KR102798427B1 - 자기 조립 단분자층 코팅을 사용함으로써 금속 오염을 방지하기 위한 방법 및 시스템 - Google Patents

자기 조립 단분자층 코팅을 사용함으로써 금속 오염을 방지하기 위한 방법 및 시스템 Download PDF

Info

Publication number
KR102798427B1
KR102798427B1 KR1020217009302A KR20217009302A KR102798427B1 KR 102798427 B1 KR102798427 B1 KR 102798427B1 KR 1020217009302 A KR1020217009302 A KR 1020217009302A KR 20217009302 A KR20217009302 A KR 20217009302A KR 102798427 B1 KR102798427 B1 KR 102798427B1
Authority
KR
South Korea
Prior art keywords
substrate
front surface
edge
paragraph
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217009302A
Other languages
English (en)
Korean (ko)
Other versions
KR20210041094A (ko
Inventor
호영 강
안톤 드빌리어스
코리 렘리
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20210041094A publication Critical patent/KR20210041094A/ko
Application granted granted Critical
Publication of KR102798427B1 publication Critical patent/KR102798427B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/165—Monolayers, e.g. Langmuir-Blodgett
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Saccharide Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020217009302A 2018-09-04 2019-09-04 자기 조립 단분자층 코팅을 사용함으로써 금속 오염을 방지하기 위한 방법 및 시스템 Active KR102798427B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862726605P 2018-09-04 2018-09-04
US62/726,605 2018-09-04
PCT/US2019/049508 WO2020086164A2 (en) 2018-09-04 2019-09-04 Method and system for prevention of metal contamination by using a self-assembled monolayer coating

Publications (2)

Publication Number Publication Date
KR20210041094A KR20210041094A (ko) 2021-04-14
KR102798427B1 true KR102798427B1 (ko) 2025-04-23

Family

ID=69641094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217009302A Active KR102798427B1 (ko) 2018-09-04 2019-09-04 자기 조립 단분자층 코팅을 사용함으로써 금속 오염을 방지하기 위한 방법 및 시스템

Country Status (6)

Country Link
US (1) US11460775B2 (cg-RX-API-DMAC7.html)
JP (1) JP7317320B2 (cg-RX-API-DMAC7.html)
KR (1) KR102798427B1 (cg-RX-API-DMAC7.html)
CN (1) CN112638547A (cg-RX-API-DMAC7.html)
TW (1) TWI810357B (cg-RX-API-DMAC7.html)
WO (1) WO2020086164A2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087580B2 (en) * 2021-08-30 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor devices
US12094716B2 (en) 2021-09-13 2024-09-17 Applied Materials, Inc. Chambers and coatings for reducing backside damage
US12288698B2 (en) * 2023-02-21 2025-04-29 Tokyo Electron Limited Methods for retaining a processing liquid on a surface of a semiconductor substrate
US12506019B2 (en) 2024-03-11 2025-12-23 Tokyo Electron Limited Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070212522A1 (en) 2005-06-10 2007-09-13 Babak Heidari Imprint stamp comprising Cyclic Olefin copolymer
US20140018463A1 (en) 2010-06-10 2014-01-16 Econous Systems Inc. Modification of biomedical polymers for prevention of fouling and clotting
US20180046086A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6461983B1 (en) 1999-08-11 2002-10-08 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
US7601386B2 (en) * 2003-07-11 2009-10-13 Seiko Epson Corporation Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment
JP4179288B2 (ja) 2005-02-01 2008-11-12 セイコーエプソン株式会社 膜パターン形成方法
KR100994920B1 (ko) 2008-06-05 2010-11-17 주식회사 소로나 기상 자기조립 단분자막 코팅장치
US8691331B2 (en) 2009-02-09 2014-04-08 Prashant D. Santan Surface modification of hydrophobic and/or oleophobic coatings
US8293658B2 (en) 2010-02-17 2012-10-23 Asm America, Inc. Reactive site deactivation against vapor deposition
JP2014157941A (ja) 2013-02-15 2014-08-28 Fujikura Ltd 有機薄膜トランジスタ及びその製造方法
JP6552009B2 (ja) 2013-12-17 2019-07-31 東京エレクトロン株式会社 基板への周期的オルガノシリケートまたは自己組織化モノレイヤのスピンオンコーティングのためのシステムおよび方法
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070212522A1 (en) 2005-06-10 2007-09-13 Babak Heidari Imprint stamp comprising Cyclic Olefin copolymer
US20140018463A1 (en) 2010-06-10 2014-01-16 Econous Systems Inc. Modification of biomedical polymers for prevention of fouling and clotting
US20180046086A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists

Also Published As

Publication number Publication date
KR20210041094A (ko) 2021-04-14
TW202025242A (zh) 2020-07-01
CN112638547A (zh) 2021-04-09
TWI810357B (zh) 2023-08-01
JP2021535616A (ja) 2021-12-16
US20200073244A1 (en) 2020-03-05
US11460775B2 (en) 2022-10-04
JP7317320B2 (ja) 2023-07-31
WO2020086164A3 (en) 2020-06-18
WO2020086164A2 (en) 2020-04-30

Similar Documents

Publication Publication Date Title
TWI810357B (zh) 基板處理方法
US6576489B2 (en) Methods of forming microstructure devices
TWI784176B (zh) 用以增進極紫外光(euv)蝕刻抗性的保護性覆蓋物之選擇性原子層沉積(ald)
US6423380B1 (en) Method of coating a semiconductor wafer
US20100112236A1 (en) Facilitating Adhesion Between Substrate and Patterned Layer
TWI460807B (zh) 晶圓狀物件之液體處理方法與設備
US20150214070A1 (en) Method For Self-Aligned Double Patterning Without Atomic Layer Deposition
JPWO2018128088A1 (ja) 基板洗浄方法、基板洗浄システムおよび記憶媒体
WO2023283072A1 (en) Selective film formation using a self-assembled monolayer
US9679770B2 (en) Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
US11043378B2 (en) Systems and methods for inhibiting detectivity, metal particle contamination, and film growth on wafers
JP5782460B2 (ja) 材料除去及びパターン転写の方法及びシステム
US5185056A (en) Method and apparatus for etching semiconductor wafers and developing resists
KR101252967B1 (ko) 기판 프로세싱 장치 및 방법
JP2018001155A (ja) 基板コーティング方法及びコーティングシステム
US7681519B2 (en) Apparatus for coating a photoresist layer
CN114709131A (zh) 一种半导体金属剥离工艺中的角度控制方法
JP2001345293A5 (cg-RX-API-DMAC7.html)
KR100744277B1 (ko) 웨이퍼의 에지 비드 제거장치
KR20240086559A (ko) Euv 감지 필름을 증착하는 방법 및 관련 시스템
TW202503853A (zh) 用於圖案化基板之方法、系統及結構
JP2000049163A (ja) 配線の形成方法
JP2026509340A (ja) 半導体基板の表面に処理液を保持するための方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601