611A JP 7319549 B2 JP7319549 B2 JP 7319549B2
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wiring
optical member
light
holding member
metal layer
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JPWO2019131439A1 (ja
Inventor
智紀 三次
政信 田中
祐且 湯藤
章徳 原
輝彦 野口
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06233—Controlling other output parameters than intensity or frequency
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Lasers (AREA)
  • Engineering & Computer Science (AREA)
  • Optical Filters (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
JP2019561611A 2017-12-26 2018-12-20 光学部材、発光装置及び光学部材の製造方法 Active JP7319549B2 (ja)

Priority Applications (1)

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JP2023117100A JP7614526B2 (ja) 2017-12-26 2023-07-18 光学部材の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017249795 2017-12-26
JP2017249795 2017-12-26
PCT/JP2018/046999 WO2019131439A1 (ja) 2017-12-26 2018-12-20 光学部材、発光装置及び光学部材の製造方法

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JP7319549B2 true JP7319549B2 (ja) 2023-08-02

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US (3) US11108210B2 (enExample)
EP (1) EP3734778B1 (enExample)
JP (2) JP7319549B2 (enExample)
CN (2) CN118431888A (enExample)
WO (1) WO2019131439A1 (enExample)

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US10587090B1 (en) * 2015-12-31 2020-03-10 Soraa Laser Diode, Inc. Safe laser light
JP6702349B2 (ja) 2018-03-27 2020-06-03 日亜化学工業株式会社 発光装置
FR3079623B1 (fr) * 2018-03-29 2022-04-08 St Microelectronics Grenoble 2 Capot pour dispositif electronique et procede de fabrication
US11056855B2 (en) * 2018-07-04 2021-07-06 Namuga, Co., Ltd. Beam projector module for performing eye-safety function using temperature, and control method thereof
DE102018120508A1 (de) * 2018-08-22 2020-02-27 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zum Steuern einer optoelektronischen Vorrichtung
CN110175499B (zh) * 2018-10-15 2024-09-03 华为技术有限公司 光学元件及其监测系统和方法、主动发光模组、终端
TWI701882B (zh) * 2018-11-08 2020-08-11 晶智達光電股份有限公司 雷射元件
DE112019006138T5 (de) * 2018-12-10 2021-09-02 Ams Sensors Asia Pte. Ltd. Licht emittierendes modul mit erhöhter augensicherheitsfunktion
DE102019104986A1 (de) * 2019-02-27 2020-08-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE102020106594A1 (de) * 2019-03-12 2020-09-17 Nichia Corporation Verfahren zur herstellung eines optischen elements, optisches element, und lichtemittierende vorrichtung
EP4080697A4 (en) * 2019-12-20 2023-06-21 Sony Semiconductor Solutions Corporation Light-emitting device and method for manufacturing light-emitting device
JP7538399B2 (ja) 2020-04-06 2024-08-22 日亜化学工業株式会社 発光装置、又は、光学部材
US12212119B2 (en) * 2020-04-23 2025-01-28 Analog Devices International Unlimited Company Laser system
JP7525775B2 (ja) * 2020-06-05 2024-07-31 日亜化学工業株式会社 金属成膜部材の製造方法、金属成膜部材、波長変換部材、又は、発光装置
US20230344192A1 (en) * 2020-06-08 2023-10-26 Nichia Corporation Light emitting device
JP7553772B2 (ja) * 2020-06-17 2024-09-19 日亜化学工業株式会社 光学部材、及び、発光装置
JP7562071B2 (ja) * 2021-01-27 2024-10-07 日亜化学工業株式会社 発光モジュール
JP2022190310A (ja) 2021-06-14 2022-12-26 セイコーエプソン株式会社 波長変換部材および発光装置
JP2023047990A (ja) * 2021-09-27 2023-04-06 日亜化学工業株式会社 光学部材、発光装置

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JP2010024278A (ja) 2008-07-16 2010-02-04 Stanley Electric Co Ltd 蛍光体セラミック板およびそれを用いた発光素子
WO2012124522A1 (ja) 2011-03-15 2012-09-20 シャープ株式会社 発光装置、照明装置、前照灯および車両
JP2013168587A (ja) 2012-02-16 2013-08-29 Sharp Corp 発光装置、半導体レーザ素子、および照明装置
JP2013166886A (ja) 2012-02-16 2013-08-29 Konica Minolta Inc 蛍光体分散液の製造方法、およびそれを用いてｌｅｄ装置を製造する方法
JP2013196920A (ja) 2012-03-21 2013-09-30 Stanley Electric Co Ltd 光源装置および照明装置
US20130250544A1 (en) 2012-03-22 2013-09-26 Nathan Zink Ceramic wavelength-conversion plates and light sources including the same
WO2014021027A1 (ja) 2012-08-02 2014-02-06 日亜化学工業株式会社 波長変換装置
JP2015060159A (ja) 2013-09-20 2015-03-30 カシオ計算機株式会社 蛍光発光装置及びプロジェクタ
JP2016092288A (ja) 2014-11-07 2016-05-23 スタンレー電気株式会社 光源装置及びこれを用いた照明装置
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US20160290856A1 (en) 2015-04-01 2016-10-06 Osram Gmbh Device and method for light conversion device monitoring
WO2017012763A1 (de) 2015-07-17 2017-01-26 Osram Gmbh Wellenlängenumwandlung von primärlicht mittels eines konversionskörpers
JP2017085036A (ja) 2015-10-30 2017-05-18 日亜化学工業株式会社 発光装置
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JP2017216362A (ja) 2016-05-31 2017-12-07 日亜化学工業株式会社 発光装置

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US20190199052A1 (en) 2019-06-27
US11984697B2 (en) 2024-05-14
CN118431888A (zh) 2024-08-02
WO2019131439A1 (ja) 2019-07-04
EP3734778A4 (en) 2021-10-13
EP3734778A1 (en) 2020-11-04
CN111512505B (zh) 2024-04-12
JP2023126547A (ja) 2023-09-07
US20210359489A1 (en) 2021-11-18
US11108210B2 (en) 2021-08-31
JP7614526B2 (ja) 2025-01-16
JPWO2019131439A1 (ja) 2021-01-21
US20230216268A1 (en) 2023-07-06
EP3734778B1 (en) 2024-02-14
CN111512505A (zh) 2020-08-07
US11646544B2 (en) 2023-05-09

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