JP7319482B2 - セラミックス板の製造方法、セラミックス板、複合シート、及び積層基板 - Google Patents

セラミックス板の製造方法、セラミックス板、複合シート、及び積層基板 Download PDF

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Publication number
JP7319482B2
JP7319482B2 JP2023514411A JP2023514411A JP7319482B2 JP 7319482 B2 JP7319482 B2 JP 7319482B2 JP 2023514411 A JP2023514411 A JP 2023514411A JP 2023514411 A JP2023514411 A JP 2023514411A JP 7319482 B2 JP7319482 B2 JP 7319482B2
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Japan
Prior art keywords
ceramic plate
plate
boron nitride
resin
composite sheet
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Japanese (ja)
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JPWO2023027122A1 (https=
JPWO2023027122A5 (https=
Inventor
仁孝 南方
政秀 金子
亮 吉松
真也 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/82—Coating or impregnation with organic materials
    • C04B41/83—Macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2023514411A 2021-08-26 2022-08-24 セラミックス板の製造方法、セラミックス板、複合シート、及び積層基板 Active JP7319482B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021138221 2021-08-26
JP2021138221 2021-08-26
PCT/JP2022/031927 WO2023027122A1 (ja) 2021-08-26 2022-08-24 セラミックス板の製造方法、セラミックス板、複合シート、及び積層基板

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JPWO2023027122A1 JPWO2023027122A1 (https=) 2023-03-02
JP7319482B2 true JP7319482B2 (ja) 2023-08-01
JPWO2023027122A5 JPWO2023027122A5 (https=) 2023-08-02

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JP (1) JP7319482B2 (https=)
WO (1) WO2023027122A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002275571A (ja) 2001-03-13 2002-09-25 Toshiba Tungaloy Co Ltd ｃＢＮ基焼結体およびその被覆工具
JP2011178598A (ja) 2010-03-01 2011-09-15 Hitachi Metals Ltd 窒化珪素基板の製造方法および窒化珪素基板
WO2013054852A1 (ja) 2011-10-11 2013-04-18 日立金属株式会社 窒化珪素基板および窒化珪素基板の製造方法
JP2015195292A (ja) 2014-03-31 2015-11-05 三菱化学株式会社 放熱シートおよび放熱シート製造方法、放熱シート用スラリー、並びにパワーデバイス装置
WO2020203692A1 (ja) 2019-03-29 2020-10-08 デンカ株式会社 複合体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IN150013B (https=) * 1977-07-01 1982-06-26 Gen Electric
JPH02164775A (ja) * 1988-12-19 1990-06-25 Denki Kagaku Kogyo Kk 立方晶窒化ほう素焼結体の製造方法
JPH09278526A (ja) * 1996-04-10 1997-10-28 Denki Kagaku Kogyo Kk セラミックス焼成用セッター

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002275571A (ja) 2001-03-13 2002-09-25 Toshiba Tungaloy Co Ltd ｃＢＮ基焼結体およびその被覆工具
JP2011178598A (ja) 2010-03-01 2011-09-15 Hitachi Metals Ltd 窒化珪素基板の製造方法および窒化珪素基板
WO2013054852A1 (ja) 2011-10-11 2013-04-18 日立金属株式会社 窒化珪素基板および窒化珪素基板の製造方法
JP2015195292A (ja) 2014-03-31 2015-11-05 三菱化学株式会社 放熱シートおよび放熱シート製造方法、放熱シート用スラリー、並びにパワーデバイス装置
WO2020203692A1 (ja) 2019-03-29 2020-10-08 デンカ株式会社 複合体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
第７節 窒化ホウ素フィラー及び放熱シートについて，スマートフォン・タッチパネル部材の最新技術便覧 ，高薄 一弘 株式会社技術情報協会，2013年，PP.461-468，ISBN:978-4-86104-484-7

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WO2023027122A1 (ja) 2023-03-02

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