CN112638547A - 通过使用自组装单层涂层抵御金属污染的方法和系统 - Google Patents

通过使用自组装单层涂层抵御金属污染的方法和系统 Download PDF

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Publication number
CN112638547A
CN112638547A CN201980056372.7A CN201980056372A CN112638547A CN 112638547 A CN112638547 A CN 112638547A CN 201980056372 A CN201980056372 A CN 201980056372A CN 112638547 A CN112638547 A CN 112638547A
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CN
China
Prior art keywords
substrate
edge
front side
assembled monolayer
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980056372.7A
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English (en)
Chinese (zh)
Inventor
姜浩英
安东·德维利耶
科里·莱姆利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN112638547A publication Critical patent/CN112638547A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/165—Monolayers, e.g. Langmuir-Blodgett
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B05D1/322—Removable films used as masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B17/00—Methods preventing fouling
    • B08B17/02—Preventing deposition of fouling or of dust
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Saccharide Compounds (AREA)
  • Laminated Bodies (AREA)
CN201980056372.7A 2018-09-04 2019-09-04 通过使用自组装单层涂层抵御金属污染的方法和系统 Pending CN112638547A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862726605P 2018-09-04 2018-09-04
US62/726,605 2018-09-04
PCT/US2019/049508 WO2020086164A2 (en) 2018-09-04 2019-09-04 Method and system for prevention of metal contamination by using a self-assembled monolayer coating

Publications (1)

Publication Number Publication Date
CN112638547A true CN112638547A (zh) 2021-04-09

Family

ID=69641094

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980056372.7A Pending CN112638547A (zh) 2018-09-04 2019-09-04 通过使用自组装单层涂层抵御金属污染的方法和系统

Country Status (6)

Country Link
US (1) US11460775B2 (cg-RX-API-DMAC7.html)
JP (1) JP7317320B2 (cg-RX-API-DMAC7.html)
KR (1) KR102798427B1 (cg-RX-API-DMAC7.html)
CN (1) CN112638547A (cg-RX-API-DMAC7.html)
TW (1) TWI810357B (cg-RX-API-DMAC7.html)
WO (1) WO2020086164A2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12087580B2 (en) * 2021-08-30 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor devices
US12094716B2 (en) 2021-09-13 2024-09-17 Applied Materials, Inc. Chambers and coatings for reducing backside damage
US12288698B2 (en) * 2023-02-21 2025-04-29 Tokyo Electron Limited Methods for retaining a processing liquid on a surface of a semiconductor substrate
US12506019B2 (en) 2024-03-11 2025-12-23 Tokyo Electron Limited Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070212522A1 (en) * 2005-06-10 2007-09-13 Babak Heidari Imprint stamp comprising Cyclic Olefin copolymer
US20180046086A1 (en) * 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US6461983B1 (en) 1999-08-11 2002-10-08 Micron Technology, Inc. Method for pretreating a substrate prior to application of a polymeric coat
US7601386B2 (en) * 2003-07-11 2009-10-13 Seiko Epson Corporation Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment
JP4179288B2 (ja) 2005-02-01 2008-11-12 セイコーエプソン株式会社 膜パターン形成方法
KR100994920B1 (ko) 2008-06-05 2010-11-17 주식회사 소로나 기상 자기조립 단분자막 코팅장치
US8691331B2 (en) 2009-02-09 2014-04-08 Prashant D. Santan Surface modification of hydrophobic and/or oleophobic coatings
US8293658B2 (en) 2010-02-17 2012-10-23 Asm America, Inc. Reactive site deactivation against vapor deposition
US9078956B2 (en) * 2010-06-10 2015-07-14 Econous Systems Inc. Modification of biomedical polymers for prevention of fouling and clotting
JP2014157941A (ja) 2013-02-15 2014-08-28 Fujikura Ltd 有機薄膜トランジスタ及びその製造方法
JP6552009B2 (ja) 2013-12-17 2019-07-31 東京エレクトロン株式会社 基板への周期的オルガノシリケートまたは自己組織化モノレイヤのスピンオンコーティングのためのシステムおよび方法
JP6439766B2 (ja) * 2016-09-23 2018-12-19 東京エレクトロン株式会社 塗布、現像方法及び塗布、現像装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070212522A1 (en) * 2005-06-10 2007-09-13 Babak Heidari Imprint stamp comprising Cyclic Olefin copolymer
US20180046086A1 (en) * 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
《建筑工人职业技能培训教材》编委会: "《复杂曲管机器人喷涂理论与技术》", vol. 1, 30 September 2016, 中国建材工业出版社, pages: 114 - 166 *

Also Published As

Publication number Publication date
KR20210041094A (ko) 2021-04-14
TW202025242A (zh) 2020-07-01
TWI810357B (zh) 2023-08-01
JP2021535616A (ja) 2021-12-16
US20200073244A1 (en) 2020-03-05
US11460775B2 (en) 2022-10-04
JP7317320B2 (ja) 2023-07-31
WO2020086164A3 (en) 2020-06-18
KR102798427B1 (ko) 2025-04-23
WO2020086164A2 (en) 2020-04-30

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