JP7317320B2 - 自己組織化単分子膜コーティングを使用することによる金属汚染の防止のための方法及びシステム - Google Patents

自己組織化単分子膜コーティングを使用することによる金属汚染の防止のための方法及びシステム Download PDF

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JP7317320B2
JP7317320B2 JP2021512227A JP2021512227A JP7317320B2 JP 7317320 B2 JP7317320 B2 JP 7317320B2 JP 2021512227 A JP2021512227 A JP 2021512227A JP 2021512227 A JP2021512227 A JP 2021512227A JP 7317320 B2 JP7317320 B2 JP 7317320B2
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substrate
front surface
edge
depositing
perimeter
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JP2021535616A (ja
JP2021535616A5 (cg-RX-API-DMAC7.html
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カン，ホヨン
デヴィリアーズ，アントン
レムリー，コーリー
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/165—Monolayers, e.g. Langmuir-Blodgett
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Saccharide Compounds (AREA)
  • Laminated Bodies (AREA)
JP2021512227A 2018-09-04 2019-09-04 自己組織化単分子膜コーティングを使用することによる金属汚染の防止のための方法及びシステム Active JP7317320B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862726605P 2018-09-04 2018-09-04
US62/726,605 2018-09-04
PCT/US2019/049508 WO2020086164A2 (en) 2018-09-04 2019-09-04 Method and system for prevention of metal contamination by using a self-assembled monolayer coating

Publications (3)

Publication Number Publication Date
JP2021535616A JP2021535616A (ja) 2021-12-16
JP2021535616A5 JP2021535616A5 (cg-RX-API-DMAC7.html) 2022-09-06
JP7317320B2 true JP7317320B2 (ja) 2023-07-31

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JP2021512227A Active JP7317320B2 (ja) 2018-09-04 2019-09-04 自己組織化単分子膜コーティングを使用することによる金属汚染の防止のための方法及びシステム

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Country Link
US (1) US11460775B2 (cg-RX-API-DMAC7.html)
JP (1) JP7317320B2 (cg-RX-API-DMAC7.html)
KR (1) KR102798427B1 (cg-RX-API-DMAC7.html)
CN (1) CN112638547A (cg-RX-API-DMAC7.html)
TW (1) TWI810357B (cg-RX-API-DMAC7.html)
WO (1) WO2020086164A2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087580B2 (en) * 2021-08-30 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor devices
US12094716B2 (en) 2021-09-13 2024-09-17 Applied Materials, Inc. Chambers and coatings for reducing backside damage
US12288698B2 (en) * 2023-02-21 2025-04-29 Tokyo Electron Limited Methods for retaining a processing liquid on a surface of a semiconductor substrate
US12506019B2 (en) 2024-03-11 2025-12-23 Tokyo Electron Limited Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040157471A1 (en) 1999-08-11 2004-08-12 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
JP2006212476A (ja) 2005-02-01 2006-08-17 Seiko Epson Corp 膜パターン形成方法、膜パターン、レジスト膜、及び絶縁膜、並びに回路基板、半導体装置、表面弾性波デバイス、表面弾性波発振装置、電気光学装置、及び電子機器
JP2013520028A (ja) 2010-02-17 2013-05-30 エーエスエム アメリカ インコーポレイテッド 蒸着に対する反応部位の不活性化
JP2014157941A (ja) 2013-02-15 2014-08-28 Fujikura Ltd 有機薄膜トランジスタ及びその製造方法
JP2019532489A (ja) 2016-08-12 2019-11-07 インプリア・コーポレイションＩｎｐｒｉａ Ｃｏｒｐｏｒａｔｉｏｎ 金属含有レジストからのエッジビード領域における金属残留物を低減する方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7601386B2 (en) * 2003-07-11 2009-10-13 Seiko Epson Corporation Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment
US7854873B2 (en) * 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
KR100994920B1 (ko) 2008-06-05 2010-11-17 주식회사 소로나 기상 자기조립 단분자막 코팅장치
US8691331B2 (en) 2009-02-09 2014-04-08 Prashant D. Santan Surface modification of hydrophobic and/or oleophobic coatings
US9078956B2 (en) * 2010-06-10 2015-07-14 Econous Systems Inc. Modification of biomedical polymers for prevention of fouling and clotting
JP6552009B2 (ja) 2013-12-17 2019-07-31 東京エレクトロン株式会社 基板への周期的オルガノシリケートまたは自己組織化モノレイヤのスピンオンコーティングのためのシステムおよび方法
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040157471A1 (en) 1999-08-11 2004-08-12 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
JP2006212476A (ja) 2005-02-01 2006-08-17 Seiko Epson Corp 膜パターン形成方法、膜パターン、レジスト膜、及び絶縁膜、並びに回路基板、半導体装置、表面弾性波デバイス、表面弾性波発振装置、電気光学装置、及び電子機器
JP2013520028A (ja) 2010-02-17 2013-05-30 エーエスエム アメリカ インコーポレイテッド 蒸着に対する反応部位の不活性化
JP2014157941A (ja) 2013-02-15 2014-08-28 Fujikura Ltd 有機薄膜トランジスタ及びその製造方法
JP2019532489A (ja) 2016-08-12 2019-11-07 インプリア・コーポレイションＩｎｐｒｉａ Ｃｏｒｐｏｒａｔｉｏｎ 金属含有レジストからのエッジビード領域における金属残留物を低減する方法

Also Published As

Publication number Publication date
KR20210041094A (ko) 2021-04-14
TW202025242A (zh) 2020-07-01
CN112638547A (zh) 2021-04-09
TWI810357B (zh) 2023-08-01
JP2021535616A (ja) 2021-12-16
US20200073244A1 (en) 2020-03-05
US11460775B2 (en) 2022-10-04
WO2020086164A3 (en) 2020-06-18
KR102798427B1 (ko) 2025-04-23
WO2020086164A2 (en) 2020-04-30

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